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Process and apparatus for producing highly wear resistant diamond cutting wires

A high wear resistance, diamond technology, applied in the direction of metal sawing equipment, metal processing equipment, metal material coating technology, etc., can solve the problem of difficult production of diamond wire, inability to cut crystals, uniform thickness of diamond coating diameter and Uneven wire diameter and other problems, to achieve the effect of good wear resistance, low cutting cost and high quality

Inactive Publication Date: 2003-11-19
江晓平 +2
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, the diameter of the diamond coating prepared by this process is uniform and the thickness and wire diameter are not uniform. It is difficult to produce a diamond wire longer than 120 meters, and it is impossible to cut crystals with a diameter larger than 6″.

Method used

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  • Process and apparatus for producing highly wear resistant diamond cutting wires
  • Process and apparatus for producing highly wear resistant diamond cutting wires
  • Process and apparatus for producing highly wear resistant diamond cutting wires

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Embodiment Construction

[0016] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0017] like figure 1 Shown is the working principle of the indenter die (3).

[0018] Firstly, a steel wire (1) with a diameter of 0.1-1 mm is selected according to cutting requirements, and the material of the steel wire (1) can be carbon steel or stainless steel. In order to improve the diamond setting strength, it is better to use steel wires with copper or nickel plating on the surface. Secondly, diamond particles (2) with an appropriate average diameter are selected according to the diameter of the steel wire (1). Generally, the diameter of the diamond particles (2) should not be greater than 1 / 2 of the wire diameter of the steel wire. If a steel wire of 0.1mm is selected, diamond particles with a particle size of 10 μm can be selected, and a metal coating of 1 μm is coated on the diamond particles at the same time. The metal coating can be nickel or copper. ...

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Abstract

A technology and apparatus for manufacturing the antiwear combined cutting diamond wire features that the diamond microparticles are inlaid in the subsurface of steel wire by squeezing or punching. Its advantages are long length up to 60 km, uniform diameter, and high antiwear performance and tension strength.

Description

Technical field: [0001] The invention relates to a process and equipment for cutting crystals, in particular to a process and equipment for producing high wear resistance diamond composite cutting microwires. Background technique: [0002] With the continuous development of the factory industry, the growth diameter of semiconductor crystals, such as single crystal silicon, single crystal germanium, gallium arsenide, and photoelectric crystals, such as lithium niobate and quartz, continues to increase. How to cut these brittle and Precious crystals have become a crucial issue in crystal processing. [0003] The traditional method of cutting crystals is to use diamond internal circular saw blades. This method can only cut crystals with a diameter less than 6 inches in one piece, and the saw blade is thicker, resulting in large crystal loss and low efficiency. In recent years, a multi-knife wire cutting machine has been developed abroad, which uses reciprocating motion of smo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21C23/22B23D61/18C23C2/38
Inventor 江晓平张革赵洪生
Owner 江晓平
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