Semiconductor device and manufacturing method thereof

A manufacturing method and semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as difficult to form thick films, filling metals, and reduced mechanical strength of semiconductor chips
CN1758430AInactive Publication Date: 2006-04-12KK TOSHIBA
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
KK TOSHIBA
Publication Date
2006-04-12
Estimated Expiration
Not applicable · inactive patent

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Abstract

A semiconductor device comprises a semiconductor substrate having an through hole, a first insulation resin layer formed on an inner surface of the through hole, a second insulation resin layer formed on at least one of front and rear surfaces of the semiconductor substrate, and a first conductor layer formed in the through hole to connect at least both front and rear surfaces of the semiconductor substrate and insulated from the inner surface of the through hole with the first insulation resin layer. A second conductor layer (wiring pattern) which is electrically connected to the first conductor layer in the through hole is further provided on the second insulation resin layer. The conductor layer formed in the through hole and constituting a connecting plug has a high insulation reliability. Therefore, a semiconductor device suitable for a multi-chip package and the like can be obtained. Further, since the forming ability of the conductor layer connecting the front and rear surfaces and the insulation layer is high, the manufacturing cost can be reduced.
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Description

technical field

[0001] The present invention relates to a semiconductor device suitable for a multi-chip package on which a plurality of semiconductor elements (semiconductor chips) are mounted, and a method for manufacturing the same. Background technique

[0002] In recent years, in order to achieve miniaturization and high-density mounting of semiconductor devices, a stacked multi-chip package in which a plurality of semiconductor elements (chips) are stacked and sealed in one package has been realized. In general, in a stacked multi-chip package, electrical connection between each electrode pad of a plurality of semiconductor chips and an electrode portion of a substrate has been performed by means of wire bonding. In addition, when connecting a plurality of semiconductor chips to each other, electrode pads of the respective semiconductor chips are electrically connected by wire bonding.

[0003] Like such a stacked multi-chip package, a package structure in which wire ...

Claims

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