TiAlN/TiAlCN multilayer coating of substrate surface and preparing method thereof

A multi-layer film and coating technology, applied in the direction of coating, metal material coating process, ion implantation plating, etc., can solve the problems of large interlayer thickness, internal stress accumulation, increase of defects, etc., to improve the bonding force, The effect of reducing internal stress accumulation and low internal stress

Active Publication Date: 2011-04-13
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Jeon G.Han et al. prepared TiAlN / TiAlCN multilayer film by cathodic arc ion plating. The longitudinal and transverse impact resistance of the multilayer film is higher than that of TiAlN single layer film. The rate is fast and the interlayer thickness is large. Although the flow of C2H2 and N2 is periodically changed in the opposite direction, the interlayer is still C transition, and no lattice epitaxy is formed between the layers, resulting in the increase of defects in the single layer and the accumulation of internal stress.

Method used

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  • TiAlN/TiAlCN multilayer coating of substrate surface and preparing method thereof

Examples

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Embodiment 1

[0021] Example 1: With Korloy cemented carbide milling cutter as the substrate, the substrate was ultrasonically cleaned with acetone and alcohol water for 15 minutes, dried, placed in the coating cavity, heated, and vacuumed to make the vacuum degree lower than 2×10 -3 Pa, turn on public rotation and rotation.

[0022] (1) Introduce 30 sccm argon gas into the coating chamber to maintain the argon gas pressure at 0.1Pa, maintain the ion source current of the linear anode layer at 2A, apply a pulse bias voltage of -500V on the substrate, and etch the substrate surface for 30 minutes;

[0023] (2) Introduce nitrogen gas with a flow rate of 30 sccm and argon gas with a flow rate of 6 sccm into the coating cavity, keep the partial pressure of nitrogen at 0.5 Pa, the partial pressure of argon at 0.1 Pa, and control the temperature in the cavity at 400 ° C. The transition coating TiN is prepared by pulsed magnetron sputtering technology. The target material is a Ti target with a pur...

Embodiment 2

[0027] Example 2: Take the high-speed steel rotor as the substrate, clean the substrate with degreasing cleaning solution, then ultrasonically clean it with deionized water and acetone for 15 minutes, dry it, place it in the coating cavity, heat it, turn on the motor and rotation, Vacuum to make the vacuum degree below 2×10 -3 Pa.

[0028] (1) Pass 30sccm argon gas into the coating cavity, keep the argon gas pressure at 0.1Pa, maintain the ion source current of the linear anode layer at 2A, apply a pulse bias voltage of -500V on the substrate, and etch the substrate for 30 minutes;

[0029] (2) Introduce nitrogen gas with a flow rate of 30 sccm and argon gas with a flow rate of 6 sccm into the coating cavity, keep the partial pressure of nitrogen at 0.5 Pa, the partial pressure of argon at 0.1 Pa, and control the temperature in the cavity at 400 ° C. The transition coating TiN is prepared by pulsed magnetron sputtering technology. The target material is a Ti target with a pur...

Embodiment 3

[0033] Embodiment 3: This embodiment can be used for anticorrosion of titanium alloys. With titanium alloy blocks as the substrate, the substrate is mirror-polished, cleaned with degreasing cleaning solution, then ultrasonically cleaned with deionized water and acetone for 15 minutes, and dried. Put it in the coating chamber, heat it, turn on the motor and rotate it, and evacuate it so that the vacuum degree is lower than 2×10 -3 Pa.

[0034] (1) Introduce 40 sccm argon gas into the coating chamber to maintain the argon gas pressure at 0.2Pa, maintain the linear anode layer ion source current at 2A, apply a pulse bias voltage of -500V on the substrate, and etch the substrate for 30 minutes;

[0035] (2) Introduce nitrogen gas with a flow rate of 36 sccm and argon gas with a flow rate of 6 sccm into the coating cavity, keep the partial pressure of nitrogen at 0.6Pa, the partial pressure of argon at 0.1Pa, and control the temperature in the cavity at 400°C. The transition coati...

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Abstract

The present invention discloses a TiAlN/TiAlCN multilayer coating of substrate surface and preparing method thereof, wherein a transitional layer is between a substrate and a TiAlN/TiAlCN multilayer coating; the multilayer coating is formed by alternating periodic arrangement of TiAlN films and TiAlCN films; in a period, the thickness sum of the TiAlN films and the TiAlCN films is 1-20 nano; the percentage by weight of C atom in the TiAlCN films is 0.1-5%. The multilayer coating of the present invention has the advantages of high hardness, low internal stress and high tenacity; the cutting efficiency and corrosion resistance of the substrate can be improved, and the service life of the substrate can be prolonged. In the present invention, the multilayer coating is deposited by high power pulse magnetron sputtering technique; the problems that cathode arc ion plating and depositing speed is too fast to prepare a nano epitaxial film and that target poisoning is caused during the procedure for preparing films by DC magnetron sputtering are solved; the nano modulation period is controlled via adjusting the autorotation and revolution speeds of the substrate and adjusting the quantity of targets.

Description

technical field [0001] The invention relates to the technical field of material surface coating, in particular to a TiAlN / TiAlCN multilayer film coating on the surface of a substrate and a preparation method thereof. Background technique [0002] TiAlN coating has high hardness, high wear resistance, good high-temperature oxidation resistance, which greatly improves the efficiency of machining; at the same time, the service life of workpieces with TiAlN coating is longer than that with traditional TiN coating and without coating The workpiece has been greatly improved, so it has been widely used in the field of material surface modification. However, TiAlN as a ceramic material has low toughness due to the limitation of dislocation movement, which limits the preparation of thick films and easily causes the peeling failure of TiAlN coating during mechanical processing. Therefore, the preparation of thicker TiAlN thin films has become the current research and development main...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/06C23C14/35
Inventor 汪爱英陈锋光孙丽丽
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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