Encapsulation structure and method for applying guidance type light emitting diode device

A light-emitting diode and application-oriented technology, which is applied in the field of packaging structure of application-oriented light-emitting diode devices to achieve the effects of improving light extraction efficiency and spot quality, improving efficiency and reducing volume
CN101452987AInactive Publication Date: 2009-06-10GUANGDONG REAL FAITH OPTO

Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
GUANGDONG REAL FAITH OPTO
Publication Date
2009-06-10
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention relates to a structure and a method for packaging application-oriented LED devices. The structure comprises an LED chip, a packaging tube shell, phosphor gel, packaging colloid and a lens, wherein the LED chip is pasted in the packaging tube shell; a chip electrode is connected with a circuit layer in the packaging tube shell; the LED chip is packaged by the packaging colloid or the phosphor gel; the lens is manufactured by use of a mold or a precision machining method; at least one surface selected from the light outlet surface and the light inlet surface of the lens is a free curved surface; the lens is manufactured by pouring the packaging colloid or by a self-flow forming method; the light outlet surface of the lens is a free curved surface; and the lens is a single lens, a plurality of lens combinations or a lens array. As the invention adopts the application-oriented free-curved-surface lens to package an LED module, the LED module can be directly applied to different lighting occasions, and no other secondary optical system is needed when an LED lamp is designed. Therefore, the invention has the advantages of improving the light-emitting efficiency and spot quality of the LED module, improving the efficiency of the LED lamp, reducing the volume of the LED lamp and providing use convenience for users.
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Description

technical field

[0001] The invention relates to a light-emitting diode, in particular to a packaging structure and method for an application-oriented light-emitting diode device. technical background

[0002] Light-emitting diode (LED) is a type of electroluminescent device that can directly convert electrical energy into visible light and radiant energy. Its light-emitting mechanism is to use the recombination of electrons and holes to generate photons. Compared with traditional light sources, LED has the advantages of high luminous efficiency, good color rendering, low power consumption, energy saving and environmental protection, high safety and reliability, and long service life, and has been widely used in many fields, and is considered by the industry as a lighting source The main direction of the market, with huge market potential.

[0003] At present, Lamp-type low-power LEDs and Power-type high-power LEDs are basically packaged in spherical or hemispherical or appr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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