System architecture for vacuum processing

Abstract

A system for processing substrates in plasma chambers, such that all substrates transport and loading / unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.

Description

RELATED APPLICATIONS[0001]This application claims priority benefit from U.S. Provisional Application Ser. No. 61 / 639,052, filed on Apr. 26, 2012, the entire disclosure of which is incorporated herein by reference.BACKGROUND[0002]1. Field[0003]This application relates to systems for vacuum processing, such as systems used in the fabrication of solar cells, flat panel displays, touch screens, etc.[0004]2. Related Art[0005]Various systems are known in the art for fabricating semiconductor IC's, solar cells, touch screens, etc. The processes of these systems are conducted in vacuum and include, e.g., physical vapor deposition (PVD), chemical vapor deposition (CVD), ion implant, etch, etc. There are two basic approaches for such systems: single-substrate processing or batch processing. In single wafer processing, only a single substrate is present inside the chamber during processing. In batch processing several substrates are present inside the chamber during processing. Single substrat...

AI Technical Summary

Benefits of technology

The invention provides a system that can handle different types and sizes of substrates without reconfiguration, by simply changing the susceptors used. The system can handle various processes and process steps, and can be used for fabrication of various devices, such as solar cells, flat panel displays, and touch screens. The system allows for separate handling and processing of substrates in atmospheric environment and in vacuum, and can also be used with manual or automated loading and unloading. The system enables efficient cooling and prevents accidental movement of substrates, and can also use electrostatic chucking or mechanical chucking for substrate biasing. The system can process substrates on line-array carriers and can be used for vertical transport of substrates.

Problems solved by technology

Single substrate processing enables high level of control of the process inside the chamber and the resulting film or structure fabricated on the substrate, but results in a relatively low throughput.

While throughput is increased utilizing trays of two-dimensional wafer arrays, the handling and the loading and unloading operations of such large trays becomes complex.

However, since batch system utilize a moving tray with the substrates, it is difficult to apply the bias.

However, loading and unloading of substrate vertically is complex compared to horizontal loading and unloading.

One way to create this exclusion zone is through the use of a mask; however, using masks has many challenges.

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