Isotropic high-performance thermal conductive adhesive for filling carbon nano tube

An isotropic, carbon nanotube technology, applied in the direction of adhesives, other rubber adhesives, non-polymer adhesive additives, etc., can solve the problems of low bonding strength and low thermal conductivity of thermally conductive adhesives, and achieve bonding High strength, high thermal conductivity, easy to obtain raw materials

Inactive Publication Date: 2010-09-15
CHANGZHOU HE RUN NEW MATERIAL TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the disadvantages of low thermal conductivity and low bonding strength of existing thermally conductive adhesives, and provide a high-performance thermally co

Method used

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  • Isotropic high-performance thermal conductive adhesive for filling carbon nano tube
  • Isotropic high-performance thermal conductive adhesive for filling carbon nano tube

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1: Weigh epoxy resin, epoxy toughness modifier, adhesion promoter, rheology control agent according to the mass given in Table 2 and mix them. The way of mixing is mechanical stirring, the stirring rate is 1000 rpm, and the time is 10 minutes. Then add the weighed heat-conducting filler, filler surface modifier, and diluent to the mixture in a stirring state. Stirring was continued for 10 minutes after the addition was complete. After mixing evenly, add curing agent and curing accelerator to the mixture, mechanically stir for 5 minutes, transfer the mixture to a high-speed shear mixer for mixing, the mixing speed is 2000 rpm, and the time is 30s. Repeat the mixing process in the high-speed shear mixer three times to obtain a uniformly mixed jelly, which is the thermally conductive adhesive.

[0033] The preparation of the test sample for the bonding strength of the thermal conductive adhesive is carried out in accordance with the standard ASTM1002-01. First...

Embodiment 2～11

[0038]According to the composition and dosage listed in Table 2, weigh epoxy resin, epoxy toughness modifier, adhesion promoter, rheology control agent and mix them. The way of mixing is mechanical stirring, the stirring rate is 1000 rpm, and the time is 10 minutes. Then add the weighed heat-conducting filler, filler surface modifier, and diluent to the mixture in a stirring state. Stirring was continued for 10 minutes after the addition was complete. After mixing evenly, add curing agent and curing accelerator to the mixture, mechanically stir for 5 minutes, transfer the mixture to a high-speed shear mixer for mixing, the mixing speed is 2000 rpm, and the time is 30s. Repeat the mixing process in the high-speed shear mixer three times to obtain a uniformly mixed jelly, which is the thermally conductive adhesive.

[0039] Table 2

[0040]

[0041]

[0042]

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Abstract

The invention discloses isotropic high-performance thermal conductive adhesive for filling a carbon nano tube, which belongs to the technical field of thermal conductive adhesive preparation. The thermal conductive adhesive comprises the following components in percentage by weight: 10 to 20 percent of at least one epoxy resin, 15 to 25 percent of epoxy resin toughness modifier, 6 to 11 percent of dicyandiamide, 0.1 to 1 percent of curing accelerator, 5 to 15 percent of thermal conductive filler, 30 to 40 percent of thinner, 0.5 to 0.8 percent of rheology controller, 0.5 to 0.8 percent of filler surface modifier, and 0 to 1 percent of flow additive and adhesive promoter. The thermal conductive adhesive has the advantages of high thermal conductivity, high adhesive strength, thermal resistance and the like, and has good adhesion to high-energy surfaces of metal, ceramic, glass and polymer.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting adhesive preparation, in particular to an isotropic high-performance heat-conducting adhesive filled with carbon nanotubes. Background technique [0002] With the development of large-scale integrated circuits and packaging technology, electronic components and electronic equipment are becoming thinner, lighter, and smaller. The assembly density of components in circuits is getting higher and higher, and heat dissipation has become a very prominent problem. Heat dissipation is a critical issue in the electronics industry. If the heat is not dissipated in time, the operating temperature of the components will rise, and in severe cases, the electronic components will fail, which will directly affect the life and reliability of various high-precision equipment using them. Traditional heat dissipation materials, such as metals and ceramics, have the disadvantages of large specific gravity, di...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/04C09J109/02C09J181/04C09J175/04C09J179/08C09J121/00
Inventor 吴海平陶新永陶宇蔡金锅杨勇
Owner CHANGZHOU HE RUN NEW MATERIAL TECH
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