[Problem] One of the objects of the present invention is to provide a liquid addition-curable fluorosilicone composition that has a low
compression set value after heating and curing, retains
mechanical strength, and in particular, is suitably applied to injection molding. Further, the object of the present invention is to provide a fluorosilicone rubber obtained by heating and curing aforesaid composition, and a molded article of the fluorosilicone rubber. [Solution] An addition-curable fluorosilicone composition in a form of liquid at 23 °C, comprises (A) an organopolysiloxane represented by the following general formula (1) and having a
viscosity at 25 °C of 100 to 500,000 mPa·s, wherein R1 is, independently of each other, a group selected from the group consisting of an
alkyl group having 1 to 8 carbon atoms, an
aryl group having 6 to 12 carbon atoms, and an aralkyl group having 7 to 12 carbon atoms, x is an integer of 1 to 10, m is an integer of 0 to 100, and n is an integer of 1 to 800, provided that 5 <= m + n <= 800; (B) an organohydrogenpolysiloxane having two or more
hydrogen atoms each bonded to a
silicon atom per one molecule, in an amount such that the number of
hydrogen atoms bonded to a
silicon atom in Component (B) is 0.5 to 10, per one vinyl group bonded to a
silicon atom in Component (A); (C) an addition-reaction catalyst in a catalytic amount; and (D) a reinforcing silica filler agent, a surface of which being treated with an
organosilicon compound represented by the following general formula (2): wherein R3 is, independently of each other, a group selected from the group consisting of an
alkyl group having 1 to 8 carbon atoms, an
aryl group having 6 to 12 carbon atoms, and an aralkyl group having 7 to 12 carbon atoms, R2 is, independently of each other, a group defined for R3 or a 3,3,3-trifluoropropyl group, provided that at least one R2 is a 3,3,3-trifluoropropyl group, and p is an integer that satisfies equation 1 <= p <= 20, in an amount of 10 to 60 parts by
mass, relative to 100 parts by
mass of Component (A).