MEMS in-plane displacement measurement method correlated with mixed fractal interpolation and frequency-domain digital speckle

A frequency-domain digital speckle and fractal interpolation technology, which is applied in the direction of measuring devices, instruments, and optical devices, can solve the problems of large measurement errors, large calculations, and low calculation efficiency, so as to improve test accuracy and repeated search. , the effect of reducing the amount of calculation

Inactive Publication Date: 2015-11-11
CHONGQING UNIV OF POSTS & TELECOMM
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Problems solved by technology

In terms of image correlation, the above studies mostly use gray-scale and feature-based matching methods in the spatial domain. These methods are extremely sensitive to image gray-scale changes or rotations, and traditional digital correlation methods produce large errors due to repeated searches. The amount of calculation, so there will be low calculation efficiency and large measurement error

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  • MEMS in-plane displacement measurement method correlated with mixed fractal interpolation and frequency-domain digital speckle
  • MEMS in-plane displacement measurement method correlated with mixed fractal interpolation and frequency-domain digital speckle
  • MEMS in-plane displacement measurement method correlated with mixed fractal interpolation and frequency-domain digital speckle

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[0041] Below in conjunction with accompanying drawing, the present invention will be further described:

[0042] First, based on the micro-visual stroboscopic system, artificial spraying speckle is used to obtain the moving image of the MEMS microstructure, and its sub-regions f (MEMS microstructure image at zero phase time) and g (MEMS microstructure moving image at a certain phase), and There is only a simple pure translation relationship between them, namely

[0043] g(x,y)=f(x+u,y+v)(1)

[0044] The relative translation size between images f and g is denoted by (u, v).

[0045] Then, the fractal interpolation processing based on the random midpoint is performed on the two sub-region images, and the random midpoint displacement method can use a simple formula to represent the interpolation point (x mi ,y mi )

[0046] x mi =(x i +x i+1 ) / 2+s w rand() (2)

[0047] the y mi =(y i +y i+1 ) / 2+s w rand()

[0048] In formula (2), s and w are parameters controlling the...

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Abstract

The invention provides an MEMS microstructure plane displacement measurement method based on correlated technologies of mixed fractal interpolation and frequency-domain digital speckle, and relates to the field of image frequency-domain correlated technologies and MEMS dynamic measurement. The method comprises the steps that MEMS microstructure motion speckle image f (zero-phase time) and g (a phase time) are acquired; appropriate sizes of a reference sub-region and a target sub-region are selected; fractal interpolation processing is carried out on two sub-region images; reference sub-region image Fourier conversion adjoint is used as a matching filter; an acquired filter is used to filter the frequency spectrum of the target sub-region; Fourier conversion is carried out on a result acquired through filtering again, so as to acquire a correlated highlight; and a displacement parameter is acquired according to the position of the correlated highlight. The defects of large calculating quantity and insufficient measurement resolution of a traditional method are overcome. Fast and high-precision measurement of MEMS micro mechanism plane motion displacement can be realized.

Description

technical field [0001] The invention belongs to the research field of MEMS dynamic measurement methods, and the measurement of MEMS in-plane displacement belongs to one of the contents. It specifically relates to fractal interpolation and frequency-domain digital speckle correlation MEMS plane displacement measurement methods. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS: Micro-electro-MechanicalSystems) is a multidisciplinary cutting-edge research field developed on the basis of microelectronics technology, involving micromechanics, microelectronics, automatic control, physics, chemistry, biology and materials science and other engineering technologies and sciences. The development of MEMS technology has opened up a new technical field and industry. Micro-sensors, micro-actuators, micro-components, micro-mechanical optical devices, vacuum microelectronic devices, power electronic devices, etc. made by MEMS technology are small in size, light in weig...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/02
Inventor 胡章芳罗元席兵黄冬冬刘金兰胡银平辛伟李岩岩
Owner CHONGQING UNIV OF POSTS & TELECOMM
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