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60 results about "Micro mechanism" patented technology

Uniaxle integrated inertia measurement device based on single mass-block

The present invention which relates to the micro-mechanism electric technology provides a single-shaft and integrated device for measuring the inertia based on the single quality block. And the present solves the problems of the prior single-shaft and integrated assembly for measuring the inertia that the structure is complex, the volume and quality are big, etc. The single-shaft and integrated device for measuring the inertia includes a quality block and a glass cover bottom. The quality block which is hang on the upper of the glass cover bottom through a supporting beam includes a quality chip and four supporting bodies that are fixed with the four sides of the quality chip through the elastic beam. A moveable comb for detecting is fixed on the external of the supporting body relative to the Y direction and a moveable comb for driving is fixed on the external of the supporting body relative to the X direction. A fixed comb for detecting and a fixed comb for driving are fixed on the glass cover bottom, and electrodes for forming the capacitance are fixed on the lower end surface and the glass cover bottom of the quality chip. The device in the present invention has advantages of a reasonable structure, an easy processing, a high reliability, a small volume, a strong ability of resisting the interference, a high precision, a high precision of measuring the paralleling and orthogonality of the vectors, etc.
Owner:ZHONGBEI UNIV

Particle measurement method and device based on optical fiber type dynamic light scattering mutual correlation technology

The invention discloses a particle measurement method and device based on an optical fiber type dynamic light scattering mutual correlation technology. A laser device and a first optical fiber probe in a sample pool form an incidence optical path; a second optical fiber probe in the sample pool and the first optical fiber probe form a scattering optical path; scattered light passes through a coupler, a first optical detector and a second optical detector to form a dynamic scattered light signal detection and processing unit through a digital correlator and a micro mechanism; laser irradiates the particle sample pool through the first optical fiber probe; particles scatter the laser; the scattered light is received by the second optical fiber probe, then is divided by the coupler, enters the two optical detectors and is converted into a pulse signal read by the micro mechanism to calculate a particle size. The conventional optical elements are eliminated, so that the size of a system is greatly reduced; more importantly, the optical fiber probes can be directly inserted into a sample solution and can directly measure a sample with high concentration; and therefore, on-line monitoring and remote measurement for industrial production are realized.
Owner:ZHEJIANG MEASUREMENT SCI RES INST

Micro-mechanism testing probe card based on electroplating technique and manufacturing method thereof

The invention relates to a micro mechanical testing probe card based on electroplating process and a manufacturing method thereof, and is characterized in that, cantilevers and probe tips are manufactured and formed on a silicon wafer with electroplated metal nickel; the probe tips are manufactured on an (111) inclined surface of the silicon wafer, and each probe tip is connected with a ceramic substrate with one or two probe cantilevers; the probe cantilevers and the probe tips adopt an isostress beam structure; probes on an flip chip substrate are intensively arranged in two directions. The manufacturing is characterized in that: firstly, the upper surface of the (100) silicon wafer is taken as the electroplated working face, and the probe cantilevers of a low stress nickel layer is formed by electroplating; and then a deep groove (111) inclined surface produced by anisotropic etching is taken as the working face, and the probe tips of the low stress nickel layer is formed by electroplating, and then the probes are connected with a package substrate by a flip chip process, and finally the probe structure is released through a method of removing the corrosion of the silicon wafer.
Owner:深圳市道格特科技有限公司
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