Epoxy resin composition suitable for low-pressure packaging and preparation method thereof

A technology of epoxy resin and composition, which is applied in the field of the preparation of the aforementioned epoxy resin composition, epoxy resin composition, and epoxy resin composition for low-voltage packaging, can solve the problems of leakage, cracking, air holes, etc., and achieve Excellent moisture resistance, high reliability, and low stress effects

Active Publication Date: 2022-04-05
JIANGSU HHCK NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using traditional epoxy molding compound for capacitor packaging, especially for solid-state laminated aluminum capacitors and chip tantalum capacitors, because capacitor manufacturers generally use lower injection pressure in the packaging process to minimize the impact on the internal Influenced by the electrical properties of the device, ordinary epoxy molding compounds have many shortcomings, such as leakage, pores, etc., and are prone to cracking after moisture absorption and reflow

Method used

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  • Epoxy resin composition suitable for low-pressure packaging and preparation method thereof
  • Epoxy resin composition suitable for low-pressure packaging and preparation method thereof
  • Epoxy resin composition suitable for low-pressure packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Embodiment 1, a kind of epoxy resin composition of low pressure encapsulation:

[0033] Each component is weighed according to the ratio recorded in Table 1, Example 1, wherein the formula [1] epoxy resin and the release agent are made into an intermediate in advance, and the formula [1] epoxy resin, formula [3] are added according to the formula ratio. 】Phenolic resin, fused spherical silica powder filler (60% of the total content in the formula), fiber filler (glass fiber filament, diameter 5um, length 3mm), epoxy silane coupling agent, release agent, coloring agent, according to certain The ratio is weighed, mixed evenly, and the mixed material is melted and kneaded in a twin-screw extruder at 80°C, and crushed after being pressed into tablets and cooled. Weigh a certain amount of the above primary extruded material, add the remaining molten spherical silicon micropowder and solidification accelerator according to the ratio of Example 1 in Table 1, melt and knead the...

Embodiment 2

[0034] Embodiment 2, a kind of epoxy resin composition of low pressure encapsulation,

[0035] Each component is weighed according to the proportion of Example 2 in Table 1, wherein the epoxy resin of formula [2] and the release agent are made into intermediates in advance, and the epoxy resin of formula [2] and phenolic resin of formula [3] are added according to the formula ratio , Inorganic filler (the ratio of molten spherical silica powder to molten angular silica powder is 8:1, and the amount of inorganic filler added in the first mixing extrusion is 80%), fiber filler (glass fiber filament, diameter 10um, length 3mm), ring Oxysilane coupling agent, mold release agent and coloring agent are weighed according to a certain ratio and mixed evenly. The mixed materials are melted and mixed in a twin-screw extruder at 80°C, pressed into tablets and then pulverized after cooling. Weigh a certain amount of the above-mentioned primary extruded material, add the remaining inorgani...

Embodiment 3

[0036] Embodiment 3, a kind of epoxy resin composition of low pressure encapsulation,

[0037]Weigh each component according to the ratio of Example 3 in Table 1, wherein formula [1] \ formula [2] epoxy resin and release agent are made into intermediates in advance, and formula [1] \ [2] ring is added according to the formula ratio Oxygen resin, formula [3] phenolic resin, molten spherical silica powder (80% of total content in the formula), fiber filler (glass fiber filament, diameter 10um, length 3mm), epoxy silane coupling agent, release agent, The coloring agent is weighed according to a certain proportion and mixed evenly. The mixed material is melted and kneaded in a twin-screw extruder at 80°C, and crushed after being pressed into tablets and cooled. Weigh a certain amount of the above primary extruded material, add the remaining molten spherical silicon micropowder and solidification accelerator according to the ratio of Example 3 in Table 1, melt and knead the mixed m...

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Abstract

The invention relates to an epoxy resin composition suitable for low-pressure packaging. The epoxy resin composition comprises the following main components: epoxy resin, phenolic resin, an inorganic filler, a reinforcing material and a curing accelerator. The epoxy resin includes an epoxy resin represented by Formula 1 and/or Formula 2. The reinforcing material can be a fiber material or nano-scale and submicron-scale micro powder with high specific surface area. The invention also discloses a preparation method of the epoxy resin composition suitable for low-pressure packaging. The epoxy resin composition disclosed by the invention can meet the requirements of low-pressure packaging and rapid curing, and has the advantages of high high-temperature bending strength, low stress, good moisture resistance, high cracking resistance, high reliability and the like. The method is especially suitable for products with low-voltage packaging and curing requirements, such as packaging of various capacitors.

Description

technical field [0001] The invention relates to an epoxy resin composition, especially an epoxy resin composition suitable for low-voltage packaging, and the invention also discloses a preparation method of the aforementioned epoxy resin composition. The invention belongs to the technical field of electronic packaging materials and can be used as electronic packaging materials specially used for low-voltage packaging. Background technique [0002] Epoxy molding compound is mainly composed of epoxy resin, curing agent, curing accelerator and various additives. Epoxy molding compounds have many excellent properties, such as good thermal stability, insulation, good thermodynamic properties and low cost, and are widely used in the packaging of electronic components. When using traditional epoxy molding compound for capacitor packaging, especially for solid-state laminated aluminum capacitors and chip tantalum capacitors, because capacitor manufacturers generally use lower injec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08K7/14C08K5/5435C08K7/18C08K7/00C08K3/36H01G9/08
Inventor 段杨杨谭伟刘红杰李兰侠范丹丹成兴明崔亮蒋小娟
Owner JIANGSU HHCK NEW MATERIAL CO LTD
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