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Method for rapidly preparing one-dimensional linear welding point of Cu6Sn5 intermetallic compound at low temperature

An intermetallic compound and linear welding technology, which is applied in metal processing equipment, welding media, manufacturing tools, etc., can solve the problems of long solder joint formation time, complicated preparation process, and high welding temperature, and achieve shortened preparation time, simple process, The effect of omitting process steps

Inactive Publication Date: 2018-12-07
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Currently, the preparation of Cu 6 sn 5 Intermetallic compound solder joints face a series of difficulties: complex preparation process, high soldering temperature, long solder joint formation time, and high preparation cost

Method used

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  • Method for rapidly preparing one-dimensional linear welding point of Cu6Sn5 intermetallic compound at low temperature
  • Method for rapidly preparing one-dimensional linear welding point of Cu6Sn5 intermetallic compound at low temperature
  • Method for rapidly preparing one-dimensional linear welding point of Cu6Sn5 intermetallic compound at low temperature

Examples

Experimental program
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example 1

[0025] Example 1: Combining the following Figure 1-3 Embodiments of the present invention will be described in detail.

[0026] 1. Cut copper with a purity greater than 99.99wt.% into copper rods with a size of 800μm×800μm×20mm by wire cutting;

[0027] 2. Use No. 2000 sandpaper to polish the copper rod used in the experiment, combine figure 1 ;

[0028] 3. Put the polished copper rod into acetone solution and 30vol.% nitric acid aqueous solution for ultrasonic cleaning for 8 minutes to remove organic pollutants and oxides on the surface of the copper rod, then take out the copper rod and put it into ethanol solution Wash and dry in

[0029] 4. Weigh 5g of Sn-3.5Ag Lead-free solder paste, the solder paste is composed of alloy and flux, and the flux uses ALPHA FLUX flux. The percentage of SnAg alloy in the solder paste is about 87.4wt.%, m 1 =4.37g, the flux accounts for about 12.6wt.%, m 2 =0.63g; if the composite solder paste is Sn-3.5Ag-10wt.%Cu, the mass percentage...

example 2

[0037] Example 2: The following specifically sets forth the implementation mode of the present invention,

[0038] Combining the following Figure 4 Embodiments of the present invention will be described. Example 2 is basically the same as the implementation steps 1-3 and steps 5-7 of example 1, except that in step 4, the mass percentage of copper in the composite solder solder paste is 25wt.%, and the specific implementation methods are as follows:

[0039] 1. Weigh 5g of Sn-3.5Ag Lead-free solder paste, the solder paste is composed of alloy and flux, and the flux uses ALPHA FLUX flux. The percentage of SnAg alloy in the solder paste is about 87.4wt.%, m 1 =4.37g, the flux accounts for about 12.6wt.%, m 2 =0.63g; if the composite solder paste is Sn-3.5Ag-10wt.%Cu, the mass percentage of copper powder is 25wt.%, and the mass of copper powder to be added is m 5 =1.46g, in order to ensure that the percentage of the SnAg-Cu alloy in the composite solder paste remains unchange...

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Abstract

The invention discloses a method for rapidly preparing a one-dimensional linear welding point of a Cu6Sn5 intermetallic compound at low temperature, and belongs to the field of material preparation and connection. The method is suitable for preparing the one-dimensional linear welding point of the Cu6Sn5 intermetallic compound. One-dimensional linear copper rods are adopted as a bonding pad; the bonding pad is fixed on a printed circuit board through double faced adhesive tape, a composite brazing filler metal is filled between the two copper rods; and welding are carried out by adopting a lead-free welding system, a one-dimensional linear solder joint is prepared; and grinding and polishing are carried out, so that the one-dimensional linear welding point of the Cu6Sn5 intermetallic compound which can be used for electrical, mechanical and thermal reliability research is obtained. The method can ensure that the rapid preparation of the one-dimensional linear welding point of the Cu6Sn5 intermetallic compound can be carried out under a low-cost and low-temperature condition, the problem of failure caused by anisotropy of Sn-based welding spots can be relieved; and meanwhile, the preparation cost of a traditional intermetallic compound welding spots can be greatly reduced.

Description

technical field [0001] The present invention is low-cost rapid preparation of Cu 6 sn 5 A method for one-dimensional linear solder joints of intermetallic compounds, which belongs to the field of material preparation and connection, and is applicable to the preparation of Cu 6 sn 5 One-dimensional linear solder joints of intermetallic compounds are used in the study of electrical, mechanical and thermal reliability of solder joints. This method can ensure low-cost and rapid preparation of Cu 6 sn 5 The one-dimensional linear solder joints of intermetallic compounds ensure the mechanical properties and dimensions of the butt solder joints, thereby ensuring the stability of the solder joints in the reliability test. Background technique [0002] With the development of electronic packaging technology and the continuous improvement of assembly density, electronic products have to withstand reliability challenges such as high temperature, high current density, and thermal f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/20B23K35/40B23K35/26
CPCB23K1/00B23K1/20B23K35/262B23K35/40
Inventor 郭福田雨马立民王乙舒齐楚晗
Owner BEIJING UNIV OF TECH
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