Halogen-free resin composition, RCC, adhesive film and metal foil-clad laminated board

Abstract

The invention provides a halogen-free resin composition, which comprises large-equivalent isocyanate modified epoxy resin, large-molecular-weight dicyclopentadiene phenol epoxy resin, a curing agent,plastified epoxy-terminated acrylate rubber, a curing accelerator and heat-conducting filler. The invention also provides RCC, a laminated board, an adhesive film and a metal foil-clad laminated boardprepared from the resin composition. The halogen-free resin composition has excellent toughness, the heat conductivity of an aluminum-based copper-clad plate manufactured from the halogen-free resincomposition reaches 2.2W/m.k or above, after the aluminum-based copper-clad plate is bent by 360-degree into a spiral shape, the insulation layer does not delaminate or shed, no fissure is generated,the peel strength of a bending surface is larger than or equal to 1.8N/mm (T288DEG C, 10s), the bending surface can be subjected to thermal stress 288DEG C dip soldering for 60min or more, after the 360-degree bending into a spiral shape, the breakdown voltage is larger than or equal to 7kV after heat-moisture treatment on the bending surface, and after 1000 times of circulation treatment under the conditions of -40DEG C/30min-125DEG C/30min, the breakdown voltage is larger than or equal to 6 kV.

Description

technical field [0001] The invention belongs to the technical field of metal foil-clad laminates, and in particular relates to a halogen-free resin composition, RCC, adhesive film and metal foil-clad laminates. Background technique [0002] LED is more and more applied to landscape lighting, architectural lighting, indoor lighting, and stage lighting due to its advantages of environmental protection, low energy consumption, and long life. Conventional LED substrates are planar. With the development of the lighting industry, LED lighting tends to develop in a 3D direction. [0003] Compared with conventional LED lighting, 3D-LED lighting requires the base aluminum substrate to have excellent toughness and flexibility under the conditions of ensuring excellent heat dissipation, heat resistance, insulation, and peel strength, so as to meet the needs of the board during PCB processing and bending. There is no breakage or delamination of the insulation layer. [0004] In order ...

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Problems solved by technology

[0006] The purpose of the present invention is to overcome the deficiencies in the prior art, provide a halogen-free resin composition, solve the problem of insufficient flexibility or flexibility of the resin formulation under the condition of high filler thermal conductivity system, and at the same time satisfy excellent heat dissipation and insulation reliability , heat resistance, peel strength, long-term reliability

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