The invention discloses isotropic high-performance thermal conductive adhesive for filling a carbon nano tube, which belongs to the technical field of thermal conductive adhesive preparation. The thermal conductive adhesive comprises the following components in percentage by weight: 10 to 20 percent of at least one epoxy resin, 15 to 25 percent of epoxy resin toughness modifier, 6 to 11 percent of dicyandiamide, 0.1 to 1 percent of curing accelerator, 5 to 15 percent of thermal conductive filler, 30 to 40 percent of thinner, 0.5 to 0.8 percent of rheology controller, 0.5 to 0.8 percent of filler surface modifier, and 0 to 1 percent of flow additive and adhesive promoter. The thermal conductive adhesive has the advantages of high thermal conductivity, high adhesive strength, thermal resistance and the like, and has good adhesion to high-energy surfaces of metal, ceramic, glass and polymer.