Resin composition for copper foil-clad base plate in high-frequency and high-speed field and application thereof

A technology of copper clad substrate and resin composition, which is applied in the direction of lamination, layered products, metal layered products, etc., can solve the problems of poor processability, insufficient resin fluidity, large molecular weight, etc., and achieve low loss factor, excellent Effect of low dielectric constant and high heat resistance

Active Publication Date: 2017-04-26
SOUTH CHINA INST OF COLLABORATIVE INNOVATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polyphenylene ether resin has excellent dielectric properties and good heat resistance, but its large molecular weight, insufficient resin fluidity, and poor processability limit its large-area application in copper clad laminates.

Method used

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  • Resin composition for copper foil-clad base plate in high-frequency and high-speed field and application thereof
  • Resin composition for copper foil-clad base plate in high-frequency and high-speed field and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] In this embodiment, a resin composition for copper-clad substrates in the high-frequency and high-speed field is prepared by stirring 65 wt% of active ingredients and 35 wt% of solvent (butanone) through a disperser, and the active ingredients include the following weight Parts of raw materials: 20 parts of terminal allyl polyphenylene ether (weight average molecular weight is 2000), 20 parts of styrene, 15 parts of TAIC, 5 parts of petroleum resin C5, 12 parts of decabromodiphenylethane, 1 part of di Cumene and 27 parts of microsilica.

[0025] Use 2116 glass fiber cloth to impregnate the above resin composition, and bake at 125°C for 190s to make a prepreg. The resin content of the prepreg was 50%, and the resin fluidity was 20%.

[0026] Take 6 pieces of prepreg and stack them up, with 1HZ electrolytic copper foil on both sides, then clamp them between two steel plates, place them in a vacuum press, and heat them at 200°C and 35kg / cm 2 Under the conditions of hot p...

Embodiment 2

[0028] In this embodiment, a resin composition for copper-clad substrates in the high-frequency and high-speed field is prepared by stirring 70wt% active ingredients and 30wt% solvent (butanone) through a disperser, and the active ingredients include the following weight Parts of raw materials: 15 parts of terminal allyl polyphenylene ether (weight average molecular weight is 2000), 25 parts of styrene, 10 parts of TAIC, 10 parts of petroleum resin C5, 12 parts of decabromodiphenylethane, 1 part of di Cumene and 27 parts of microsilica.

[0029] Use 2116 fiberglass cloth to impregnate the above resin composition, and bake at 125°C for 180s to make a prepreg. The resin content of the prepreg was 50%, and the resin fluidity was 20%.

[0030] Take 6 pieces of prepreg and stack them up, with 1HZ electrolytic copper foil on both sides, then clamp them between two steel plates, place them in a vacuum press, and heat them at 200°C and 35kg / cm 2 Under the conditions of hot pressing ...

Embodiment 3

[0032] In this embodiment, a resin composition for copper-clad substrates in the high-frequency and high-speed field is prepared by stirring 65 wt% of active ingredients and 35 wt% of solvent (butanone) through a disperser, and the active ingredients include the following weight Parts of raw materials: 25 parts of terminal allyl polyphenylene ether (weight average molecular weight is 2000), 10 parts of styrene, 20 parts of TAIC, 5 parts of petroleum resin C5, 12 parts of decabromodiphenylethane, 1 part of di Cumene and 27 parts of microsilica.

[0033] Use 2116 glass fiber cloth to impregnate the above resin composition, and bake at 125°C for 200s to make a prepreg. The resin content of the prepreg was 50%, and the resin fluidity was 20%.

[0034] Take 6 pieces of prepreg and stack them up, with 1HZ electrolytic copper foil on both sides, then clamp them between two steel plates, place them in a vacuum press, and heat them at 200°C and 35kg / cm 2 Under the conditions of hot p...

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Abstract

The invention belongs to the technical field of polymer composite materials, and particularly relates to a resin composition for a copper foil-clad base plate in the high-frequency and high-speed field and application thereof. The resin composition is prepared from 55 to 70 weight percent of active ingredients and 30 to 45 weight percent of solvents, wherein the active ingredients comprise the following raw materials in parts by weight: 15 to 45 parts of modified polyphenyl ether resin, 10 to 50 parts of cross-linking agents, 5 to 30 parts of TAIC, 5 to 20 parts of hydrocarbon resin, 10 to 15 parts of fire retardants, 0.5 to 2 parts of initiators and 15 to 30 parts of inorganic fillers. The obtained resin composite with various excellent properties can be applied to the preparation of high-performance copper-clad plates; and the copper-clad plates have the excellent dielectric property and high temperature-resistant performance, soldering-tin-resistant performance, heat-resistant performance and high glass transition temperature.

Description

technical field [0001] The invention belongs to the technical field of polymer composite materials, and in particular relates to a resin composition for copper-clad substrates in the high-frequency and high-speed field and its application. Background technique [0002] With the rapid development of electronic information technology, especially the high frequency and high speed of signal transmission, the quality requirements of signal transmission are getting higher and higher. It is required that the signal transmission speed should be as fast as possible and the signal transmission loss should be as small as possible. Copper clad laminates are required to have higher high frequency characteristics, lower dielectric constant and dielectric loss. [0003] Traditional epoxy resins have been difficult to meet the high requirements for heat resistance, mechanical properties, processability, and electrical properties of copper-clad laminates in the high-frequency and high-speed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08L57/02C08K7/14C08K5/03C08K3/36C08F283/06B32B37/10B32B37/06B32B17/06B32B17/04
CPCB32B15/14B32B37/06B32B37/10B32B2260/021B32B2262/101B32B2307/306C08F283/065C08L51/08C08L2201/08C08L2203/20C08L57/02C08K7/14C08K5/03C08K3/36
Inventor 周俊文马文石吴力
Owner SOUTH CHINA INST OF COLLABORATIVE INNOVATION
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