The invention provides a target poisoning resisting method and
system based on multi-stage pulse reactive
sputtering, and belongs to the technical field of magnetron
sputtering. According to the method, air serves as reaction gas, a pulse direct-current power source is adopted, and reactive
sputtering treatment is conducted on a
metal target material; the reactive sputtering treatment comprises a first stage, a second stage and a sputtering
voltage feedback control stage in sequence. The sputtering power and the duty ratio are adjusted in three stages, the first stage can stabilize luminance build-up and preliminarily clean the surface of the target material, and the second stage can improve the
nitrogen ionization rate (gt; 50%) and suppresses the
oxygen ionization rate (lt; and in the sputtering
voltage feedback control stage, the sputtering power and the duty ratio are adjusted according to the drop amplitude of the sputtering
voltage, an insulating compound layer on the surface of the target material can be efficiently sputtered and stripped, and the poisoning state of the target material is effectively inhibited, so that the method can effectively inhibit target material poisoning, the service life of the target material is prolonged, complex equipment is not needed, and the cost is relatively low.