54results about How to "Thermal resistance" patented technology

The disclosure relates to method and apparatus for isolating sensitive regions of a semiconductor device by providing a thermal path or an electromagnetic shield. The thermal path may include vias having different length, depth and configuration such that the thermal path between the two regions is lengthened. In addition, the vias may be fully or partially filled with an insulating material having defined conductive properties to further retard heat electromagnetic or heat transmission between the regions. In another embodiment, electrical isolation between two regions is achieved by etching a closed loop or an open loop trench at the border of the regions and filling the trench with a conductive material to provide proper termination of electromagnetic fields within the substrate.

A cooling system applying a thermo siphon therein, being superior in energy saving and / or ecology, with an effective cooling, and also an electronic apparatus applying that therein, in particular, for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, comprises a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heats therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof, a condenser 320 for receiving refrigerant vapor from the heat-receiving jacket within a pressure-reduced inner space thereof and for condensing the refrigerant vapor into a liquid by transferring the heats into an outside of the apparatus, a vapor tube 331, and a liquid return tube 332, with applying the thermo siphon for circulating the refrigerant due to phase change thereof, wherein the condenser forms fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

The present invention relates to an LED module for illumination, and more particularly, to an LED module for illumination capable of enhancing light emitting efficiency by having a light emitting structure, in which the thickness of an insulation substrate with an electrode pattern formed on a top portion thereof is minimized, a heat radiation substrate is formed by integrally attaching a radiator to a bottom surface of the insulation substrate, and LED elements are attached to the electrode pattern of the heat radiation substrate through silver epoxy with excellent heat conductivity as an adhesive agent, so that heat generated from the LED elements can effectively radiate through the radiator, white light is effectively generated from the light emitted from the LED elements, and the white light can be emitted to the outside maximally.

Provided is a composite joint comprising a pair of adjoining composite panels disposed in side-by-side arrangement and being generally aligned with one another. Each one of the composite panels has opposing inner and outer face sheets sandwiching a core panel therebetween and includes a ramp portion wherein the composite panel transitions into a reduced thickness solid laminate edge portion. The core panel includes a plurality of cells extending between the inner and outer face sheets. The cells within the ramp portions are substantially filled with a filler material. The cells adjacent to the ramp portions are substantially filled with aerogel. The composite joint further comprises a primary splice plate extending across the solid laminate edge portions of the adjoining composite panels with mechanical fasteners extending through the solid laminate edge portions and passing through the primary splice plate. A layer of thermal barrier compound covers the primary splice plate.

A wearable thermometer patch for continuous wearing by a user includes a circuit substrate that includes an electric circuit, a battery holder mounted in the circuit substrate, and a detachable cover layer on the battery holder. The battery holder can hold a replaceable battery to supply power to the electric circuit. A temperature probe unit in connection with the electric circuit includes one or more temperature sensors in electric connection with the electric circuit in the circuit substrate. The one or more temperature sensors each can measure temperatures near the user's skin to produce one or more temperature values.

A heat-conductive silicone composition comprising (A) a silicone resin, (B) a heat-conductive filler, and (C) a volatile solvent is disposed between a heat-generating electronic part and a heat sink part. It is a grease-like composition at room temperature prior to application to the electronic or heat sink part. It becomes a non-flowable composition as the solvent volatilizes off after application, and this composition, when heated during operation of the electronic part, reduces its viscosity, softens or melts so that it may fill in between the electronic and heat sink parts.

A forward converter comprises a magnetic component with a transformer and a filter output inductor. Also disclosed is a method for assembly of a forward converter. A first and a second U / UR core are arranged to form an O-core. Windings of the transformer are arranged on the O-core. A bobbin-less U / UR core is arranged to abut the O-core, and windings of a filter output inductor are arranged directly on a body section of the bobbin-less U / UR core. Alternatively, windings of the transformer are arranged on a first section of an E / ER core, and windings of the filter output inductor are arranged directly on a second, bobbin-less section of the E / ER core.

An ultrasonic probe suitable for reducing reflected waves returning from a rear surface part to a transducer side, and an ultrasonic diagnostic apparatus. Ultrasonic probe 1 comprises transducer 10 transmitting and receiving ultrasonic waves to and from a subject, a backing material 12 disposed on the rear side of the transducer 10, and heat dissipating block 14 stacked on the backside of the backing material 12. At least one of the backing material 12 and heat-dissipating block 14 comprises void 16 therein. A sound absorbing material 18 is desirably filled in void 16.

A battery charging apparatus for an electric vehicle (EV) or a hybrid electric vehicle (HEV) includes a case chassis, a circuit board and at least one electronic component. The case chassis includes a plurality of side plates, a bottom plate and a receptacle. The circuit board is accommodated within the receptacle of the case chassis. The electronic component includes a passive component body with a plurality of conductive wires and a fixing member for accommodating the passive component body. The conductive wires are electrically connected to the circuit board. The fixing member is fixed on at least one of the side plates and the bottom plate of the case chassis.

A fluorescent light emitting element includes a substrate; a phosphor layer that is provided on the substrate; an adhesive layer that is provided between the substrate and the phosphor layer; and a reflection unit that is provided between the adhesive layer and the substrate or between the adhesive layer and the phosphor layer. The phosphor layer is formed of a sintered body made of a cerium-activated garnet structure phosphor containing 0.05 atm % cerium, and a thickness of the phosphor layer is in a range of 100 μm to 250 μm.

A wearable thermometer patch includes a flexible circuit substrate comprising an electric circuit and an opening, a thermally conductive cup having a bottom portion plugged into the opening and fixed to the flexible circuit substrate, and a temperature sensor inside the thermally conductive cup. The temperature sensor is in thermal conduction with the thermally conductive cup. The temperature sensor is electrically connected to the electric circuit in the flexible circuit substrate.

An LED light bulb has LEDs (32) mounted on a tubular carrier (22) with open ends. The tube (22) functions as a chimney to promote cooling by creating convection currents through the chimney. The cooling can be entirely passive or it may be active by incorporating a fan (50).

A terminal case formed by integrally molding a lead frame and a case that has internally an inner face on which the lead frame is mounted and has externally a step portion fixed to a circuit block having an insulating substrate and semiconductor chips formed on the insulating substrate. An opening portion is formed between the step portion and the inner face so as to extend through them, and the opening portion is filled with an adhesive to bond the insulating substrate to the step portion. Since a connecting area to which a bonding wire of the lead frame is ultrasonically bonded is fixed, it is possible to reduce the bonding failures of the lead frames.

A mechanical assembly for regulating the temperature of an IC-chip in an IC-module includes: a) a heat-exchanger having a first face for contacting a second face on the IC-module; and b) a gimbal, coupled to the heat-exchanger, for tilting and pressing the first face flatly against the second face, as the first and second faces are moved from a spaced-apart position to an engaged position at which the IC-chip temperature is regulated. In addition, the mechanical assembly further includes an output tube, coupled to an output port on the heat-exchanger, which has two ends that move relative to each other as the first and second faces move from the spaced-apart position to the engaged position; and, this output tube is coiled into a weak spring which is characterized by a stiffness matrix that is limited by a predetermined acceptance criterion.

A plurality of carbon fibers having a surface having a metal-plated layer (Cu-plated layer) are stood vertically on a flat plate-like provisional substrate by electrostatic flocking, and one end of the carbon fibers is provisionally adhered to the provisional substrate with an adhesive. The other end of the carbon fibers which is not provisionally adhered is contacted with a substrate (Cu plate) having a surface coated with a solder paste and, in this state, a brazing material (solder) is melted and cooled, and carbon fibers and a substrate are brazed (soldered). After completion of mechanical and thermal connection between the substrate and the carbon fibers, this is immersed in an organic solvent, and the provisionally adhered provisional substrate is peeled from the carbon fibers to manufacture a radiating fin.

The invention proposes a printed circuit board with multiple layers, which features at least one outer layer and at least one inner layer adjacent to the outer layer. The printed circuit board features a plurality of micro-through-holes, which are formed between a supply voltage area of at least one outer layer and a supply voltage area of at least one inner layer.

A wearable thermometer patch includes a substrate and a temperature probe unit mounted in the substrate and configured to measure temperature of a user's skin. The temperature probe unit includes a force sensor configured to measure contact force between the temperature probe unit and the user' skin, a plate, a first temperature sensor attached to a lower surface of the plate, and a second temperature sensor attached to an upper surface of the plate.

A battery pack includes a thermally conductive plate that can be cooled or heated, and an array of electrochemical cells. The cells include a stacked or rolled arrangement of electrode plates, and a current collector disposed in the battery cell that forms an electrical connection with the electrode plates and provides a thermal conduction pathway for conducting heat from the electrode plates to the thermally conductive plate.

The invention proposes a printed circuit board with multiple layers, which features at least one outer layer and at least one inner layer adjacent to the outer layer. The printed circuit board features a plurality of micro-through-holes, which are formed between a supply voltage area of at least one outer layer and a supply voltage area of at least one inner layer.

A technique which is suitable in joining an end surface of a laser medium to a transparent heat sink for maintaining thermal resistance therebetween low and avoiding large thermal stress from acting on the laser medium is to be provided. An end coat is provided on the end surface of the laser medium, a same-material layer constituted of a same material as the heat sink is provided on a surface of the end coat, a surface of the same-material layer and an end surface of the heat sink are activated in a substantially vacuum environment, and those activated surfaces are bonded in the substantially vacuum environment. A laser apparatus having low thermal resistance between the laser medium and the heat sink and high transparency at a joint interface therebetween, and no large thermal stress acting on the laser medium is thereby obtained.

An electronic device includes a heating structure including a sub-mount for mounting an LED chip thereon, a first solder layer for bringing the LED chip and the sub-mount into junction and a heat releasing structure including a first metal layer and a graphite layer stacked onto the first metal layer, wherein the heating structure is mounted on the graphite layer side of the heat releasing structure. The electronic device includes a second metal layer being present on a plane in the graphite layer opposite to a plane where the first metal layer is stacked; and the second metal layer and the sub-mount are brought into junction with a second solder layer so that the heating structure and the heat releasing structure are thereby brought into junction.

A brushless motor according to the present invention is provided with: a tubular stator case; a stator core fitted into the stator case; and a rotor rotatably supported via a bearing inside the stator core, wherein: an inner flange portion which extends radially inward is formed at a peripheral edge of an opening of one end of the stator case; and a bracket is fixed to the inner flange portion while contacting therewith so as to close the opening.

A wearable thermometer patch includes a substrate and a temperature probe unit mounted in the substrate and configured to measure temperature of a user's skin. The temperature probe unit includes a force sensor configured to measure contact force between the temperature probe unit and the user' skin, a plate, a first temperature sensor attached to a lower surface of the plate, and a second temperature sensor attached to an upper surface of the plate.

A heat dissipating device which dissipates heat generated by a heat generating object mounted on a base includes a heat sink body, a heat-conducting area, a tip portion, an inclined surface, and a fastener. The heat-conducting area includes the tip portion, which is a substantially middle portion of the heat-conducting area and is arranged substantially closest to the heat generating object among the other areas of the heat-conducting area, and the inclined surface which is a part of the heat-conducting area and inclines outwardly from the tip portion such that a distance between the inclined surface and the heat generating object gradually increases. The fastener includes an attaching portion to mount the heat dissipating device to the base, and the attaching portion is arranged substantially radially outside of an outer peripheral portion of the heat generating object. When the attaching portion is secured to the base, the tip portion of the heat-conducting area is pressed to the heat generating object.

A power module comprises a first circuit board assembly, a second circuit board assembly and a magnetic assembly. The first circuit board assembly comprises a first printed circuit board and at least one power circuit. The second circuit board assembly comprises a second printed circuit board and at least one output capacitor. The magnetic assembly is located between the first circuit board assembly and the second circuit board assembly and comprises a magnetic core module and at least one first electrical conductor. The magnetic core module comprises at least one hole. The at least one first electrical conductor passes through the corresponding hole of the magnetic core module to define at least one output inductor. Each of the at least one output inductor is electrically connected with the corresponding power circuit and the at least one output capacitor so that the power module forms at least one phase converter.