Chip-level bottom filling adhesive and preparation method thereof

An underfill glue and chip-level technology, which is applied in adhesives, epoxy resin glue, semiconductor/solid-state device components, etc., can solve the problem of unsuitable high-density packaging of memory chips, low radioactivity, and curing shrinkage. Advanced problems, to achieve the effect of low curing shrinkage, small particle diameter and low radioactivity

Inactive Publication Date: 2012-07-11
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, most underfills have disadvantages such as high curing shrinkage rate and low reliability, and are only suitable for secondary packaging. At the same time, the uranium content is relatively hi

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Accurately weigh the following raw materials, alicyclic epoxy resin 5g, polycyclic aromatic epoxy resin 10g, rubber modified resin 1g, BYK-9076 0.1g, BYK-A530 0.1g, β-(3,4- Put 5.3g of epoxycyclohexyl)ethyltrimethoxysilane and 0.5g of carbon black into the reaction kettle and stir for 0.5 to 1 hour to form a homogeneous solution; then weigh 70g of low-radioactive silicon micropowder with an average diameter of Stir in the reaction kettle for 2-4 hours; then weigh 3g of modified amine curing agent, at this time, the temperature is controlled at 20-30°C, put the curing agent into the reaction kettle, stir for 1-2 hours, and mix well; Finally, weigh 5g of neopentyl glycol diglycidyl ether, put it into the reaction kettle, vacuum degree -0.098~-0.095MPa, rotate speed 300~600 rpm, stir for 1~2 hours, form a uniform solution, and obtain the product.

Embodiment 2

[0036] Accurately weigh the following raw materials, polycyclic aromatic epoxy resin 10g, bisphenol A epoxy resin 10g, rubber modified resin 3g, BYK-W9010 0.2g, PC-1344 0.4g, γ-glycidyloxy Put 10 g of propyltrimethoxysilane and 0.4 carbon black into the reactor and stir for 0.5 to 1 hour to form a homogeneous solution, then weigh 50 g of low-radioactive silicon micropowder with an average diameter of 15 microns, put it into the reactor and stir for 2 to 1 hour. 4 hours; then weigh 7g of modified amine curing agent, at this time the temperature is controlled at 20-30°C, put this curing agent into the reaction kettle, stir for 1-2 hours, and mix well; finally weigh 4-tert-butyl Put 9g of phenyl glycidyl ether into the reaction kettle, vacuum degree -0.098~-0.095MPa, rotation speed 300~600 rpm, stir for 1~2 hours, form a homogeneous solution, and obtain the product.

Embodiment 3

[0038] Accurately weigh the following raw materials, alicyclic epoxy resin 15g, phenolic epoxy resin 10g, silicone modified resin 2.5g, BYK-W985 0.15g, PC-1244 0.1g, γ-aminopropyl triethyl Put 5.8g of oxysilane and 0.45 of carbon black into the reactor and stir for 0.5-1 hour to form a homogeneous solution, then weigh 48g of low-radioactive silicon micropowder with an average diameter of 10 microns, put it into the reactor and stir for 2-4 hours ; Then weigh 10g of acid anhydride curing agent, at this time, the temperature is controlled at 20-30°C, put the curing agent into the reaction kettle, stir for 1-2 hours, and mix well; finally weigh the dodecyl to tetradecyl shrink Put 8g of glycerol ether into the reaction kettle, the vacuum degree is -0.098~-0.095MPa, the rotation speed is 300~600 rpm, and it is stirred for 1~2 hours to form a homogeneous solution to obtain the product.

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PUM

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Abstract

The invention relates to a chip-level bottom filling adhesive, which comprises following components by weight percentage: 15 to 50 percent of epoxy resin, 1 to 20 percent of toughening agent, 0.1 to 1 percent of dispersing agent, 0.01 to 1 percent of defoaming agent, 0.8 to 10 percent of cross-linking agent, 0.1 to 0.5 percent of pigment, 40 to 70 percent of filler, 3 to 30 percent of curing agent and 1 to 20 percent of diluting agent. A preparation method of the chip-level bottom filling adhesive comprises the steps that the epoxy resin, toughened resin, the dispersing agent, the defoaming agent, the cross-linking agent and the pigment are weighed according to the proportion, thrown into reaction kettle and mixed to form a homogeneous solution; and afterwards, the filler, the curing agent and the diluting agent are weighed according to the proportion, thrown into the reaction kettle in sequence and evenly mixed with the homogeneous solution, and then the chip-level bottom filling adhesive is obtained. The bottom filling adhesive prepared by adopting the method has the characteristics of low curing shrinkage rate, high reliability, and the like, simultaneously satisfies the requirement of low radioactivity and is suitable for primary high-density packaging of memory chips.

Description

technical field [0001] The invention relates to a chip-level bottom filling glue and a preparation method thereof, which is suitable for bottom filling for chip level packaging and belongs to the field of adhesives. Background technique [0002] With the rapid development of the electronics industry, the closely related electronic packaging technology is becoming more and more advanced. Intelligence, light weight, small size, fast speed, strong function, and good reliability have become the main development trends of electronic products. In order to adapt to the development of this trend, flip-chip technology has been produced. Key benefits of flip-chip include shrinkability and space savings, in addition to shorter and lower inductance interconnect paths, high I / O density, rework and self-alignment capabilities. Flip-chip performance is also outstanding for thermal management. The underfill is one of the key electronic materials required in high-density flip-chip BGA, CS...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J163/04H01L23/29
Inventor 王红娟王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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