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Encapsulation structure and method for applying guidance type light emitting diode device

A light-emitting diode and application-oriented technology, which is applied in the field of packaging structure of application-oriented light-emitting diode devices to achieve the effects of improving light extraction efficiency and spot quality, improving efficiency and reducing volume

Inactive Publication Date: 2009-06-10
GUANGDONG REAL FAITH OPTO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the lens control method can reduce the volume of LED lamps, the externally installed lens still belongs to the secondary optical system

Method used

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  • Encapsulation structure and method for applying guidance type light emitting diode device
  • Encapsulation structure and method for applying guidance type light emitting diode device
  • Encapsulation structure and method for applying guidance type light emitting diode device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] like Figure 4 Shown is the encapsulation flow chart of the encapsulation method 1 of the present invention. First, fix the light emitting diode chip 2 on the packaging package 1 through silver paste or solder or other bonding materials, and complete the electrical connection between the light emitting diode chip 2 and the package package 1 by punching gold wires or other electrode interconnection methods. interconnection. Phosphor powder glue 3 is wrapped LED chip 2 and cured ( Figure 4 a). Then, the free-form surface lens 5 obtained by mold manufacturing or precision machining is fixed on the package package 1 through the fixing structure 8 on the free-form surface lens and the fixing groove 9 on the package package. The fixation structures 8 and 9 are in natural contact or Adhesive bonding ( Figure 4 b). Then through the glue injector 11, the encapsulating colloid 4 is poured into the glue injection hole 6 of the free-form surface lens, and the encapsulating c...

Embodiment 2

[0044] like Figure 5Shown is the encapsulation flow chart of the encapsulation method 2 of the present invention. First, obtain the light-emitting diode chip 2 ( Figure 5 a). Then, inject the encapsulant 4 into the encapsulation shell 1 through the glue injector 11, so that the encapsulant 4 can be self-flowing on the encapsulation shell without restraint, or constrained by the convex structure 10 that restricts the flow of the encapsulant on the encapsulation shell. bottom self-flow forming, and wrapping the light-emitting diode chip 2 ( Figure 5 b). Then, the free-form surface lens 5 is obtained by mold manufacturing or precision machining, and the encapsulation colloid 4 is squeezed from top to bottom, so that the encapsulation colloid 4 is completely surrounded by the upper surface of the packaging tube, the upper surface of the chip, the base surface of the lens, and the light incident surface. cavity, excess encapsulation colloid and air are discharged from the in...

Embodiment 3

[0046] like Image 6 Shown is the encapsulation flow chart of the encapsulation method 3 of the present invention. First, obtain the light-emitting diode chip 2 ( Image 6 a). Then, the free-form surface lens mold 12 is aligned and fixed on the package shell 1 ( Image 6 b). Then from the free-form surface lens mold injection hole 13, the encapsulation compound 4 is poured into the cavity surrounded by the package shell upper surface, the chip upper surface and the inner surface of the mold, and the encapsulation compound 4 is filled with the entire cavity ( Image 6 c). Finally, curing the encapsulation colloid 4, demolding, and completing the encapsulation of the light-emitting diode free-form surface lens ( Image 6 d).

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Abstract

The invention relates to a structure and a method for packaging application-oriented LED devices. The structure comprises an LED chip, a packaging tube shell, phosphor gel, packaging colloid and a lens, wherein the LED chip is pasted in the packaging tube shell; a chip electrode is connected with a circuit layer in the packaging tube shell; the LED chip is packaged by the packaging colloid or the phosphor gel; the lens is manufactured by use of a mold or a precision machining method; at least one surface selected from the light outlet surface and the light inlet surface of the lens is a free curved surface; the lens is manufactured by pouring the packaging colloid or by a self-flow forming method; the light outlet surface of the lens is a free curved surface; and the lens is a single lens, a plurality of lens combinations or a lens array. As the invention adopts the application-oriented free-curved-surface lens to package an LED module, the LED module can be directly applied to different lighting occasions, and no other secondary optical system is needed when an LED lamp is designed. Therefore, the invention has the advantages of improving the light-emitting efficiency and spot quality of the LED module, improving the efficiency of the LED lamp, reducing the volume of the LED lamp and providing use convenience for users.

Description

technical field [0001] The invention relates to a light-emitting diode, in particular to a packaging structure and method for an application-oriented light-emitting diode device. technical background [0002] Light-emitting diode (LED) is a type of electroluminescent device that can directly convert electrical energy into visible light and radiant energy. Its light-emitting mechanism is to use the recombination of electrons and holes to generate photons. Compared with traditional light sources, LED has the advantages of high luminous efficiency, good color rendering, low power consumption, energy saving and environmental protection, high safety and reliability, and long service life, and has been widely used in many fields, and is considered by the industry as a lighting source The main direction of the market, with huge market potential. [0003] At present, Lamp-type low-power LEDs and Power-type high-power LEDs are basically packaged in spherical or hemispherical or appr...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L25/00H01L25/075H01L21/50H01L33/50H01L33/52
Inventor 刘胜王恺罗小兵刘宗源陈飞陈明祥甘志银金春晓
Owner GUANGDONG REAL FAITH OPTO
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