Intelligent power module, preparation method thereof and electric appliance comprising intelligent power module

Abstract

The invention relates to an intelligent power module and a preparation method thereof, and an electric appliance comprising the intelligent power module. The intelligent power module comprises a heat-conducting insulating metal substrate, a lead frame and a component fixed on the heat-conducting insulating metal substrate, wherein the heat-conducting insulating metal substrate and the lead frame are connected through a metal bonding wire, and a sealant is fixed in a bonding wire area between the heat-conducting insulating metal substrate and the lead frame; and the heat-conducting insulating metal substrate, the lead frame and the components are plastically packaged into a whole by a molding compound. The IPM provided by the invention avoids the problem that the insulating layer is easy to layer from the substrate, and has good insulating reliability metal.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an intelligent power module, a preparation method thereof, and an electric appliance including the intelligent power module. Background technique [0002] The intelligent power module (IPM) generates a lot of heat, so a good heat dissipation design is required to solve the reliability problem. A common practice in the industry is to set a metal-based heat dissipation plate on the package body, and the chip is cooled by heat transfer to the heat dissipation plate to prevent Instantaneous overheating causes the chip to burn out. With heat dissipation metal substrates as substrates, it can be designed more flexibly and realize heat dissipation design with higher efficiency. At present, metal-based circuit boards are widely used as insulation and heat dissipation components of power devices. These circuit boards need to have the function of insulation, so the circuit The boar...

AI Technical Summary

Problems solved by technology

However, in the actual packaging process, since the metal lead frame and the metal substrate of the IPM are welded together by solder paste reflow to realize electrical connection, in order to prevent EMC from overflowing from the substrate surface, the lead frame and the metal substrate are placed in the package mold A certain amount of pressure is generated during the mold clamping process, but this pressure will cause delamination between the insulating layer inside the metal substrate and the metal plate, which will pose a safety hazard to the IPM and make mass production impossible

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