Method for testing interfacial fracture toughness of second-generation high-temperature superconducting strip

A technology of high-temperature superconducting strips and fracture toughness, which is applied in the preparation of test samples, testing the strength of materials by applying a stable bending force, and testing the strength of materials by applying a stable tension/pressure, which can solve the problems affecting the use of strips , Difficult to test and other problems, to achieve the effect of ensuring the accuracy of the experiment, easy to implement, and simple measurement methods

Active Publication Date: 2019-05-10
LANZHOU UNIVERSITY
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Problems solved by technology

[0002] The second-generation high-temperature superconducting tape is a typical laminated composite material, and interlayer delamination often occurs, which seriously affects the use of th

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  • Method for testing interfacial fracture toughness of second-generation high-temperature superconducting strip
  • Method for testing interfacial fracture toughness of second-generation high-temperature superconducting strip
  • Method for testing interfacial fracture toughness of second-generation high-temperature superconducting strip

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Embodiment Construction

[0025] The solutions of the present invention will be further described below in conjunction with specific examples.

[0026] A method for testing the interface fracture toughness of a second-generation high-temperature superconducting strip, comprising the following steps:

[0027] (1) if figure 1 As shown, on both sides of the superconducting strip 1, the solidified thickness is much larger than its reinforcing layer 2, forming a composite beam structure and as a sample to be tested. 30 times, and the reinforcing layer 2 on both sides of the superconducting strip 1 has the same thickness, and the length of the reinforcing layer 2 is the same as that of the superconducting strip 1; the material of the reinforcing layer 2 can be selected from epoxy resin, oxygen-free copper or stainless steel, and High-strength glue can be used for bonding and curing. When oxygen-free copper or stainless steel is selected as the reinforcement layer, special solder for superconducting material...

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Abstract

The invention provides a method for testing the interfacial fracture toughness of a second-generation high-temperature superconducting strip. The method comprises the steps of: (1), solidifying an enhancement layer, the thickness of which is much greater than the superconducting strip, at two sides of the superconducting strip, so that a composite beam structure is formed and used as a sample to be tested; (2), coating speckles at the narrow side of the sample in the length direction; (3), cutting the initial crack at one end of the superconducting strip of the sample, then, loading the sampleon a stretcher, and aligning a CCD camera to one side of the sample, on which the speckles are coated; (4), respectively developing type I and II interlayer fracture experiments; and (5), obtaining type I and II interlayer fracture toughness of the sample by calculation by using a digital image correlation method, wherein the result is the type I and II interlayer fracture toughness of the superconducting strip. According to the method provided by the invention, the enhancement layer, the thickness of which is much greater than the superconducting strip, is increased at two sides of the superconducting strip; therefore, the fracture toughness of the superconducting strip can be measured by a conventional experimental method; and furthermore, the experimental method is simple and high in accuracy.

Description

technical field [0001] The invention belongs to the technical field of superconducting strip experiments, and relates to a second-generation high-temperature superconducting strip interface fracture toughness test method. Background technique [0002] The second-generation high-temperature superconducting tape is a typical laminated composite material, and the interface peeling between layers often occurs, which seriously affects the use of the tape. Since the thickness of the second-generation high-temperature superconducting strip is very thin (thickness is about 0.1 mm), and it has an asymmetric structure along the thickness direction of the material, such structural features make it difficult to capture the deformation characteristics of superconducting materials, especially the crack tip during deformation. . In addition, because the superconducting tape is very thin, it is difficult to test it with the traditional method of testing the interface fracture toughness of ...

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Application Information

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IPC IPC(8): G01N3/08G01N3/20G01N3/06G01N1/28
Inventor 高配峰王淑丹耿鑫关明智王省哲
Owner LANZHOU UNIVERSITY
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