Method for preparing three-dimensional micro-configuration of unidimensional nanometer material

A technology of nanomaterials and microstructures, applied in the field of preparation in the field of nanotechnology, can solve problems such as the inability to prepare three-dimensional microstructures and the difficulty in achieving mass production capabilities of semiconductor manufacturing technology, achieving low cost, easy mass production, and simple processes Effect

Inactive Publication Date: 2006-02-08
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The three-dimensional structure formed by this method is formed on the carbon nanotube array, so there are process compatibility problems with other parts of the electronic device, such as metal film, dielectric film and other functional corresponding structures, and it is difficult to achieve it by laser processing. Mass production capability of semiconductor manufacturing technology
Since both methods are processed on the CVD-grown carbon nanotube layer, the height of the obtained three-dimensional microstructure is limited by the thickness of the CVD growth film, and it is impossible to prepare a large-height three-dimensional microstructure.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] (1) Preparation of the substrate. The substrate used in this embodiment is a glass with a diameter of 3 inches and a thickness of 1.2 mm. First, a sputtering method is used to form a metal composite film of chromium and copper on the substrate. The thickness of chromium is 0.03 Micrometers, the thickness of copper is 0.07 micrometers.

[0017] (2) Metal micro-electroforming: first photoresist micro-molding, using semiconductor photolithography process, including four steps of glue rejection, glue baking, exposure and development. In this embodiment, a positive photoresist is used, and the glue is spun-baked twice on the glue-spun machine to form a 70-micron-thick photoresist layer, and then exposed and developed twice with a 275-watt mercury lamp. Each exposure time is 5 minutes, the development time is 5 minutes. After development, a photoresist mold pattern with a thickness of 70 microns was formed.

[0018] The electroforming material used is metallic nickel, and the thi...

Embodiment 2

[0024] The second embodiment includes the same steps as the first embodiment, and the main difference is:

[0025] (1) Substrate preparation

[0026] (2) Metal micro-electroforming: The micro-molding material used is SU-8 negative photoresist, and its thickness is 500 microns. When forming the photoresist mold, the exposure time was 320 seconds, and the development time was 10 minutes. When removing the photoresist mold, the entire glass sheet is immersed in acetone for 48 hours, after the photoresist is removed, rinsed with deionized water and dried.

[0027] (3) Screen printing carbon nanotube paste: In the composition ratio of the paste, the mass percentage of organic solvent and carbon nanotubes is 16:1, and the organic solvent is composed of terpineol and ethyl with a mass percentage of 100:5. Cellulose composition. The mesh number of the screen plate is 400, and the thickness of the carbon nanotube paste screen printing layer is 10 microns.

[0028] (4) Microstructure curing a...

Embodiment 3

[0031] The third embodiment includes the same steps as the first embodiment, and the main difference is:

[0032] (1) Substrate preparation

[0033] (2) Metal micro electroforming

[0034] (3) Screen printing carbon nanotube paste: In the composition ratio of the paste, the mass percentage of organic solvent and carbon nanotube is 12:1, and the organic solvent is composed of terpineol and ethyl ester with a mass percentage of 100:2. Cellulose composition. The mesh number of the screen plate is 300, and the thickness of the screen printing layer of the carbon nanotube paste is 12 microns.

[0035] (4) Microstructure curing and molding: the heat treatment temperature is 300 degrees, and the heat preservation time is 1 hour.

[0036] The final three-dimensional carbon nanotube configuration is a comb-shaped electrode structure with a curved configuration. The radius of curvature of each electrode is 1 mm, and the length of the electrode is 200 microns. The carbon nanotubes are locate...

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Abstract

The invention relates to a method for preparing three-space micro mechanism of a one-space nanometer material in the field of nanometer technology, which comprises: preparing for the base chip: doing preprocessing to the base chip; steel micro electric molding: forming the photoresist micro casting mold of the mental electrode structure with the needed structure and the displacement characters on the processed base chip, and cladding the mental material on the micro casting mold to form the mental micro mechanism; silk-screen printing one-space nanometer material paste: preparing one-space nanometer material paste and adopting silk-screen printing method to coat the one-space nanometer material paste on the side wall and the surface of the steel micro mechanism; micro mechanism solid shaping: extracting the organics of the one-space nanometer material micro mechanism to stable the nanometer material structure by heating and heat preservation process.

Description

Technical field [0001] The invention relates to a preparation method in the field of nanotechnology, in particular to a method for preparing a three-dimensional microstructure of one-dimensional nanomaterials. Background technique [0002] The application of one-dimensional nanomaterials in micro-nano electronic devices is mainly realized by adopting micro-nano electronic processing technology through various micro-pattern structures. The commonly used processing method generally combines the film forming process and the patterning process. At present, in the patterning technology of one-dimensional nanomaterials, the patterning technology of carbon nanotubes has been studied more. Its mainstream technologies include CVD technology and patterning technology based on carbon nanotube paste. However, these two methods are effective for carbon nanotubes. The three-dimensional structure ability of nanotube microstructures is very low, which cannot meet the special requirements of a ce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/00G03F7/12G03F5/00
Inventor 侯中宇张亚非蔡炳初徐东魏星
Owner SHANGHAI JIAO TONG UNIV
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