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Curable resin composition, dry film, cured product and printed wiring board

A curable resin and composition technology, which is applied in the secondary treatment of printed circuits, instruments, and photosensitive materials used in optical mechanical equipment, etc., can solve the problems of easy cracks, interference concerns, and heightening, and achieve excellent crack resistance , Excellent effect of insulation reliability

Inactive Publication Date: 2018-11-23
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In printed circuit boards (also called package substrates) used in such IC packages, SROs (Solder Resist Openings) are formed adjacent to each other at a narrow pitch, and therefore short circuits and crossovers occur between SROs. talk noise) worries become higher
In addition, since the solder resist layer formed between SROs becomes thinner and thinner, cracks are likely to occur

Method used

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  • Curable resin composition, dry film, cured product and printed wiring board
  • Curable resin composition, dry film, cured product and printed wiring board
  • Curable resin composition, dry film, cured product and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～16、 comparative example 1～5

[0192] The above resin solution (varnish) was mixed with the various components shown in Table 1 at the ratio (parts by mass) shown in Table 1, pre-mixed with a mixer, and then kneaded with a three-roll mill to prepare a curable resin combination.

[0193]

Embodiment 1～15

[0194] (Examples 1-15, Comparative Examples 1-5)

[0195] The curable resin composition was coated on the entire surface of the copper foil substrate by screen printing so that the dry film thickness would be about 40 μm. This was dried at 80° C. and cooled naturally to room temperature to form a resin layer containing a curable resin composition, and to obtain an evaluation substrate having each uncured sample of each Example and Comparative Example. About this, it exposed through the stripe-shaped negative mask of 50 mm x 3 mm at optimum exposure amount: 800 mJ using ORC company HMW680GW (metal halide lamp, scattered light). Thereafter, development was carried out in a 1 wt.% sodium carbonate aqueous solution at 30° C. to obtain a cured film pattern. Furthermore, it heated at 160 degreeC for 1 hour after irradiating ultraviolet-ray so that the cumulative exposure amount might become 1000 mJ, and it hardened|cured.

[0196] The cured film of the evaluation board|substrate o...

Embodiment 16

[0198] The curable resin composition was coated on the entire surface of the copper foil substrate by screen printing so that the dry film thickness would be about 40 μm. This was dried at 80 degreeC, and it cooled naturally to room temperature, and the resin layer containing curable resin composition was formed. This was cured by heating at 160° C. for 1 hour to obtain an evaluation substrate having a cured film.

[0199] The cured film of the evaluation board|substrate obtained above was peeled from copper foil, it cut into the strip shape of 50 mm x 3 mm, and it evaluated. The measurement was performed using a TMA measuring device (manufactured by Shimadzu Corporation, model name: TMA6000), and Tg, CTEα1 (0°C-50°C) and CTEα2 (200°C-250°C) were evaluated. The evaluation criteria are as follows.

[0200] (Tg)

[0201] ◎…150℃above

[0202] ○…145°C or higher and lower than 150°C

[0203] △…Above 140°C and below 145°C

[0204] ×…Below 140℃

[0205] (CTEα1)

[0206] ◎…Les...

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PUM

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Abstract

Provided are: a curable resin composition which is capable of providing a cured product that has excellent crack resistance and insulation reliability; a dry film which has a resin layer obtained fromthe composition; a cured product of the composition or the resin layer of the dry film; and a printed wiring board which comprises the cured product. A curable resin composition which is characterized by containing (A) a carboxyl group-containing resin and (B) an epoxy resin having a silsesquioxane skeleton; and the like.

Description

technical field [0001] The present invention relates to curable resin composition, dry film, cured product and printed circuit board. Background technique [0002] Conventionally, as a material for forming a permanent coating such as a solder resist layer, an interlayer insulating layer, and a cover layer of a printed circuit board, for example, Patent Document 1 discloses a material containing an active energy ray-curable resin, a photopolymerization initiator, and a photopolymerizable monomer. A composition of a body and an epoxy resin obtained by reacting a reaction product of a novolac-type epoxy compound with an unsaturated monocarboxylic acid and a polybasic acid anhydride. [0003] In recent years, due to the rapid progress of semiconductor components, electronic equipment tends to become thinner, thinner, more functional, and more multifunctional. Following this trend, miniaturization and multi-pin semiconductor packages are being put into practical use. [0004] S...

Claims

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Application Information

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IPC IPC(8): G03F7/075C08F220/06H05K3/28C08G77/14C08F220/28C08F299/02C08G8/30C08G59/20G03F7/004G03F7/027
CPCC08F220/06C08F299/02C08G8/30C08G59/20C08G77/14G03F7/004G03F7/027G03F7/075H05K3/28C08G59/306C08G59/3281C08K9/06C08L25/14C08L63/00G03F7/0757
Inventor 冈田和也植田千穗依田健志伊藤信人
Owner TAIYO INK MFG
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