The invention discloses a
salvia miltiorrhiza hole tray factory substrate
seedling raising method. The method comprises the following steps: a) preparing a substrate; b) hole tray treatment; c) seed pretreatment; d)
sowing and accelerating
germination; e) culturing by stages; f)
seedling hardening and outplanting. According to the
seedling raising method for the
salvia miltiorrhiza hole tray factory substrate, through a layered substrate structure and precise temperature and
light control, the emergence rate and the seedling rate are greatly increased, a light-temperature cooperation strategy is adopted, low light and low temperature are achieved in the first stage, the
transpiration effect is reduced, long growth caused by water roots (water absorption >
transpiration) of
salvia miltiorrhiza seedlings is avoided, strong light and carbon enrichment are achieved in the second stage, and the light saturation point is increased under the high CO2 concentration; accumulation of secondary metabolites (
salvianolic acid) is accelerated, the seedling raising efficiency is improved, the seedling raising period is shortened, early-stage soil-borne diseases are blocked through seed
coating agent enveloping, fungal spores are killed through KMnO4 plug tray disinfection,
pythium propagation is inhibited through matrix low-EC value management, and the
infection resistance of seedling
cell walls is enhanced through regular spraying of KH2PO4, so that a
disease and
insect pest prevention and control
closed loop is achieved.