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Positve photosensitive painting composition, method for producing positive photosensitive resin and forming method of pattern

A technology of photosensitive resin and photosensitivity, which is applied in the field of positive photosensitive coating composition and protective layer, and can solve the problems of insufficient solubility difference of alkaline developer, reduced sensitivity, and reduced graphic formability, etc.

Inactive Publication Date: 2004-01-21
KANSAI PAINT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that if the added amount of the photosensitive material increases, the sensitivity will decrease. Conversely, if the added amount decreases, the sensitivity will increase, but the difference in solubility to the alkaline developer will not be sufficiently expressed, and the formability of the pattern will decrease.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0101] The present invention will be described in more detail by enumerating examples below.

[0102] "Parts" and "%" are based on weight. The present invention is not limited by the following examples.

[0103] The following abbreviations are used for the following chemical substances. Its content is expressed as follows.

[0104] IEM: Isocyanoethyl methacrylate

[0105] DMFDG: Dipropylene glycol dimethyl ether

[0106] ADVN: 2,2-Azobis(2,4-Dimethylvaleronitrile)

[0107] NAU-8: 1,2-Naphthoquinone-2-diazido-5-sulfonic acid-N-methyl-N-(2-hydroxyethyl)amide (manufactured by Toyosei Co., Ltd.)

[0108] NMP: N-methyl-2-pyrrolidinone (pirolidinone)

[0109] DBTDL: dibutyltin dilaurate

[0110] PABA: para-aminobenzoic acid

[0111] Manufacture of positive photosensitive resin

manufacture example 1

[0113] Under nitrogen flow, add DMFDG335 parts into a 4-necked flask, and after stirring while raising the temperature to 117°C, add the following mixture dropwise within 3 hours:

[0114] Styrene 60 parts

[0115] 150 parts of methyl methacrylate

[0116] 115 parts of n-butyl acrylate

[0117] 33 parts of n-butyl methacrylate

[0118] 142 parts of isocyanoethyl methacrylate

[0119] ADVN 17 parts

[0120] Thereafter, a mixture of 45 parts of ADVN and 180 parts of DMFDG was added dropwise over 3 hours and kept for 1 hour. After the temperature dropped to 60°C, 85 parts of NAU-8, 125 parts of DMFDG, and 130 parts of NMP were added, stirred for 1 hour, and DBTDL500PPM was added to continue stirring for 1 hour. Thereafter, 85 parts of PABA, 70 parts of DMFDG, and 15 parts of NMP were added and stirred for 4 hours to obtain a positive photosensitive resin solution having a resin solid content of 52% and a Gardner viscosity of Z3Z4. The solid content of the obtained resin had...

manufacture example 2

[0122] Under nitrogen flow, 335 parts of DMFDG were added into a 4-necked flask, and after the temperature was raised to 117°C while stirring, the following mixture was added dropwise within 3 hours:

[0123] Styrene 60 parts

[0124] 150 parts of methyl methacrylate

[0125] 115 parts of n-butyl acrylate

[0126] 40 parts of n-butyl methacrylate

[0127] 135 parts of isocyanoethyl methacrylate

[0128] ADVN 17 parts

[0129] Thereafter, a mixture of 45 parts of ADVN and 180 parts of DMFDG was added dropwise over 3 hours and kept for 1 hour. After the temperature dropped to 60°C, 74 parts of NAU-8, 116 parts of DMFDG, and 128 parts of NMP were added, stirred for 1 hour, and DBTDL500PPM was added to continue stirring for 1 hour. Thereafter, 85 parts of PABA, 70 parts of DMFDG, and 15 parts of NMP were added and stirred for 4 hours to obtain a positive photosensitive resin solution having a resin solid content of 51% and a Gardner viscosity of Z4. The obtained resin had an...

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PUM

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Abstract

The present application provides a positive type coating composition and forming method of pattern by using the said coating composition. The positive type sensitivity coating according to the present invention is characterized in that contains specific modified quinonediazido-sulfonamide as union based on the 100 parts by weight in one molecular, making the structure unit containing 0.1 to 0.9 mole concentration in 1 kg resin, and using the specific carboxylic sulfonamide derivative as the structure unit, which in 1 kg resin the structure unit containing 0.2 to 0.4 mole concentration positive type sensitivity resin with 1 to 50 parts by weight at least one component selected from the group of phenol resin phenol derivative and catechol.

Description

technical field [0001] The present invention relates to a protective layer with excellent operational stability and high reliability of conductive image formation, in particular a positive-type photosensitive coating composition suitable for etching protective layers for the manufacture of printed circuit wiring boards, and also relates to a positive-type photosensitive coating composition using the positive-type photosensitive coating composition. A pattern forming method for forming a printed circuit wiring board and the like from a permanent coating composition. Background technique [0002] Printed circuit wiring boards used in electronic equipment, etc., are mainly the pattern printing method of screen printing on an insulating substrate with a conductive layer on the surface, or the subtraction method of forming a circuit pattern by photolithography using a photosensitive dry film ( subtract) manufacturing method. [0003] Recently, miniaturization of circuit patterns...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/022G03F7/039G03F7/16G03F7/32H01L21/027
CPCB43K29/10
Inventor 山中一男大西晋辅宫川坚次濑古健治
Owner KANSAI PAINT CO LTD
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