Special hole-plugging ink composition for hole filling and printed circuit board

An ink composition, a technology for special plugging, which is applied in the directions of printed circuits, printed circuit manufacturing, inks, etc., can solve the problems of insufficient heat resistance, crack resistance, cavitation resistance, etc., and low degree of double bond cross-linking reaction. , to achieve the effect of excellent cavitation resistance, excellent heat resistance, and excellent crack resistance

Active Publication Date: 2019-04-26
深圳市容大感光科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] During the photocuring process, due to the blocking effect of pigments and fillers in the ink system on light, as the thickness of the ink increases, the energy of light passing through the ink will decrease, and the degree of double bond crosslinking of deep inks is quite different from that of surface inks. , especially for plugging ink, the thickness of the ink can reach more than 200um (the surface ink is generally only 25um), so the double bond crosslinking reaction degree of the ink in the hole is very low when the plugging ink is cured by light, and the performance problem shown is heat resistance Insufficient performance, crack resistance, cavitation resistance, etc.

Method used

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  • Special hole-plugging ink composition for hole filling and printed circuit board
  • Special hole-plugging ink composition for hole filling and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Example 1: Preparation of Photocurable Dilute Alkaline Water Developable Resin

[0039] Add o-cresol novolac epoxy resin (Shandong Shengquan 704M), 203 grams, 0.5 grams of hydroquinone, and 250 grams of diethylene glycol ethyl ether acetate (water-soluble solvent) into a three-necked flask, stir, and heat to 100 ° C to Heat and dissolve at 110°C for 1 hour to ensure complete dissolution, then cool down to 90°C, add a solution of 72 grams of acrylic acid and 3 grams of N,N dimethylbenzylamine dropwise, and finish the dripping within three hours. During the process, control the temperature at 90-100°C After the dropwise addition, raise the temperature to 105°C to 110°C and react for 12 hours. The measured acid value is less than 10mgKOH / g, and the temperature of the material is lowered to 90°C. Add 100 grams of tetrahydrophthalic anhydride and keep it at 90-95°C for 4 hours. Spectrometer detection, 1780cm-1 peak disappears, stop the reaction, lower the temperature to room...

Embodiment 2

[0040] Embodiment 2: the preparation of plug hole ink composition

[0041] According to the material ratio listed in Table 1 and Table 2 below (the value of each component is the weight value, and the unit is gram), the plugging ink composition was prepared respectively. Accurately weigh various materials into the container, use a high-speed disperser at a speed of 500 rpm, stir and disperse for 15 minutes, and then grind the composition three times with a three-roll mill to make the fineness of the composition less than 15 microns.

[0042] The formula table of table 1 plug hole ink composition embodiment 1-5

[0043] Element

Example 1

Example 2

Example 3

Example 4

Example 5

Resin A

450

401

446

441

431

Menthane

1

5

1

3

5

tert-butyl peroxyisobutyrate

4

7

1

dipentaerythritol hexaacrylate

45

45

45

45

45

907

50

50

50

50

50

isopropylthi...

Embodiment 3

[0054] Embodiment 3 plug hole ink composition property measurement

[0055] According to the plugging ink prepared in Table 1 and Table 2, the plugging experiment was carried out. The specific experimental process is as follows:

[0056] For double-sided substrates with a thickness of 2.0mm, plated through-hole diameters of 0.2mm, 0.3mm, 0.4mm, 0.5mm, and 0.6mm, and a through-hole pitch of 1mm (no pattern is formed, and the number of each through-hole is 50), as the previous Treated pickling + brushing, and then use the semi-automatic printing machine to carry out aluminum sheet hole filling printing with the plugging ink composition of the foregoing examples and comparative examples, dry it in a constant temperature oven at 75 ° C for 50 minutes, cool to room temperature, and use 21 The step exposure scale is 10 grids of energy, and the substrate is exposed, and developed by the conventional development process of the circuit board factory, and then the substrate is post-cure...

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PUM

PropertyMeasurementUnit
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Abstract

The invention relates to a special hole-plugging ink composition for hole filling and a printed circuit board. The ink composition comprises photocurable dilute alkaline water developable resin and peroxide, wherein the photocurable dilute alkaline water developable resin contains carboxyl groups and unsaturated double bonds in molecules; the weight of the peroxide is 0.1-5.0% of the weight of theink composition. Through addition of the peroxide, the problems of performance defects caused by low double bond reaction rate and insufficient molecular crosslinking degree in the hole-plugging inkare solved, and excellent heat resistance, excellent crack resistance and excellent cavitation resistance of the hole-plugging ink are achieved.

Description

technical field [0001] The invention belongs to the field of photosensitive electronic materials, and relates to a special plugging ink composition for hole filling and a printed circuit board, in particular, relates to a hole filling with excellent heat resistance, crack resistance and cavitation resistance Special plugging ink composition and printed circuit board. Background technique [0002] With the continuous improvement of the requirements of high precision, high density, durability and reliability of electronic products, the requirements for permanent hole filling compositions filled in through holes, via holes, etc. are also getting higher and higher. The tape printing process (printed circuit boards are screen-printed with solder resist ink on both sides while performing through-hole ink plugging operations) can no longer meet the current PCB production requirements, and it is replaced by the aluminum plate printing process. [0003] The aluminum plate printing p...

Claims

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Application Information

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IPC IPC(8): C09D11/101H05K3/00
CPCH05K3/0094C09D11/101
Inventor 李泽波杨遇春
Owner 深圳市容大感光科技股份有限公司
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