337results about How to "Reduce yield loss" patented technology

An ion implantation device and a method of manufacturing a semiconductor device is described, wherein ionized boron hydride molecular clusters are implanted to form P-type transistor structures. For example, in the fabrication of Complementary Metal-Oxide Semiconductor (CMOS) devices, the clusters are implanted to provide P-type doping for Source and Drain structures and for Polygates; these doping steps are critical to the formation of PMOS transistors. The molecular cluster ions have the chemical form BnHx+ and BnHx− where 10

The invention discloses an airbag laminating device and method for curved glass on a touch screen. The airbag laminating device comprises a support plate and a fixture platform located below the support plate, wherein the fixture platform is used for positioning the curved glass; a main airbag is arranged on one side of the support plate close to the fixture platform; an auxiliary airbag is arranged at a position inside the main airbag corresponding to a bent part of the curved glass; the auxiliary airbag is used for tightly laminating a flexible film to the bent part of the curved glass. The airbag laminating device improves a stress structure of the bent part of the curved glass during lamination by arranging the auxiliary airbag corresponding to the bent part of the curved glass in the main airbag, and increases pressure of the bent part during lamination, so that the flexible film is further laminated to the bent part of the curved glass under compression effect of the auxiliary airbag, thereby eliminating the lamination bubbles of the flexible film and the curved glass, increasing the lamination quality and reducing yield loss.

An ion implantation device and a method of manufacturing a semiconductor device is described, wherein ionized carborane cluster ions are implanted into semiconductor substrates to perform doping of the substrate. The carborane cluster ions have the chemical form C2B10Hx+, C2B8Hx+ and C4B18Hx+and are formed from carborane cluster molecules of the form C2B10H12 ,C2B8H10 and C4B18H22 The use of such carborane molecular clusters results in higher doping concentrations at lower implant energy to provide high dose low energy implants. In accordance with one aspect of the invention, the carborane cluster molecules may be ionized by direct electron impact ionization or by way of a plasma.

A method for precipitating (separation) of lignin, using small amounts of acidifying agents, whereby a lignin product or an intermediate lignin product is obtained which can be used as fuel or chemical feed stock (or as a chemical or a raw material for further refining), from a lignin containing liquid / slurry, such as black liquor. A method for separation of lignin from a lignin containing liquid / slurry, such as black liquor, whereby a more pure lignin is obtained, a lignin product or an intermediate lignin product obtainable by the above methods, and use, preferably for the production of heat or for use as chemical, of the lignin product or intermediate lignin product are also disclosed.

An ion implantation device and a method of manufacturing a semiconductor device is described, wherein ionized boron hydride molecular clusters are implanted to form P-type transistor structures. The molecular cluster ions have the chemical form BnHx+and BnHx−, where 10<n<100 and 0≦x≦n+4. The use of such boron hydride clusters results in a dramatic increase in wafer throughput, as well as improved device yields through the reduction of wafer charging. A method of manufacturing a semiconductor device is further described, comprising the steps of: providing a supply of molecules containing a plurality of dopant atoms into an ionization chamber, ionizing said molecules into dopant cluster ions, extracting and accelerating the dopant cluster ions with an electric field, selecting the desired cluster ions by mass analysis, modifying the final implant energy of the cluster ion through post-analysis ion optics, and implanting the dopant cluster ions into a semiconductor substrate.

The present disclosure provides a method of manufacturing a photoelectric conversion device, including, a first step of forming a plurality of photoelectric conversion regions on a surface on one side of a semiconductor wafer, a second step of preparing a light-blocking wafer having insertion openings, a third step of bonding the one-side surface of the semiconductor wafer and a surface on the opposite side to a surface on the one side of the light-blocking wafer to each other to form a bonded wafer body, and a fourth step of dividing the bonded wafer body in peripheries of the photoelectric conversion regions, to obtain bonded-body chips each having the photoelectric conversion region.

An ion implantation device and a method of manufacturing a semiconductor device is described, wherein ionized boron hydride molecular clusters are implanted to form P-type transistor structures. The molecular cluster ions have the chemical form BnHx+ and BnHx−, where 10<n<100 and 0≦x≦n+4. The use of such boron hydride clusters results in a dramatic increase in wafer throughput, as well as improved device yields through the reduction of wafer charging. A method of manufacturing a semiconductor device is further described, comprising the steps of: providing a supply of molecules containing a plurality of dopant atoms into an ionization chamber, ionizing said molecules into dopant cluster ions, extracting and accelerating the dopant cluster ions with an electric field, selecting the desired cluster ions by mass analysis, modifying the final implant energy of the cluster ion through post-analysis ion optics, and implanting the dopant cluster ions into a semiconductor substrate.

A photoluminescent display device includes a blue light source and a photoluminescent display panel adjoining the blue light source. The photoluminescent display panel includes a transparent substrate, a color filter structure and a photoluminescent structure. The color filter structure includes a red pixel region, a green pixel region and a blue pixel region arranged adjacent to one another on the transparent substrate. The photoluminescent structure, which is disposed on the color filter structure and is facing toward the blue light source, includes a red light-conversion layer and a green light-conversion layer, wherein the red light-conversion layer is disposed on the green light-conversion layer. With this vertically stacked arrangement of the light-conversion layers, the photoluminescent display device can have higher optical energy utilization efficiency and a wider viewing angle, while being easier to be manufactured by relaxing the specification of accurate pixel-level alignment among the light-conversion layers and the color filter structure.

The present invention relates to a method and apparatus for filtering and drying a product. In a preferred embodiment, the apparatus comprises a container having a plurality of porous walls and a plurality of solid walls that divide the container into a plurality of product chambers, a plurality of vacuum chambers, and, preferably, a plurality of heat transfer chambers. Each product chamber shares at least one porous wall with an adjacent vacuum chamber. Each product chamber preferably shares at least one solid wall with an adjacent heat transfer chamber. According to the method of the present invention, a product is introduced into the product chambers, where the product is held while a substance is filtered from the product through the porous walls and the product is dried by reducing the pressure in the vacuum chambers and the product chambers. In a preferred embodiment of the method, a heat transfer fluid flows through the heat transfer chambers to facilitate keeping the product frozen and / or to facilitate faster drying of the product.

Adhesion of dielectric layer stacks to be formed after completing the basic configuration of transistor elements may be increased by avoiding the formation of a metal silicide in the edge region of the substrate. For this purpose, a dielectric protection layer may be selectively formed in the edge region prior to a corresponding pre-clean process or immediately prior to deposition of the refractory metal. Hence, non-reacted metal may be efficiently removed from the edge region without creating a non-desired metal silicide. Hence, the further processing may be continued on the basis of enhanced process conditions for forming interlayer dielectric materials.

Techniques for improving the design of circuits, such as integrated microcircuits. A proposed circuit design is analyzed to identify design features associated with yield loss in manufactured circuits. Corrective design changes that will reduce the yield losses associated with the yield loss features then are designated. Once the corrective design changes have been determined, the corrective design changes that will optimize the manufacturing yield of the circuit are selected and incorporated into the circuit design. This analysis and revision process may then be repeated for each revised circuit design, until no further reduction in the manufacturing can be obtained.

By providing a protection layer at the bevel region, the deposition of polymer materials during the patterning process of complex metallization structures may be reduced. Additionally or alternatively, a surface topography may be provided, for instance in the form of respective recesses, in order to enhance the degree of adhesion of any materials deposited in the bevel region during the manufacturing of complex metallization structures. Advantageously, the provision of the protection layer providing the reduced polymer deposition may be combined with the modified surface topography.

A method and structure for producing lasers having good optical wavefront characteristics, such as are needed for optical storage includes providing a laser wherein an output beam emerging from the laser front facet is essentially unobstructed by the edges of the semiconductor chip in order to prevent detrimental beam distortions. The semiconductor laser structure is epitaxially grown on a substrate with at least a lower cladding layer, an active layer, an upper cladding layer, and a contact layer. Dry etching through a lithographically defined mask produces a laser mesa of length lc and width bm. Another sequence of lithography and etching is used to form a ridge structure with width w on top of the mesa. The etching step also forming mirrors, or facets, on the ends of the laser waveguide structures. The length ls and width bs of the chip can be selected as convenient values equal to or longer than the waveguide length lc and mesa width bm, respectively. The waveguide length and width are selected so that for a given defect density D, the yield YD is larger than 50%.

The invention provides a formulation composite comprising toxic fluoride phosphate and at least one growth regulator. According to the weight part, the toxic fluoride phosphate accounts for 10%-80% of the formulation composite, the growth regulator accounts for 0.0001%-2% of the formulation composite, the formulation composite also comprises an assistant, an surface active agent, a solvent and a carrier accepted by agriculture, and the formulation composite can be prepared into wettable powder, suspending agent, missible oil, microemulsion, emulsion in water, water dispersible granule, dry suspending agent, seed coating agent and other agents. The formulation composite can be used for preventing and curing tobacco mosaic virus, cucumber mosaic virus, and various virus diseases caused by viruses on rice, such as tobacco mosaic, cucumber mosaic, tomato virus disease, pepper virus disease, rice virus disease and the like and achieves the effects of improving efficacy, treating in a compatible manner, delaying medicine resistance, reducing the using amount of toxic fluoride phosphate and the like.

The invention discloses bacillus velezensis (Bacillus velezensis) for preventing and treating rice blast and the application of the bacillus velezensis, and belongs to the technical field of microorganisms. The bacillus velezensis (Bacillus velezensis) E69 disclosed by the invention is preserved in China General Microbiological Culture Collection Center (CGMCC) of China Committee for Culture Collection of Microorganisms, the preservation date is 5 September, 2018, and the preservation number is CGMCC NO.16427. The bacillus velezensis E69 provided by the invention can prevent and treat rice blast of rice, the new field of application of the bacillus velezensis is opened up, and the bacillus velezensis has good preventing effects on the rice blast of the rice, has significant bacterium restraining effects on various plant pathogenic bacteria, is high in preventing and treating efficiency, has good effects of preventing and treating the rice blast of the rice having different varieties inthe south and the north of China, and can reduce the yield loss of rice industry caused by plant diseases which arise suddenly near the collection period of the rice to a larger extent.

A method for manufacturing a solar cell from a semiconductor substrate (1) of a first conductivity type, the semiconductor substrate having a front surface (2) and a back surface (3). The method includes in a sequence: texturing (102) the front surface to create a textured front surface (2a); creating (103) by diffusion of a dopant of the first conductivity type a first conductivity-type doped layer (2c) in the textured front surface and a back surface field layer (4) of the first conductivity type in the back surface; removing (105; 104a) the first conductivity-type doped layer from the textured front surface by an etching process adapted for retaining texture of the textured front surface; creating (106) a layer of a second conductivity type (6) on the textured front surface by diffusion of a dopant of the second conductivity type into the textured front surface.

A circuit board assembly comprising a laminate substrate and a surface mount device having a CTE less than that of the laminate substrate and attached with at least one solder joint to a first surface of the laminate substrate. The assembly further includes a localized stiffener attached to a second surface of the laminate substrate so as to be directly opposite the circuit device. The localized stiffener is formed of a material and is shaped so that, when attached to the laminate substrate, the stiffener is capable of increasing the thermal cycle fatigue life of the one or more solder joints that attach the device to the substrate.

Firstly encapsulated wafer and component wafere are provided, and the frontispiece of the encapsulated wafer possesses many cavities and grooves. Then the encapsulated wafer and component wafere are jointed, and the first incising craft is preceded. Then the adhesion layer is adhibited to the encapsulated wafer, the second incising craft is preceded and the adhesion layer is removed to form the wafer-class encapsulation structure. At last, the wafer-class encapsulation structure is incised into several encapsulated cores.

A TMR sensor and a CPP GMR sensor all include a free layer that is of the form CoFexBy / non-magnetic layer / NiFez or of the form CoFe / CoFeB / non-magnetic layer / NiFe, where, in one embodiment, the thickness of the non-magnetic layer is less than approximately 15 angstroms and the atom percentage x, z of Fe can vary between 0 and 70% for x and 0 and 100% for z and the atom percentage, y, of B can vary between 0 and 30%. This arrangement can produce a 5-10% improvement in dR / R and can allow the coupling field between the CoFeB and the NiFe to be strong enough that an in-stack biasing of the CoFeB layer occurs and the hysteresis behavior and stability of the sensor is improved.

A method of making an electronic assembly comprising an electronic component that is attached to a circuit board by protruding solder bumps of the electronic component places the electronic component on a surface of the circuit board so that solder bumps on the bottom of the electronic component engage contact pads on the top of the circuit board. The solder bumps are then reflowed to attach the electronic component to the circuit board after which the electronic component is underfilled by providing a mold die having a mold cavity, a gate leading into the mold cavity and a vent leading out of the mold cavity. The mold die is placed over the electronic component and onto the surface of the circuit board so that the electronic component is inside the mold cavity and the mold cavity is sealed. An encapsulating material, preferably an epoxy material, is transferred or injected into the mold cavity to fill space between the respective surfaces of the electronic component and the circuit board and then cured to encapsulate the solder bumps that have been reflowed. An optional integrated heat sink for the electronic component may be used when practicing the method of the invention to make an electronic assembly.

Cumene production methods are disclosed, based on the alkylation of benzene with propylene, in which byproducts of the alkylation reaction are advantageously reduced to achieve a high cumene selectivity. This may be attained by (i) reducing the portion of the total alkylation effluent that is recycled, after cooling, to the alkylation reaction zone for quenching or direct heat exchange and / or (ii) reducing the benzene:propylene molar ratio of the alkylation feedstock. To manage the temperature differential across catalyst bed(s) in the alkylation reaction zone, indirect heat exchange may be used to remove heat.

Disclosed is a method for replacing an upper anchor cable of mooring anchor legs. The method includes 1), arranging a plurality of limiting tugs on the stem of a floating production storage and offloading oil tanker; 2), mounting protractors on the mooring anchor legs; 3), descending a tensioner to the sea floor and then tightening an anchor chain; 4), cutting a loosened anchor chain ring; 5), demounting the tensioner; 6), regulating heading of the oil tanker to be perpendicular to the anchor legs; 7), uplifting the upper anchor cable; 8), demounting an old upper anchor cable section head; 9), pulling a new upper anchor cable section head to the bottom of a single point; 10), mounting the new upper anchor cable section head; 11), connecting the new upper anchor cable section head with one section of the anchor chain to form a complete anchor leg; 12), releasing an underwater hydraulic tensioner steel strand to a natural state and demounting the same; 13), remeasuring water entry angle of the anchor legs and water depth and position of an lower anchor cable section head of the anchor legs. By the application of the method, all construction work like recycling the old anchor cable and mounting the new anchor cable are realized under the condition of not releasing the floating production storage and offloading oil tanker; therefore, production efficiency and reliability are improved.

The invention relates to a method for separating and recovering propylene from reaction product of direct oxidation for preparing epoxypropane, which comprises steps as follows: effluent gas containing propylene, propane, methanol, oxygen and carbon dioxide from an epoxypropane separation system enters a propylene absorption tower to contact an absorbent; the absorbent absorbs and remove the propylene and propane in the effluent gas; the effluent gas without the propylene and propane is discharged from the top of the absorption tower; an mixture of the absorbent, propane and propylene enters a desorption tower to be desorbed at high temperature; the absorbent is discharged from the bottom of the desorption tower, is cooled by heat exchange, and returns into the absorption tower for cyclic use; the propylene and propane at the top pf the desorption tower enter a propylene rectification tower to be separated; and the absorbent is one or mixture of more of alcohols, diol ethers and aldehydes. The propylene recovery rate of the method provided by the invention can reach higher than 95%, and the propylene purity can reach higher than 95%. Compared with the existing method, the absorbent does not need rectification or separation, and obviously lowers the operating cost.

The invention discloses an anti-drought, anti-disease and detoxication plant growth and protection chemical, which consists of moisturizing agent, virus tolerance agent, growth accelerating agent, nitrogen synergist, nutrient activating agent, humic acids, nitric acid rare earths and medium microelement; the moisturizing agent which undergoes the copolymerization reaction, decompression and drying processes is evenly mixed with other constituents according to a certain percentage, then the mixing agent undergoes measuring and packaging processes to become the anti-drought, anti-disease and detoxication plant growth and protection chemical. The invention combines all special activities of all constituents, achieves best comprehensive and balance functions, gives full play to the corresponding united and synergistic effects of all constituents, improves plant physiological functions, boosts plant growth and development, prevents and cures plant diseases, removes toxins from plant body, keeps soil moisture, activates soil nutrients, increases utilization rate of fertilizers, prolongs fertilizer efficiency period and lowers pollution on the environment. The invention is capable of being used with other fertilizers, which resolves the problem of the comprehensive and balance fertilization, creating or improving the living conditions needed for plant growth and protection, lowering costs caused by such harms as drought and diseases etc. and greatly increasing the crop yield.

A radial sawing method for cutting a log into six sections. Each resulting section has a triangular wedge shape, such that in cross-section, an angle of approximately sixty-degrees (60°) at the interior edge of the log section is formed. The approximately 60° angle can be the point of an equilateral triangle. After the log has been formed into six pieces that are relatively equivalent in size and shape, each respective piece can then be fed into additional sawing machines for additional processing, such as to form symmetrically shaped pieces, include a circle, a square, a hexagon, an octagon, or other polygon pieces.

An on-chip clock controller includes a clock-control chain configured to shift first clock-control bits in serial and output the first clock-control bits to a first clock domain in parallel in response to a clock-control scan clock provided from outside of a chip, and a first domain clock generator, the first domain clock generator configured, during a test mode, to generate a first internal clock by selectively outputting a first data scan clock provided from outside of the chip or a first functional clock generated from inside of the chip.

The invention belongs to the technical field of non-point source pollution control, and discloses a method for controlling the non-point source pollution of paddy field, artificial paddy wetland system, and a paddy field wetland system for improving the P and N utilization rate of paddy field. The system structure uses the paddy field as the upper stream, and a paddy field wetland is constructed in the drainage downstream of the paddy field along the river. The surface of the paddy field wetland soil is 25-32cm lower than surface of the paddy field soil, and the area of the paddy field wetland is 3%-5% of the paddy field; the paddy filed wetland and paddy field are separated by the isolation ridge; paddy field ridges are around the paddy field, and paddy field wetland ridges are around the paddy field wetland; an irrigation ditch is arranged along one side of the paddy field and the paddy field wetland, and a drainage ditch is arranged on the other side. The method uses the paddy field to block, absorb and utilize the pollutant substances in the water, in order to reduce the pollutant substances in the output water; the paddy rice planted in the paddy field wetland uses the N, P and other elements in the drain away water from upstream paddy field as the source of nutrients, so as to increase the utilization rate of N and P in the paddy field.

A method and structure for producing lasers having good optical wavefront characteristics, such as are needed for optical storage includes providing a laser wherein an output beam emerging from the laser front facet is essentially unobstructed by the edges of the semiconductor chip in order to prevent detrimental beam distortions. The semiconductor laser structure is epitaxially grown on a substrate with at least a lower cladding layer, an active layer, an upper cladding layer, and a contact layer. Dry etching through a lithographically defined mask produces a laser mesa of length lc and width bm. Another sequence of lithography and etching is used to form a ridge structure with width won top of the mesa. The etching step also forming mirrors, or facets, on the ends of the laser waveguide structures. The length ls and width bs of the chip can be selected as convenient values equal to or longer than the waveguide length lc and mesa width bm, respectively. The waveguide length and width are selected so that for a given defect density D, the yield YD is larger than 50%.

The invention provides a white balance adjusting method which comprises the steps that S1, the white balance value of a standard sample is input to a display panel; S2, the display panel is controlled to display a testing picture with different gray levels, and the full-gray-scale data of the display panel is acquired; S3, whether the acquired data are within a specification range is judged, if yes, the next manufacture procedure is executed, and if not, the step S4 is executed; S4, the white balance value is calculated again according to the difference value of the acquired full-gray-scale data and the full-gray-scale data of the standard sample, the calculated white balance value is input to the display panel, and the step S2 is executed again. According to the white balance adjusting method, white balance can be quickly and accurately adjusted, different modules are made to have the same visual performance, and yield loss caused by overspecification of gamma and chromaticity is reduced.