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Epoxy resin composition for casting molding, and electronic part and manufacturing method thereof

An epoxy resin and casting molding technology, which is applied in the field of epoxy resin compositions for casting molding, can solve problems such as capacitor capacity changes, failure to work normally, and cracks in the cured sealing resin to achieve reduced settlement and high insulation breakdown voltage , excellent effect of crack resistance

Active Publication Date: 2019-12-27
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For electronic components using conventional epoxy resin compositions, cracks may occur in the cured sealing resin due to thermal or mechanical stress caused by thermal cycles
When the sealing resin cured product cracks, the capacitance of the capacitor changes and it cannot work normally

Method used

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  • Epoxy resin composition for casting molding, and electronic part and manufacturing method thereof
  • Epoxy resin composition for casting molding, and electronic part and manufacturing method thereof
  • Epoxy resin composition for casting molding, and electronic part and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8 and comparative example 1～7

[0079] The types and compounding amounts of the components described in the first component column of Table 2 were put into a universal mixer heated to 100° C., and mixed under vacuum conditions for 1 hour to prepare the first component. Then, each component of the type and compounding amount described in the second component column of Table 2 was put into a universal mixer heated to 60° C., and mixed under vacuum conditions for 1 hour to prepare a second component. 100 parts by mass of the first component and 100 parts by mass of the second component were mixed using a universal mixer to prepare an epoxy resin composition for casting molding.

[0080] It should be noted that in Table 2, blank columns represent non-combination.

[0081] The characteristics of the epoxy resin compositions for casting molding and the characteristics of cured products produced in Examples 1 to 8 and Comparative Examples 1 to 7 were measured and evaluated under the measurement conditions shown bel...

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Abstract

The epoxy resin composition for casting molding comprises (A) an epoxy resin, (B) an acid anhydride, (C) an inorganic filler, (D) an organic affinity phyllosilicate, and (E) a curing accelerator.

Description

technical field [0001] The present invention relates to an epoxy resin composition for casting molding, an electronic component cast and molded using the epoxy resin composition for casting molding, and a method for manufacturing the electronic component. Background technique [0002] Conventionally, impregnation properties, electrical insulation properties, and operability have been required in motors for railway vehicles, rotating machines for generators, coil products for various electronic equipment products, and capacitors / electronic components. From such a viewpoint, the insulating treatment of the above-mentioned member is often performed using a thermosetting resin composition, especially an epoxy resin composition. For example, cured products of acid anhydride curing agents and epoxy resins are excellent in thermomechanical properties, electrical insulation, and high voltage properties. Therefore, the performance and reliability of the coil can be improved by using...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K7/18C08K7/26C08K3/22C08K3/34B29C39/00
CPCC08L63/00C08K7/18C08K3/22C08K3/34B29C39/006C08K7/26
Inventor 渡边好造
Owner KYOCERA CORP
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