Insulating ink for packaging of semiconductor passive elements

A passive component and insulating ink technology, applied in the field of ink, can solve the problems of poor thermal stability, high cost, and easy ion migration, etc., and achieve good weather resistance and meet the requirements

Inactive Publication Date: 2019-06-21
JIANGSU AISEN SEMICON MATERIAL CO LTD
View PDF2 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because poor weather resistance usually leads to poor hygroscopicity and ion migration of insulating inks under long-term working conditions, resulting in poor insulation reliability of passive components; Components will fail and other faults; α radiation will cause electromagnetic signal interference to integrated circuits, affecting its long-term performance, so materials with low α radiation are preferred
[0004] At present, insulating inks for chip resistor packaging mainly rely on foreign imports, and the cost is high. There are still many areas to be improved in terms of weather resistance, thermal stability and insulation reliability.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Insulating ink for packaging of semiconductor passive elements
  • Insulating ink for packaging of semiconductor passive elements
  • Insulating ink for packaging of semiconductor passive elements

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The present invention will be described in further detail below in conjunction with specific embodiments.

[0018] Stir and mix the raw materials according to the ratio in Table 1. After fully stirring and mixing, through ball milling, sand milling or three-roll grinding, or ultrasonic dispersion, or high-speed rotation, a uniformly dispersed liquid mixture is obtained, and then filtered and quality inspected. and subpackaging to obtain insulating ink for passive component packaging with a fineness of 10 μm or less, and a viscosity of 1-120,000 mPa.s, preferably 3-90,000 mPa.s. The insulating inks of Examples 1-3 and Comparative Examples 1-6 were prepared.

[0019] Table 1:

[0020]

[0021]

[0022] Among them, the novolac resin used in the examples is PF-8210 from Shandong Moore Chemical Co., Ltd., the silicone rubber is RC-704 from Liyang Ruicheng New Material Co., Ltd., and the impact-resistant polystyrene is Trinseo polymer. STYRON A-TECH HIPS of (Zhangjiag...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
thicknessaaaaaaaaaa
softening pointaaaaaaaaaa
Login to view more

Abstract

The invention belongs to the technical field of ink and relates to insulating ink for packaging of semiconductor passive elements. A formula of the insulating ink comprises 10wt%-50wt% of linear phenolic resin, 1wt%-30wt% of organic silicon rubber, 1wt%-10wt% of impact-resistant polystyrene, 5wt%-35wt% of low alpha radiation inorganic filler, 0.1wt%-20wt% of a curing accelerator, 1wt%-10wt% of pigment, 0.1wt%-8wt% of an additive and the balance of an organic solvent. The insulating ink has good weather resistance, thermal stability and insulation reliability and meets the requirement of advanced packaging for low alpha radiation classes.

Description

technical field [0001] The invention relates to the technical field of inks, in particular to an insulating ink for packaging semiconductor passive components. Background technique [0002] In order to improve the electrical characteristics of the semiconductor package structure, passive components such as capacitors, resistors or inductors are arranged in the semiconductor package structure. Among them, resistors are generally used for voltage division, shunting, filtering and impedance matching. The main type of resistor used is chip resistor (Chip Resistor), also known as chip resistor (SMD Resistor). Chip resistor is a kind of metal glass glaze resistor. The resistor is made by printing metal silver paste and glass glaze powder on the substrate by screen printing, and a protective coating of insulating ink is printed on the outermost layer. layer. Chip resistors can generally be divided into conventional series thick film chip resistors and high precision and high stab...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/103C09D11/102C09D11/108C09D11/03
CPCC09D11/03C09D11/102C09D11/103C09D11/108
Inventor 张燕红朱坤陆兰杨一伍赵建龙陈小华向文胜张兵
Owner JIANGSU AISEN SEMICON MATERIAL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap