420 results about "Plasma chamber" patented technology

A system having the low frequency RF generator is described. The low frequency RF has an operating frequency range between 10 kilohertz (kHz) and 330 kHz. The low frequency RF generator generates an RF signal. The system further includes an impedance matching circuit coupled to the low frequency RF generator for receiving the RF signal. The impedance matching circuit modifies an impedance of the RF signal to output a modified RF signal. The system includes a plasma chamber coupled to the RF generator for receiving the modified RF signal. The plasma chamber includes a chuck having a dielectric layer and a base metal layer. The dielectric layer is located on top of the base metal layer. The dielectric layer has a bottom surface, and the base metal layer has a top surface. The base metal layer has a porous plug and the bottom surface of the dielectric layer has a portion that is in contact with the porous plug.

The invention relates to the technical field of light sources, particularly discloses a method and a device for adjusting the central position of a plasma, and aims to realize accurate positioning and stable control of the plasma by accurately controlling output parameters of a magnetic field generator. According to the method, a magnetic field generator with a specific shape and distribution is utilized, a magnetic field with a closed magnetic line structure is generated in a plasma chamber, charged particles in plasma are guided to move along a preset path, and it can be ensured that the plasma reaches and is kept at an expected position by monitoring and adjusting magnetic field parameters in real time.

The invention relates to an atomic layer etching system and method for autonomously generating a process formula. The system is provided with a system digital twinning capable of autonomously generating process formula parameters and subsystem control parameters. The system based on digital twin drive can support accurate simulation, thereby realizing efficient and highly adaptive semiconductor processing. In some embodiments, a system controller may utilize system digital twinning to generate a process recipe based on an optimization program of a predefined cost function. A novel approach is presented herein that provides an initial estimate by utilizing a large number of simulation application cases accumulated for a long term in the background. The concept of the invention can be widely applied to any type of etching and deposition process system using the vacuum plasma chamber.

An edge ring for use in a plasma chamber includes a first pair of edge ring segments with each one of the first pair of edge ring segments having a first thickness and a second pair of edge ring segments with each one of the second pair of edge ring segments having a second thickness. Each of the first pair of edge ring segments is oriented adjacent to each of the second pair of edge ring segments and each of the second pair of edge ring segments is oriented adjacent to each of the first pair of edge ring segments.

A method for plasma processing a substrate, where the method includes generating a plasma in a plasma chamber within which the substrate is held during processing, where generating the plasma includes: flowing a discharge gas through the plasma chamber; coupling a radio frequency (RF) source signal to a first RF electrode, where the coupling ionizes the discharge gas; and coupling a bias signal to a second RF electrode, the bias signal being a periodic series of bias pulses, each period having a bias-ON time and a bias-OFF time, where a bias voltage waveform is applied during the bias-ON time; generating a pulsed DC magnetic field in the plasma chamber, by coupling a magnetizing signal to an electromagnet, the magnetizing signal being a periodic series of current pulses; and prior to coupling the magnetizing signal, synchronizing the periodic series of current pulses with the bias signal to flow a DC magnetizing current during the bias-ON time.

Embodiments of the invention include a plasma system. The plasma system includes a plasma chamber; an RF driver configured to drive bursts into the plasma chamber with an RF frequency; a nanosecond pulser configured to drive pulses into the plasma chamber with a pulse repetition frequency, the pulse repetition frequency being less than the RF frequency; a high pass filter disposed between the RF driver and the plasma chamber; and a low pass filter disposed between the nanosecond pulser and the plasma chamber.

Embodiments of the present disclosure provide a system for fast impedance tuning. The system includes a radio frequency (RF) generator to generate power, a plasma chamber to receive the power from the RF generator and a RF matching network inserted between the RF generator and the plasma chamber configured to match a plasma load impedance to a RF generator impedance using a solid state based variable capacitor. The RF matching network includes a bias circuit that applies a reverse bias to the solid state based variable capacitor to control a capacitance value of the solid state based variable capacitor. The plasma load impedance is matched with the RF generator impedance when pulsed voltage, multi-level pulsing, or RF match ignition tuning is applied.

Systems, methods and apparatus for regulating ion energies in a plasma chamber and avoiding excessive and damaging charge buildup on the substrate surface and within capacitive structures being built on the surface. An exemplary method includes placing a substrate in a plasma chamber, forming a plasma in the plasma chamber, controllably switching power to the substrate so as to apply a periodic voltage function (or a modified periodic voltage function) to the substrate, and modulating, over multiple cycles of the periodic voltage function, the periodic voltage function responsive to a defined distribution of energies of ions at the surface of the substrate so as to effectuate the defined distribution of ion energies on a time-averaged basis, and to maintain surface charge buildup below a threshold.

The present invention is directed towards an apparatus and method to detect electromagnetic radiation or signals emitted by plasma comprising a sensor unit, the sensing unit comprising a first sensor for detecting electromagnetic radiation or signals; an electromagnetic barrier wherein the electromagnetic barrier is configured to surround the first sensor to prevent ambient electromagnetic radiation reaching the first sensor; a first port through which electromagnetic radiation can pass, the port configured for coupling to a port of a plasma chamber such that electromagnetic radiation or signals emitted from the plasma can reach the first sensor; and a first output coupled with a balun and a dual coaxial system whereby a signal sensed is grounded and a phase reversed version of the signal is grounded. A signal acquisition system (SAS) for detecting electromagnetic radiation emitted by a plasma is also described.

A system for mounting the shield ring to the pedestal in a plasma chamber is disclosed. The mounting system includes compliant hardware. A fastener with a compliant component, such as an O-ring, is first secured to the pedestal. The shield ring has a top surface, a bottom surface and walls extending downward from the inner and outer diameter of the shield ring. Bores are located on the bottom surface of the shield ring. The bores of the shield ring are aligned with the fasteners and the shield ring is then pressed down onto the fasteners. As the shield ring is being pressed down, the walls of the bores force the compliant hardware to yield. When in place, the compliant hardware supplies the requisite compression force to hold the shield ring in place. The compliant hardware may be implemented in various manners.

According to an embodiment, a plasma processing system includes a plasma chamber, an RF source, a matching circuit, a balun, and a resonating antenna. The resonating antenna includes a first and a second spiral resonant antenna (SRA), each having an electrical length corresponding to a quarter of a wavelength of a frequency of a forward RF wave generated by the RF source. The first end of the first SRA is coupled to a first balanced terminal of the balun and the second end of the first SRA is open circuit. The first end of the second SRA is coupled to a second balanced terminal of the balun and the second end of the second SRA is open circuit. The first and the second SRA are arranged in a symmetrically nested configuration having a same center point.

The present disclosure relates to an ion beam etching (IBE) system including a plasma chamber configured to provide plasma, a screen grid, an extraction grid, an accelerator grid, and a decelerator grid. The screen grid receives a screen grid voltage to extract ions from the plasma within the plasma chamber to form an ion beam through a hole. The extraction grid receives an extraction grid voltage, where a voltage difference between the screen grid voltage and the extraction grid voltage determines an ion current density of the ion beam. The accelerator grid receives an accelerator grid voltage. A voltage difference between the extraction grid voltage and the accelerator grid voltage determines an ion beam energy for the ion beam. The IBE system can further includes a deflector system having a first deflector plate and a second deflector plate around a hole to control the direction of the ion beam.

Apparatus and process for the continuous production of carbon black or carbon containing compounds. The process is performed by converting a carbon containing feedstock, including generating a plasma gas with electrical energy, accelerating the plasma gas through a nozzle, whose diameter is narrowing in the direction of the plasma gas, guiding the plasma gas into a reaction area where feedstock is injected under conditions generated by aerodynamic and electromagnetic forces, including intense rapid mixing between the plasma gas and feedstock occurs. There is no significant recirculation of feedstock into the plasma chamber, and the reaction zone does not immediately come into contact with any contact surfaces. The products of reaction are cooled, and the carbon black or carbon containing compounds are separated from the other reaction products.

A film forming apparatus (100) is provided with a chamber (1), a mounting table (21), and a fluid head (3). The fluid head (3) is provided inside the chamber (1) at a position facing the first main surface of the substrate (W) placed on the placement table (21). The fluid head (3) has a plasma chamber (4b), a plasma source (5), a plurality of first outlets (4c), a gas flow path (6b), and a plurality of second outlets (6c). A plasma source (5) converts a first raw material gas into plasma in a plasma chamber (4b). The first outflow ports (4c) are two-dimensionally dispersed and arranged in an overlapping region that overlaps the first main surface of the substrate (W) in plan view. Active species derived from the first raw material gas flow out from the first outlet (4c) toward the first main surface of the substrate (W). The plurality of second outlets (6c) are two-dimensionally dispersed and arranged at positions different from those of the plurality of first outlets (4c) in the overlapping region. The second source gas flows out from the plurality of second outlets (6c) toward the first main surface of the substrate (W).

A pulse generator is disclosed. The pulse generator includes a DC source; a plurality of switches, a transformer; and a pulsing output. The pulse generator can be coupled with a plasma chamber. The pulsing output outputs high voltage pulses having a peak-to-peak voltage greater than 1 kV and a voltage portion between consecutive high voltage bipolar pulses that has a negative slope that substantially offsets the voltage reduction on a wafer within a plasma chamber due to an ion current. The resulting voltage at the wafer may be substantially flat between consecutive pulses.

A processing system. The processing system may include a plasma chamber to generate a plasma; an extraction system, to extract an ion beam from the plasma chamber and deliver the ion beam to a substrate position, external to the plasma chamber; and an in-situ beam metrology system, having at least one detector to image the ion beam in imaging region that extends between the plasma chamber and the substrate position.

In one embodiment, an RF impedance matching circuit is disclosed. The matching circuit is coupled between a plasma chamber and an RF source. The matching circuit includes a first electronically variable capacitor (EVC) having a first variable capacitance, a terminal of the first EVC being operably coupled to the RF input, and a second EVC having a second variable capacitance, a terminal of the second EVC being operably coupled to the RF output. A control circuit determines, based on a first parameter, a first capacitance value for the first EVC and a second capacitance value for the second EVC. The control circuit then generates a control signal to alter the first and second variable capacitances accordingly. The alteration of the capacitances, while the frequency of the RF source is not altered, causes RF power reflected back to the RF source to decrease.

The present disclosure relates to an ion beam etching (IBE) system including a plasma chamber configured to provide plasma, a screen grid, an extraction grid, an accelerator grid, and a decelerator grid. The screen grid receives a screen grid voltage to extract ions from the plasma within the plasma chamber to form an ion beam through a hole. The extraction grid receives an extraction grid voltage, where a voltage difference between the screen grid voltage and the extraction grid voltage determines an ion current density of the ion beam. The accelerator grid receives an accelerator grid voltage. A voltage difference between the extraction grid voltage and the accelerator grid voltage determines an ion beam energy for the ion beam. The IBE system can further includes a deflector system having a first deflector plate and a second deflector plate around a hole to control the direction of the ion beam.

A pulse generator is disclosed. The pulse generator includes a DC source; a plurality of switches, a transformer; and a pulsing output. The pulse generator can be coupled with a plasma chamber. The pulsing output outputs high voltage pulses having a peak-to-peak voltage greater than 1 kV and a voltage portion between consecutive high voltage bipolar pulses that has a negative slope that substantially offsets the voltage reduction on a wafer within a plasma chamber due to an ion current. The resulting voltage at the wafer may be substantially flat between consecutive pulses.

In one embodiment, a system for controlling a matching network of a semiconductor manufacturing system is disclosed. The matching network comprises an electronically variable reactance element (EVRE) that varies its total reactance using different match configurations. A plasma chamber carries out a process upon a substrate, the process comprising process steps including at least a first process step and a second process step. A memory, for each process step, stores instructions for carrying out the process step. A control circuit, while continuously carrying out each of the process steps of the process, upon anticipation that the plasma chamber will be transitioning from the first process step to the second process step, alters the match configuration to a new match configuration based on the instructions for carrying out the second process step.

The invention relates to the field of semiconductor manufacturing, in particular to a plasma chamber and pre-cleaning equipment for physical vapor deposition, the plasma chamber comprises a vacuum chamber, a gas distribution module is arranged at the top of the vacuum chamber, a first door body is arranged on the front face of the vacuum chamber, a base is arranged in the vacuum chamber, and a second door body is arranged in the base. The base is provided with a clamp rapid switching assembly. According to the overturning device, the overturning objective table is unlocked and locked by arranging the clamp rapid switching assembly and matching of a male buckle and a female buckle, then a clamping base conforming to the shape of a workpiece can be rapidly overturned to the top, the compatibility of the device to different workpieces is improved, secondly, a telescopic rod of a first telescopic cylinder stretches out and draws back to drive a lifting table to ascend and descend, and the clamping base can be rapidly overturned to the top; and the lifting platform can be lifted to a safe height when the clamps are switched, so that the overturning objective table is prevented from colliding with other parts when being overturned. The pre-cleaning equipment for physical vapor deposition provided by the invention comprises the plasma chamber provided by the invention.

A method for controlling particle growth in a processing chamber is disclosed herein. The method includes performing at least one plasma deposition process in a chamber using a precursor to form a layer on a substrate. The method also includes providing power to the chamber during the at least one plasma deposition process, and monitoring at least one criterion to determine when at least one plasma purge is to be performed. The method further includes performing at least one plasma purge by applying a gas into the chamber in response to at least one criterion indicating that the at least one plasma purge is to be performed.

A method and apparatus for spatially switching radio frequency (RF) power from a single RF power generator to a selected one of two or more impedance matching networks coupled to associated RF electrodes for forming plasma in a plasma chamber. Full RF power may be switched within microseconds to the selected one of the two or more impedance matching networks. The two or more impedance matching networks may be coupled to one or more plasma generating electrodes. The two or more impedance matching networks may be interleaved during plasma processing recipe operation. Impedance matching networks can alternate back and forth during operation of a plasma processing recipe. This interleaving in operation and impedance transformation capabilities may also be performed with more than two impedance matching networks, and may be beneficial in enabling the use of fixed tuned impedance matching networks instead of requiring variable impedance matching networks having variable tuning capabilities.

A plasma processing method includes applying AC waveforms to a bottom electrode in a plasma chamber to generate a plasma. The method further includes applying a first pulse train including a first plurality of DC pulses to a top electrode in the plasma chamber, where each DC pulse of the first plurality of DC pulses includes a first on-state and a first off-state. And the method further includes applying a second pulse train including a second plurality of DC pulses to the bottom electrode in the plasma chamber, and where each DC pulse of the second plurality of DC pulses includes a second on-state and a second off-state, the first pulse train being offset in phase relative to the second pulse train so that each first off-state overlaps with each second on-state.

According to an embodiment, a plasma chamber having a substrate holder, a ring assembly, and a fiber optic cable is proposed. The substrate holder having a top surface and a bottom surface. The top surface of the substrate holder is configured to hold a substrate for plasma processing. The ring assembly includes a focus ring horizontally surrounding the substrate. The focus ring includes a cavity arranged in a vertical direction from the bottom surface of the substrate holder to the top surface of the substrate holder. The fiber optic cable is fed through the cavity. The fiber optic cable having an endpoint configured to collect light emitted by plasma to determine its species density as well as atomic or ionic composition.

A semiconductor processing system may include a semiconductor processing chamber configured to execute a recipe on a semiconductor wafer. The system may include a first plasma source to provide plasma to the semiconductor processing chamber and to be duty cycled during an execution of the recipe. The system may also include a second plasma source configured to maintain the plasma in the semiconductor processing chamber while the first plasma source is duty cycled.

Systems and methods for pulsing radio frequency (RF) coils are described. One of the methods includes supplying a first RF signal to a first impedance matching circuit coupled to a first RF coil, supplying a second RF signal to a second impedance matching circuit coupled to a second RF coil, and pulsing the first RF signal between a first parameter level and a second parameter level. The method includes pulsing the second RF signal between a third parameter level and a fourth parameter level in reverse synchronization with the pulsing of the first RF signal.

A semiconductor processing system with improved plasma density is disclosed. The system includes a plasma chamber having a base, chamber walls and a top wall. An antenna is used to generate RF energy that is inductively coupled into the plasma chamber. The antenna comprises a plurality of coils that are proximate a dielectric window. One or more RF blockers are disposed adjacent to the dielectric window to block some of the RF energy from entering the plasma chamber. If the RF blocker is placed near a region of high plasma density, the density in that region may be reduced, improving the uniformity of the plasma density within the plasma chamber. Further, the RF blockers may have openings and may also be overlapped to create varying degrees of blocking.

According to an embodiment, a plasma processing system is proposed. The plasma processing system includes a plasma chamber; an RF source configured to generate a forward RF wave; an impedance matching circuit coupled to the RF source, the impedance matching circuit configured to provide matching for the RF source; a balun having unbalanced terminals coupled to the impedance matching circuit; and a resonant antenna configured to generate plasma within the plasma chamber, the resonant antenna being a spiral resonant antenna with an electrical length corresponding to a half-wavelength of a frequency of the forward RF wave, the resonant antenna comprising: a first tap along the spiral resonant antenna coupled to a first balanced terminal of the balun and a second tap along the spiral resonant antenna coupled to a second balanced terminal of the balun.

The plasma chamber includes a chamber body having a processing region therein, a liner disposed on the chamber body and surrounding the processing region, a substrate support disposed within the liner, a magnet assembly having a plurality of magnets disposed around the liner, and a magnetic material shield disposed around the liner, the magnetic material shield enclosing the processing region near the substrate support.