A method for manufacturing a base material having gold-coated metallic fine pattern, a base material having gold-coated metallic fine pattern, a printed wiring board, an interposer and a semiconductor device

A printed wiring board and micro-pattern technology, applied in semiconductor devices, metal material coating processes, semiconductor/solid-state device components, etc., can solve problems such as the inability to fully prevent abnormal metal precipitation, and achieve excellent peel strength and prevent abnormality. Excellent effect of precipitation and adhesion
CN102893709AInactive Publication Date: 2013-01-23SUMITOMO BAKELITE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SUMITOMO BAKELITE CO LTD
Publication Date
2013-01-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method for manufacturing a base material having gold-coated metallic fine pattern, comprising the steps of: preparing a base material having a supporting surface composed of resin; forming a primer resin layer with surface roughness of 0.5 [mu] m or less on the supporting surface, and forming metallic fine pattern on the primer resin layer by SAP method to obtain a base material having a metallic fine pattern; gold-coating at least part of the surface of the metallic fine pattern; wherein palladium is removed from the base material having the metallic fine pattern at any time before the gold-coating step.
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Description

technical field

[0001] The present invention relates to a method of manufacturing a base material with a fine pattern of gold-plated metal, a base material with a fine pattern of gold-plated metal manufactured by the method, and particularly relates to printed wiring boards such as motherboards and interposers And a semiconductor device using the above-mentioned printed wiring board. Background technique

[0002] In recent years, high-density integration and high-density mounting of electronic components have been progressing along with demands for higher functionality, weight reduction, miniaturization, and thinning of electronic equipment. The circuit wiring of these printed wiring boards used in electronic equipment tends to be denser and more complicated, and the miniaturization of circuit patterns has been progressing.

[0003] In particular, miniaturization of circuit patterns is required on the semiconductor element mounting surface of a printed wiring board called a...

Claims

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