The invention provides a method for testing the interfacial fracture toughness of a second-generation high-temperature superconducting strip. The method comprises the steps of: (1), solidifying an enhancement layer, the thickness of which is much greater than the superconducting strip, at two sides of the superconducting strip, so that a composite beam structure is formed and used as a sample to be tested; (2), coating speckles at the narrow side of the sample in the length direction; (3), cutting the initial crack at one end of the superconducting strip of the sample, then, loading the sampleon a stretcher, and aligning a CCD camera to one side of the sample, on which the speckles are coated; (4), respectively developing type I and II interlayer fracture experiments; and (5), obtaining type I and II interlayer fracture toughness of the sample by calculation by using a digital image correlation method, wherein the result is the type I and II interlayer fracture toughness of the superconducting strip. According to the method provided by the invention, the enhancement layer, the thickness of which is much greater than the superconducting strip, is increased at two sides of the superconducting strip; therefore, the fracture toughness of the superconducting strip can be measured by a conventional experimental method; and furthermore, the experimental method is simple and high in accuracy.