Diamond fretsaw cutting method and device

A diamond wire saw and cutting equipment technology, applied in stone processing equipment, fine working devices, manufacturing tools, etc., can solve the problem of low cutting speed, achieve fast cutting efficiency, fast cutting efficiency and accuracy, and save costs Effect

Active Publication Date: 2013-09-18
CHINA NONFERROUS METAL (GUILIN) GEOLOGY & MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using high-strength steel wire as the matrix material, the diamond is uniformly consolidated on it, and the particle size of the diamond particles is between 20 microns and 120 microns, but due to the limitation of the technology itself, the cutting speed is still low

Method used

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  • Diamond fretsaw cutting method and device
  • Diamond fretsaw cutting method and device
  • Diamond fretsaw cutting method and device

Examples

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Embodiment Construction

[0028] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings.

[0029] The diamond wire saw cutting equipment of the present invention includes an annular diamond wire saw 1 (a diamond wire formed by solidifying diamond on the surface of an annular steel wire by means of electroplating or resin coating), a wire saw operating mechanism and a wire saw feeding device, The workbench 5 carrying the crystal ingot workpiece 2, the workbench horizontal feed mechanism, the base 20 and the frame.

[0030] Described frame is made of two vertical guide rails 6 and crossbeam 21, and described vertical guiderail 6 is fixed and upright on the base 20, and described crossbeam 21 is straddled on two vertical guide rails 6 and is fixed, and uses the auxiliary positioning of diagonal tie rod 22; The vertical guide rail 6 is equipped with a slide block 23, and a truss 24 is connected between the two slide blocks 23, and a lif...

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Abstract

The invention discloses a diamond fretsaw cutting method and device. An annular diamond fretsaw is used for cutting a crystal ingot workpiece; the annular diamond fretsaw surrounds a plurality of horizontal guide wheels and is tensioned by a tension mechanism; under the driving of one of the guide wheels, namely, a driving wheel, the annular diamond fretsaw operates at a high speed; under the driving of a lifting mechanism, the annular diamond fretsaw is fed to a crystal ingot cutting workpiece and retracts upward; and in a cutting process of the annular diamond fretsaw, the crystal ingot workpiece is driven by a rotary mechanism to rotate uni-directionally around a shaft of the workpiece. According to the method and the device, the annular diamond fretsaw has a higher linear speed; when a workpiece rotates uni-directionally and continuously, point contacting type cutting between the diamond fretsaw and the crystal ingot workpiece is realized; and diamond particles can be pressed into a cut material more easily, so that the device has a cutting efficiency about ten times of that of the ordinary fretsaw diamond cutting.

Description

(1) Technical field: [0001] The invention relates to a cutting method and equipment for monocrystalline silicon crystals, sapphire crystals and brittle and hard materials, in particular to a diamond wire saw cutting method and cutting equipment. (2) Background technology: [0002] Silicon and sapphire crystals are widely used as substrate materials. With the deepening of the application, the diameter of the produced crystals is getting larger and larger. The existing technology can already produce silicon or sapphire crystal ingots with a diameter of 400 mm or larger. After the crystal ingot is produced, it is first cut to remove the head and tail, and then the crystal ingot is cut into wafers for making chips and other purposes. [0003] There are several conventional methods for cutting crystal ingots, each with advantages and disadvantages. [0004] 1. Use a diamond band saw to cut the crystal ingot. [0005] Due to the inherent characteristics of the diamond band saw i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04
Inventor 陈超王进保张昌龙林峰李东平秦建新肖乐银
Owner CHINA NONFERROUS METAL (GUILIN) GEOLOGY & MINING CO LTD
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