Copper and nickel preprocessing technology in ion implantation before polymer surface chemical plating

Abstract

An ion implanted copper, nickel pretreatment process of before polymer surface chemical plating, belongs to pretreating process of polymer surface chemical plating. Adding high molecular polymer into ion implanter, adding electrode to the polymers, switching on the energy injecting switch of the ion implanter, with a accelerating voltage of 10 kV-45 kV, injected dose of 2*10e17-5*10e17ions / cm2. The method combines the ion implantation and chemical plating, adopts injecting metal ion different from or the same as the chemical coating metal, make full use of the advantages of chemical plating and ion implantation, thus creats a uniform coating with small porosity, good appearance, improves bonding tightness of the coating and substrate, has simple process and does not need repeated treatment; there is no plating liquid during the pretreatment Process, no secondary pollution; no noble metals injection, reduces costs, enhances self-catalysis in chemical plating, improves the plating efficiency.

Description

technical field [0001] The invention relates to a pretreatment process for copper plating on the polymer surface, in particular to an ion implantation copper and nickel pretreatment process before electroless plating on the polymer surface. Background technique [0002] Electroless plating is to use the reducing agent in the electroless plating solution to reduce metal ions to metal and deposit them on the surface of the substrate to form a coating. The obtained coating is uniform, has small porosity, good appearance, and the deep plating ability is 100%. The structure can be uniformly plated, so it has become a research hotspot in polymer metallization. However, electroless plating has the following disadvantages in various polymer metallization technologies: First, when plating on a non-catalytic substrate, the substrate needs to be activated by adsorbing catalytic atoms on the surface. However, the currently widely used sensitization-activation method needs to go through...

AI Technical Summary

Problems solved by technology

However, electroless plating has the following disadvantages in a variety of polymer metallization technologies: First, when plating on a non-catalytic substrate, the substrate needs to be activated by adsorbing catalytic atoms on the surface

The above-mentioned pretreatment before electroless plating adopts implanted ions as precious metals, and the activation cost of the plating layer metal is high and wastes precious metals; the pretreatment process using electroless plating method before electroless plating has serious environmental pollution