134results about How to "Less prone to defects" patented technology

A spraycoating device includes at least one coating liquid spray gun (2) which contains a measuring valve device (40) opening or closing a compressed gas measuring valve flow path (42) depending on the positions of a liquid feed valve (4). The measurement of the compressed gas flow allows automatically determining whether the liquid feed valve (4) is situated in a fully close or a fully open position or in an arbitrary intermediate position thereto.

The invention provides a binding agent for powder injection moulding, a preparation method of the binding agent and an application method of the binding agent. The binding agent is mainly prepared from the following components in percentage by mass: 65 to 75 percent of polyformaldehyde, 4 to 9 percent of dioctyl phthalate, 6 to 13 percent of polyethylene, 1 to 3 percent of acrylate copolymer, 3 to 8 percent of polyacrylamide, 1.5 to 4 percent of paraffin, 2 to 6 percent of microcrystalline wax and 0.5 to 2 percent of ethylene vinyl acetate copolymer. In the binding agent provided by the invention, multiple types of components are combined through scientific compatibility, so that the compatibility between metal powder or ceramic powder and the binding agent can be obviously improved, and meanwhile, the binding agent can be quickly removed in a degreasing process without causing the defects of bubbling and cracking of a green body, so as to guarantee the quality of the green body.

The invention relates to a chip-level bottom filling adhesive, which comprises following components by weight percentage: 15 to 50 percent of epoxy resin, 1 to 20 percent of toughening agent, 0.1 to 1 percent of dispersing agent, 0.01 to 1 percent of defoaming agent, 0.8 to 10 percent of cross-linking agent, 0.1 to 0.5 percent of pigment, 40 to 70 percent of filler, 3 to 30 percent of curing agent and 1 to 20 percent of diluting agent. A preparation method of the chip-level bottom filling adhesive comprises the steps that the epoxy resin, toughened resin, the dispersing agent, the defoaming agent, the cross-linking agent and the pigment are weighed according to the proportion, thrown into reaction kettle and mixed to form a homogeneous solution; and afterwards, the filler, the curing agent and the diluting agent are weighed according to the proportion, thrown into the reaction kettle in sequence and evenly mixed with the homogeneous solution, and then the chip-level bottom filling adhesive is obtained. The bottom filling adhesive prepared by adopting the method has the characteristics of low curing shrinkage rate, high reliability, and the like, simultaneously satisfies the requirement of low radioactivity and is suitable for primary high-density packaging of memory chips.

The invention provides an economical seamless oil well pipe for an expansion pipe and a manufacturing method thereof. The oil well pipe comprises the following chemical components in percentage by weight: 0.08 to 0.18 percent of C, 0.2 to 0.5 percent of Si, 0.6 to 1.7 percent of Mn, less than or equal to 0.012 percent of P, less than or equal to 0.005 percent of S, 0.04 to 0.15 percent of V, 0.01to 0.03 percent of Ti and the balance of Fe and inevitable impurities. A heat treatment process in the manufacturing method comprises the following steps of: incompletely quenching a hot-rolled seamless pipe, controlling the temperature of a heating furnace at 750 to 800 DEG C, keeping the temperature of the steel pipe in the range of 30 to 40 DEG C higher than Ac1 and 30 to 40 DEG C lower than Ac3 between the two phase regions of ferrite and austenite, performing calculation at the heat penetration speed of 1mm/min, preserving the heat of the oil well pipes for 10 to 60 min after the hot-rolled oil well pipes with different wall thicknesses reach the temperature of the furnace, and then cooling the oil well pipes at the speed of not higher than 0.2 DEG C per second. In the economical seamless oil well pipe and the manufacturing method thereof, the manufacturability and expandability performance of the steel pipe, the mechanical properties of the expanded steel pipe and the manufacturing cost are taken into account.

The invention specifically relates to a borehole wall stabilizing agent capable of plugging and reinforcing borehole wall rocks, which belongs to the field of oilfield chemistry. The borehole wall stabilizing agent comprises, by weight, 15 to 30% of isophorone diisocyanate, 25 to 60% of polypropylene glycol, 5 to 20% of dimethylolpropionic acid and 10 to 30% of dopamine hydrochloride. The borehole wall stabilizing agent provided by the invention is capable of plugging and cementing micro-cracks near a borehole wall, reducing permeability of shale and bonding with the shale on the borehole wall to form a compound which can harden the borehole wall; molecules of the borehole wall stabilizing agent have a small size, are easy to diffuse and can penetrate into the shale, so bonding among the shale is benefited and bonding capability is enhanced; the borehole wall stabilizing agent is convenient to use, has excellent operation performance, can be cured through heating or at room temperature and meets environmental requirements during outdoor drilling operation; and due to no side reaction during curing, a bonding layer hardly has defects.

Photovoltaic cells are fabricated in which the compositions of the light-absorbing layer and the electron-accepting layer are selected such that at least one side of the junction between these two layers is substantially depleted of charge carriers, i.e., both free electrons and free holes, in the absence of solar illumination. In further aspects of the invention, the light-absorbing layer is comprised of dual-shell passivated quantum dots, each having a quantum dot core with surface anions, an inner shell containing cations to passivate the core surface anions, and an outer shell to passivate the inner shell anions and anions on the core surface.

The present invention relates to a method of forming a three-dimensional memory and a three-dimensional memory. The method includes the steps of: providing a semiconductor structure having a substratelocated on a back side of the semiconductor structure and a first stack located on the substrate, wherein the first stack located on a front side of the semiconductor structure; forming a plurality of first channel holes passing through the first stack from the front side; putting a sacrificial layer in the first channel hole; overturning the semiconductor structure and thinning the substrate; forming a second stack stacked on the first stack from a back side; forming a plurality of second channel holes passing through the second stack and reaching the sacrificial layer; removing the sacrificial layer; and forming a plurality of vertical channel structures in the plurality of first channel holes and the plurality of second channel holes.

The invention relates to a method for preparing perfluorocarboxylic acid ion membranes, which is characterized in that the method comprises the following steps: (1) dissolving perfluorocarboxylic acid resin into a solvent for forming a uniform perfluorocarboxylic acid resin solution A; (2) adding materials with low melting point and high density into a heatable container, heating the container for dissolving the materials, and forming uniform liquid B in the container; (3) preheating the perfluorocarboxylic acid resin solution A and pouring the perfluorocarboxylic acid resin solution A onto the surface of the liquid B protected by nitrogen gas so that a thin layer solution is formed on the surface of the liquid B through casting; (4) heating the liquid B, then carrying out program temperature reduction, and continuously introducing the nitrogen gas for protection in the whole process; and (5) evaporating most or all of the solvent in the perfluorocarboxylic acid resin solution A to obtain the perfluorocarboxylic acid ion membrane on the surface of the liquid B. The perfluorocarboxylic acid ion membrane prepared by the invention can be applied to composite layers of sodium hudroxide use ion membranes, and has the advantages of uniform thickness, difficult bubble generation and stable performance, and the invention provides reliable carboxylic acid layer ion membranes for producing the sodium hudroxide use ion membranes.

The invention provides a manufacturing method of an OLED display substrate. The method comprises the following steps: providing an underlayer substrate; forming a first electrode layer; forming an initial solid buffer layer on the first electrode layer, wherein a molecular formula of a material of the initial solid buffer layer has an azobenzene group, a HOMO energy level of the initial solid buffer layer is between -6eV and 4.5eV, and a LUMO energy level of the initial solid buffer layer is between -3eV and 2eV; illuminating the initial solid buffer layer by utilizing ultraviolet, so that the initial solid buffer layer is liquefied to a liquid buffer layer; illuminating the liquid buffer layer by utilizing visible light, so that the liquid buffer layer is solidified into a final solid buffer layer; and forming a luminescent functional layer by virtue of the final solid buffer layer. The invention also provides an OLED display substrate, an encapsulation method of a display apparatus and a display apparatus. The display apparatus is relatively high in yield.

The invention relates to an active oil-washing sand consolidating agent. The active oil-washing sand consolidating agent is prepared from the following components in percentage by weight: 20 percent to 30 percent of epoxy resin, 5 percent to 15 percent of methacrylic acid, 5 percent to 15 percent of octadecyl methacrylate, 10 percent to 30 percent of ethylene glycol monobutylether, 10 percent to 20 percent of n-butanol, 10 percent to 20 percent of dimethylethanolamine, 5 percent to 7 percent of benzoyl peroxide and 10 percent to 15 percent of de-ionized water. A mixed solution of the n-butanol and the ethylene glycol monobutylether is used for pre-dissolving the epoxy resin, and the octadecyl methacrylate and the methacrylic acid are grafted onto the epoxy resin under the initiation of the benzoyl peroxide; a proper amount of the dimethylethanolamine and the de-ionized water are added to regulate the pH (Potential of Hydrogen), so as to obtain the active oil-washing sand consolidating agent. The active sand consolidating agent provided by the invention can be rapidly cured at a temperature lower than 60 DEG C, and a coupling agent can also be used for enhancing the cohesive property of the resin and a surface of a sandstone, so that the strength of a resin consolidated matter is guaranteed; meanwhile, the active sand consolidating agent has an extremely high oil-absorption capability and the permeability of the consolidated sandstone is kept, so that a stratum structure is stabilized or an artificial borehole wall with certain strength and permeability is formed.

The invention discloses a manufacturing method and a structure for a basement floor without crack, leakage and with an oversized area. According to the method and the structure, disclosed by the invention, a concrete self waterproof floor board layer is firstly poured, and the concrete self waterproof floor layer is poured by adopting leakage resisting concrete; a drain board layer made from high impact polystyrene (HIPS) is paved on the concrete self waterproof floor board layer; then, a plain concrete leveling layer is poured on the drain board layer; a reinforced concrete layer of which the thickness is from 160 to 260mm is poured on the plain concrete leveling layer, the reinforced concrete layer is divided into small integrated reinforced concrete layers by expansion joints, and extruded polystyrene board materials are filled in the expansion joints; a polyurethane coating layer is painted on each small integrated reinforced concrete layer of the reinforced concrete layer, and silicone weather-proof glue is filled in a gap between every two adjacent polyurethane coating layers. The structure has the advantages of difficulty in sinking, no crack, no leakage and the like.

The invention provides the manufacture method of a color filter, the color filter and a liquid crystal display device. The manufacture method of the color filter comprises the steps that a first metal grid layer is formed on a substrate, wherein the first metal grid layer comprises a number of first metal grid electrodes; the first metal grid layer is covered by an insulating layer; a groove is formed in the insulating layer; and a second metal grid layer is formed in the groove, wherein the second metal grid layer comprises a number of second metal grid electrodes. The second metal grid electrodes and the first metal grid electrodes are used to form mutual capacitance used for touch detection. The first metal grid electrodes and the second metal grid electrodes are made of metal, and have lower impedance compared with a touch detection electrode of an ITO material. The noise of touch detection is reduced. The sensitivity of touch monitoring is improved. Compared with the existing color filter manufacture technology, the color filter manufacture method provided by the invention has the advantages of great compatibility, high yield of manufactured color filter and reduced color filter cost.

The invention discloses a bowl type ornament manufacturing method and belongs to the technical field of ornament manufacturing methods. The bowl type ornament manufacturing method mainly comprises the following steps: preparing raw materials, pre-forming, forming, correcting, polishing internal surface, sizing, deburring and polishing external surface, wherein a sizing die is used for sizing, thesizing mold comprises a sizing upper die holder and a sizing lower die holder, the sizing upper die holder is sleeved with a sizing male die, the sizing lower die holder is provided with a sizing female die, an impression die hole is formed on the sizing lower die holder, an impression die is restrained and arranged in the impression die hole, the sizing female die comprises a plurality of femaledie segmental bodies which are arranged in an array around the center of the impression die hole and is arranged on the sizing lower die holder in a way of being capable of sliding along the radial direction of the impression die hole. In the invention, the technical problem of processing workpieces, of which the maximum sizes of the molding cavities are greater than the sizes of openings, by using a drawing die is solved, and the method can be widely used in ornament processing industry.

The invention relates to the technical field of a full-automatic welding method of a circumferential weld of a large-caliber bimetal composite pipe, and discloses a full-automatic argon arc welding method of a circumferential weld of a large-caliber bimetal composite pipe. The method includes the following steps of firstly, making a preparation before welding; secondly, conducting root welding, wherein the root welding is conducted through a full-automatic argon tungsten-arc welding machine in the upward direction from the 6 o'clock position to the 12 o'clock position, the protection gas introduced into a welding gun is argon or mixed gas of argon and helium, the volume percentage of the helium in the mixed gas is 15-20%, the purity of the argon is larger than 99.99%, the purity of the argon for welding is not lower than 99.99%, the dew point is not higher than -50 DEG C, and the oxygen content is not larger than 500 ppm. The method has the advantages that root welding is conducted bymeans of the welding gun small-amplitude swinging process, so the back of the weld is well formed, grasping is easy, and defects can hardly appear; and hot welding and filling welding are conducted through U-type swinging adaptive to the groove type, so an electric arc can more easily reach a groove face, and the side wall non-welding problem easily appearing in an existing welding process is eliminated.

An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.