Polyurethane resin composition and adhesive composition, laminate, and printed wiring board using same

A technology of polyurethane resin and composition, applied in polyurea/polyurethane adhesive, printed circuit, printed circuit manufacturing, etc., can solve problems such as insufficient adhesion, poor solder resistance, adhesive strength or poor solder resistance, etc. Achieve the effect of good insulation reliability

Active Publication Date: 2016-04-13
TOYO TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the resin composition of Patent Document 1 is excellent in flame retardancy, it has problems of poor solder resistance and insufficient adhesiveness due to thermoplastic

Method used

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  • Polyurethane resin composition and adhesive composition, laminate, and printed wiring board using same
  • Polyurethane resin composition and adhesive composition, laminate, and printed wiring board using same
  • Polyurethane resin composition and adhesive composition, laminate, and printed wiring board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0179] Add 100 parts of polyurethane resin a as polyurethane resin (A) (only the mass of solid content, the same below), 3.8 parts of epoxy resin (B-1) as epoxy resin (B), epoxy resin (B-3 ) 0.4 parts, so that the solid content concentration was 37%, and methyl ethyl ketone / toluene was added and adjusted at a ratio of 1:1. Thoroughly stir to obtain the target polyurethane resin composition. The mixture amount of the epoxy resin was determined so that the calculated result contained epoxy groups 1.2 times the total amount of the acid value of the polyurethane resin a. Adhesion evaluation samples were prepared using the above method, and the evaluation results are shown in Table 3. Both the initial evaluation and the evaluation over time showed good results.

Embodiment 2、8、9、15、 comparative example 2、4、8

[0181] In the same manner as in Example 1, resin compositions were produced with the components and compounding quantities shown in Tables 3 and 4, and properties were evaluated. In addition, in all the examples and comparative examples, in order to adjust the resin composition to a viscosity suitable for coating, the solid content concentration was appropriately selected and prepared within the range of 20 to 50%.

Embodiment 3

[0183] Add 100 parts of polyurethane resin a as polyurethane resin (A), and 0.6 parts of ion scavenger (C-1) as ion scavenger (C) to make the solid content concentration 30%, and add methyl at a mass ratio of 1:1 Ethyl ketone / toluene, fully stir and disperse. Then, 3.8 parts of epoxy resin (B-1) and 0.4 parts of epoxy resin (B-3) were added as epoxy resin (B), so that the solid content concentration was 28%, and formazan was added at a mass ratio of 1:1. ethyl ethyl ketone / toluene for modulation. Thoroughly stir to obtain the target polyurethane resin composition. The mixture amount of the epoxy resin was determined so that the calculated result contained epoxy groups 1.2 times the total amount of the acid value of the polyurethane resin a. Adhesion evaluation samples were prepared using the above method, and the evaluation results are shown in Table 3. Both the initial evaluation and the evaluation over time showed good results.

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Abstract

The present invention provides a polyurethane resin composition having high adhesiveness to various plastic films and metals, high moist heat resistance that can even accommodate soldering after humidification, and excellent flame retardancy without using any halogen or antimony, and an adhesive composition, laminate, and printed wiring board that use the polyurethane composition. A polyurethane resin composition containing a polyurethane resin (A) that satisfies (1)-(3) and an epoxy resin (B). (1) Includes a polyester polyol containing a phosphorus compound residue represented by general formula (1) or general formula (2) as a structural component; (2) an acid value (unit: Eq/106 g) of from 50 to 1000; (3) a urethane group concentration (unit: Eq/106 g) of from 100 to 600 (R1 and R2 are each independently a hydrogen atom or hydrocarbon group, R3 and R4 are each independently a hydrogen atom, hydrocarbon group, or hydroxy group-substituted hydrocarbon group, and l and m are integers of 0 to 4.) (R5 is a hydrogen atom or hydrocarbon group, and R6 and R7 are each independently a hydrogen atom, hydrocarbon group, or hydroxy group-substituted hydrocarbon group.)

Description

technical field [0001] The present invention relates to a polyurethane resin composition excellent in adhesion to various plastic films or metals, heat resistance, heat and humidity resistance, and flame retardancy, and an adhesive composition using the same. In particular, the present invention relates to a polyurethane resin composition and an adhesive composition suitable for use as an adhesive for a flexible printed wiring board. Background technique [0002] Adhesives are used in various fields, and depending on the diversification of the purpose of use, adhesives are required to have higher adhesiveness, heat resistance, moisture resistance, flame retardancy, insulation reliability, sheet life, etc. performance. Adhesives for circuit boards represented by flexible printed circuit boards (hereinafter referred to as FPC) used in electronic equipment are also one of them. Among the adhesives, epoxy / nitrile rubber-based adhesives, rings, etc. Oxygen / acrylic butadiene-bas...

Claims

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Application Information

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IPC IPC(8): C08L75/06C08G18/46C08G59/14C08K3/00C08K5/00C08L63/00C09J11/04C09J11/06C09J163/00C09J175/06H05K1/02H05K1/03H05K3/28
CPCC08G18/348C08G18/7657C08L75/06C09J163/00C09J175/04H05K3/386C08K3/36C08K5/54C08L63/00C09J11/04C09J11/06C09J175/06
Inventor 南原慎太郎伊藤武
Owner TOYO TOYOBO CO LTD
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