68results about How to "Curing shrinkage is small" patented technology

The invention relates to the technical field of epoxy molding compounds, in particular to a low-shrinkage and high-heat-resistance epoxy molding compound and a preparation method thereof. The low-shrinkage and high-heat-resistance epoxy molding compound is prepared from the following raw materials in parts by weight: 6 to 8 parts of epoxy resin, 3 to 7 parts of phenolic resin, 80 to 90 parts of filler, 0.6 to 1 part of modifier, 0.1 to 0.5 part of accelerant, 0.2 to 0.4 part of coupling agent, 0.3 to 0.8 part of flexibilizer, 0.2 to 0.4 part of release agent, 0.2 to 0.4 part of coloring agent and 0.3 to 0.5 part of flame retardant, the modifier is a mixture of 1-phenyl-5-mercaptotetrazole and 5-aminotetrazole according to a weight ratio of 5: (1 to 5); the prepared epoxy molding compound has the characteristics of low shrinkage and high heat resistance.

The invention discloses a high-bending-strength flexible graphite bipolar plate micropore plugging agent which comprises the following components in parts by weight: 20-30 parts of glycidyl ether oxypropyl cyclotetrasiloxane, 70-80 parts of oxetane or alicyclic epoxy resin, 0.1-2.0 parts of a cationic thermal initiator and 0.5-2 parts of a flatting agent, and the sum of the parts by weight of the two is 100. The flexible graphite bipolar plate plugging agent has excellent ethylene glycol resistance due to an organosiloxane structure, and each molecule of glycidyl ether oxypropyl cyclotetrasiloxane contains four epoxy groups capable of being subjected to cationic curing, so that after curing, the flexible graphite bipolar plate plugging agent is high in crosslinking density, good in heat resistance, low in curing shrinkage rate and small in residual stress; compared with a (methyl) acrylate plugging agent, the plugging agent has higher bending strength.

According to the present invention, provided are: a photosensitive resin composition which has low dielectric properties, low curing shrinkage, good storage stability, reduced phase separation during application, and which is capable of forming a cured relief pattern having high resolution and high copper adhesion; a method for producing a cured polyimide film using the photosensitive resin composition; and a cured polyimide film. This photosensitive resin composition contains 100 parts by mass of a copolymer resin containing a polyimide and a polyimide precursor, 0.5-30 parts by mass of a photopolymerization initiator, and 100-1000 parts by mass of a solvent. The copolymer resin has a polyimide block portion having a specific structure and a polyimide precursor block portion, and the copolymer resin containing the polyimide and the polyimide precursor satisfies 0.10 < n2 / (n2 + n3) < 0.90.

The invention discloses an aluminum alloy surface super-amphiphobic coating with durable wear resistance and corrosion resistance and a preparation method of the aluminum alloy surface super-amphiphobic coating, and the coating comprises the following components in parts by weight: 10-15 parts of nanoscale silicon dioxide particles, 10-15 parts of nanoscale titanium dioxide particles, 5-10 parts of polytetrafluoroethylene (PTFE) and an epoxy resin matrix serving as a carrier. The preparation method of the coating comprises the following steps: premixing the raw materials, uniformly depositing the components in the premixed solution on the surface of the aluminum alloy through an electrophoresis method, and drying to form the super-amphiphobic coating. The coating is free of pollution in the production and use processes, a prepared coating is high in crosslinking density and low in curing shrinkage rate and has the characteristics of high wear resistance, high hardness and super hydrophobicity and oleophobicity, meanwhile, the aluminum alloy surface is pretreated, a stable and compact coating film is formed, oxygen can be isolated, the corrosion resistance of the coated surface is improved, and the service life of the coating is prolonged. The coating can continuously protect the coated surface for a long time, and has a wide application prospect.

The application belongs to the technical field of putty, and particularly relates to a high-temperature-resistant CHPO curing putty with good polishing performance and a preparation method thereof. The high-temperature-resistant CHPO curing putty with good polishing performance comprises an A component and a B component. The A component comprises the following raw materials in parts by weight: linseed oil modified unsaturated polyester resin 140-160 parts, oleic acid modified air-drying unsaturated polyester resin 40-60 parts, dicyclopentadiene modified unsaturated polyester resin 90-110 parts, styrene 30-40 parts, drier 5-8 parts, accelerator 0.1-1.2 parts, dispersant 3-5 parts, thixotropic agent 8-12 parts, titanium white powder 12-16 parts, talc powder 400-500 parts, and pre-expanded polymer microspheres 5-10 parts. The application effectively solves the problems of poor polishing performance, poor adhesion to water-based epoxy primer and poor high-temperature resistance of traditional CHPO curing putty.

The invention relates to a conductive composition which comprises dimer acid modified epoxy resin, low-melting-point alloy powder with the melting point range of 240 DEG C or below, silver-coated copper alloy powder with the melting point range of 800 DEG C or above, benzoxazine resin with the viscosity range of 100-400 cps at the temperature of 25 DEG C and reactive epoxy diluent. The dosage range of the low-melting-point alloy powder is 1800-2200 parts by weight, the dosage range of the silver-coated copper alloy powder is 1100-1500 parts by weight, the dosage range of the benzoxazine resin is 35-175 parts by weight, and the dosage range of the reactive epoxy diluent is 30-70 parts by weight. Through mutual cooperation of the components and the dosage ranges thereof, the conductive composition has the advantages of low curing shrinkage rate in the curing process and good heat resistance after curing.

The invention relates to the technical field of high polymer materials, in particular to a high-scratch-resistance UV coating for a furniture film and a preparation method and application of the high-scratch-resistance UV coating. The high-scratch-resistance UV coating for the furniture film comprises a gloss oil component A and a matt oil component B. The gloss oil component A and the matt oil component B are uniformly mixed according to the weight ratio of 100: 50 to obtain the UV coating. PMMA microspheres are adopted and matched with organic silicon modified polyurethane acrylate, under the synergistic effect, the soft, fine and matte effects are achieved, and meanwhile the scratch resistance of the furniture film is greatly improved. The UV coating has better scratch resistance and stain resistance, so that the UV coating can effectively resist scraping and abrasion in daily use and cleaning processes, and the surface of the furniture film is protected from being damaged.

The invention relates to the technical field of adhesives, in particular to an organic silicon modified epoxy adhesive capable of being cured at an ultralow temperature and a preparation method of the organic silicon modified epoxy adhesive. The problems of high viscosity and poor moisture resistance in a low-temperature environment formed by a common technology are solved. The organic silicon modified epoxy adhesive comprises a component A and a component B, the component A accounts for 20-80% of the total mass, and the component B accounts for 20-80% of the total mass. The prepared adhesive is extremely low in viscosity before curing and suitable for normal-temperature even low-temperature rapid potting, the organic silicon epoxy resin in the sealant prepared by the method is preferentially arranged on the surface, the surface energy is reduced, and the moisture resistance of a cured product is improved.

The invention relates to the technical field of battery shell materials, and particularly discloses a high-temperature-resistant fireproof epoxy material for a composite battery shell material. The flame-retardant epoxy resin paint is prepared from the following raw materials: 20-30% of epoxy resin, 5-15% of a diluent, 35-45% of a flame retardant, 10-15% of polyamine, 1-5% of color paste and 1-2% of a release agent. The high-temperature-resistant flame-retardant glass fiber reinforced plastic is good in impact resistance and high temperature resistance, has good mechanical performance and manufacturability, is low in curing shrinkage rate, meets UL 94V0 fireproof combustion performance and is high in glass transition temperature.

The application discloses a resin composition and application thereof, and the resin composition comprises, in terms of solid weight, 10-70 parts of a benzoxazine resin containing unsaturated bonds, and 20-100 parts of a maleimide resin; wherein the benzoxazine resin containing unsaturated bonds is a mixture of a benzoxazine resin containing double bonds and a benzoxazine resin containing triple bonds. Compared with the prior art, the resin composition and application thereof can not only control the reactivity between the maleimide resin and the benzoxazine resin, improve the crosslinking network density, but also is beneficial to controlling the production speed of prepreg, and the prepreg has good apparent quality, and meanwhile has excellent high heat resistance, high modulus, low water absorption, low thermal expansion coefficient and low curing shrinkage.

The invention relates to the technical field of hot melt adhesives, and discloses a preparation method of a hot melt adhesive for an express bag. The hot melt adhesive for the express bag is prepared from the following raw materials in parts by weight: 60 to 80 parts of low-density polyethylene, 10 to 20 parts of modified polyurethane, 15 to 25 parts of styrene-butadiene-styrene thermoplastic elastomer, 5 to 9 parts of polyethylene wax, 8 to 15 parts of reinforcing filler and 0.2 to 0.6 part of antioxidant, low-density polyethylene is used as a main raw material, and modified polyurethane, styrene-butadiene-styrene thermoplastic elastomer, reinforcing filler and other functional aids are added, so that the adhesive property, high temperature resistance, mechanical property and water resistance of a matrix are improved.

The invention belongs to the technical field of organic thin film packaging, and particularly relates to light-curable low-dielectric ink for packaging, a packaging layer and a preparation method of the light-curable low-dielectric ink. Comprising 60%-85% of a fluorine-containing bifunctional monomer, 10%-30% of a monofunctional monomer containing a silyl ether structure, 1%-5% of a bifunctional monomer containing a POSS (Polyhedral Oligomeric Silsesquioxane) structure, 0.1%-6% of a photoinitiator and 0.1%-5% of a photosensitizer. The light-curable low-dielectric ink effectively reduces the dielectric constant of an organic layer and improves the light transmittance and tensile strength, and a packaging layer prepared from the light-curable low-dielectric ink is high in flatness, low in dielectric constant, high in light transmittance and high in tensile strength.

The invention discloses self-lubricating flame-retardant epoxy resin for pultrusion of basalt fibers as well as a preparation method and application of the self-lubricating flame-retardant epoxy resin, and relates to the technical field of high polymer materials. The self-lubricating flame-retardant epoxy resin is prepared from the following raw materials in parts by mass: 100 parts of a phenolic aldehyde modified epoxy resin solution, 0.5-2 parts of a silane coupling agent, 2-8 parts of modified graphite powder, 20-30 parts of modified nano aluminum hydroxide, 0.5-1.0 part of a plasticizer, 0.2-0.8 part of an accelerant and 10-15 parts of a diluent. The modified graphite powder and the modified nano aluminum hydroxide are used as inorganic inert fillers to synergistically modify the epoxy resin, so that the basalt fiber pultrusion sectional material has the characteristics of low friction coefficient, good flame retardance, high strength, good toughness and low shrinkage rate, is simple in preparation process and easy for industrial production, and has wide application prospects in the field of basalt fiber pultrusion sectional materials.

The invention discloses a low-warping-degree copper-clad plate and a preparation process thereof, and belongs to the technical field of copper-clad plates. The low-warping-degree copper-clad plate disclosed by the invention is prepared by the following steps: firstly, completely and uniformly infiltrating glass fiber cloth with a copper-clad plate glue solution, and then drying to obtain a prepreg; stacking a plurality of prepregs which are flat in surface and uniformly coated, attaching copper foils on the upper and lower parts, and performing hot pressing; the copper-clad plate glue solution is characterized by comprising the following raw material components in parts by weight: 80-100 parts by mass of epoxy resin, 44-55 parts by mass of a low-shrinkage curing agent, 1.6-2 parts by mass of an accelerant, 10-30 parts by mass of a flame retardant and 90-110 parts by mass of a solvent.

The invention discloses a preparation method of a negative photoresist patterned film layer, and relates to the technical field of photoresist materials. The preparation method comprises the following steps: 1, sequentially carrying out acid pickling, hydrogen peroxide washing and pure water cleaning on an epitaxial wafer to obtain a pretreated epitaxial wafer; 2, spin-coating negative photoresist on the surface of the pretreated epitaxial wafer; carrying out soft baking, carrying out exposure treatment under the shielding of a mask, and transferring a pattern to the preprocessed epitaxial wafer; and carrying out developing treatment, pure water cleaning and nitrogen drying to obtain the negative photoresist patterned film layer. The negative photoresist is prepared from the following raw material components in parts by mass: 22 to 26 parts of photosensitive polyimide, 4 to 6 parts of POSS (Polyhedral Oligomeric Silsesquioxane)-based branched polyimide, 10 to 12 parts of sulfydryl monomer, 3 to 4 parts of initiator and 108 to 132 parts of organic solvent. According to the invention, the quality of the negative photoresist patterned film layer is effectively improved by optimizing the components and the soft baking and exposure process.

The present invention aims to obtain an active energy ray-curable composition, characterized in that the formed coating film has excellent heat resistance and a high refractive index. As a solution, the present invention provides an active energy ray-curable composition, characterized in that it contains the following (A) and (B), and substantially does not contain a solvent, (A) zirconium oxide fine particles; (B) polysiloxane obtained by acetal-protecting the silanol group of the hydrolysis condensate of alkoxysilane.

The invention provides printing ink and application thereof. The ink comprises a photocuring free radical monomer, a photocuring cationic monomer, a free radical photoinitiator and a cationic photoinitiator, the photocuring free radical monomer comprises a first free radical monomer and a second free radical monomer, the first free radical monomer comprises an acrylate monomer, and the second free radical monomer is selected from a compound shown in a formula 1; the photocuring cationic monomer comprises a first cationic monomer and a second cationic monomer, and the first cationic monomer comprises a vinyl monomer; the second cationic monomer is selected from a compound shown in a formula 2. The ink has high refractive index, curing rate and light transmittance and low curing shrinkage rate, and a formed film can effectively block water and oxygen, so that the performance of a light extraction layer of an optical element and a photoelectronic device is remarkably improved.

The present invention relates to the technical field of solid-state batteries, and in particular to an additive manufacturing method for all-solid-state batteries, comprising: forming positive electrode slurry, negative electrode slurry, electrolyte slurry and current collector slurry; forming each primary solid-state battery assembly; post-processing each primary solid-state battery assembly to form a finished solid-state battery; obtaining several quality test results of the finished solid-state battery; determining the additive manufacturing state according to the proportion of the number of unqualified products in the quality test; if the additive manufacturing state is unstable, adjusting the cutting distance or determining whether the slurry solidification state meets the requirements in combination with the surface inclination of the primary solid-state battery assembly; if the slurry solidification state does not meet the requirements, adjusting the printing speed of the additive device according to the surface inclination of the primary solid-state battery assembly or adjusting the rising rate of the stirring blade according to the maximum average flow distance of the slurry. The present invention achieves the improvement of additive manufacturing accuracy and slurry stability.

The invention discloses a high-Tg flexible graphite bipolar plate micropore plugging agent which comprises the following components in parts by weight: 20-30 parts of epoxy cyclohexyl ethyl cyclotetrasiloxane, 70-80 parts of oxetane or alicyclic epoxy resin, 0.1-2.0 parts of a cationic thermal initiator and 0.5-2 parts of a flatting agent, and the sum of the parts by weight of the epoxy cyclohexyl ethyl cyclotetrasiloxane and the oxetane or alicyclic epoxy resin is 100. The flexible graphite bipolar plate plugging agent has excellent ethylene glycol resistance due to an organosiloxane structure, and each molecule of epoxy cyclohexyl ethyl cyclotetrasiloxane contains four epoxy groups capable of being subjected to cationic curing, so that after curing, the flexible graphite bipolar plate plugging agent is high in crosslinking density, good in heat resistance, low in curing shrinkage rate and small in residual stress; compared with a (methyl) acrylate plugging agent, the plugging agent has higher bending strength.

This application relates to the field of silicone rubber, and more specifically, to a high-performance weather-resistant and anti-fouling silicone rubber for encapsulation / bonding of electronic components and its preparation method. It comprises the following raw materials in weight percentages: 50-65% base compound; 20-30% insulating filler; 5-8% A synergist; 2-5% B synergist; the balance being processing aids; A synergist is a hydrogen-containing silicone resin; B synergist is composed of cage-type polysilsesquioxane containing activating groups, tetravinyltetramethylcyclotetrasilazane, and silicone wax in a weight ratio of 1:(0.5-1):(1-3); and the compound system of synergist and B synergist can bond with the silicone rubber obtained from the base compound and insulating filler to form a dense and stable three-dimensional cross-linked network after curing. This not only possesses superior physical properties but also excellent bonding strength, low shrinkage, weather resistance, and anti-fouling properties, improving the structural stability and long-term reliability of electronic components.

The invention relates to the technical field of curing adhesives, and discloses a UV curing adhesive for an FPC and a preparation method of the UV curing adhesive. Comprising the following operation steps: mixing aliphatic polyurethane acrylate, a reactive diluent and a defoaming agent, heating to 50-60 DEG C, stirring for 1-2 hours, adding modified polyurethane acrylate, a photoinitiator and an antioxidant, uniformly mixing, and filtering to obtain the UV curing adhesive. Aliphatic polyurethane acrylate is used as a base material; the flexible adhesive has good flexibility and curing speed, but is high in shrinkage rate; in the scheme, trimethylolpropane triacrylate and siloxane ethylene glycol epoxy acrylate are taken as reactive diluents, so that the curing shrinkage rate and the thermal stability are reduced; and modified polyurethane acrylate with Schiff base is introduced to synergistically further improve the thermal stability of the UV curing adhesive.

The application relates to the technical field of heat-curable crosslinking agents, in particular to vinylbenzyl fluorene containing a benzocyclobutene group and a preparation method and application thereof, wherein the preparation method of the vinylbenzyl fluorene containing the benzocyclobutene group comprises the following reaction steps: S1. adding fluorene, a solvent, a strong base and a phase transfer catalyst into a reaction container, adding 4-bromobenzocyclobutene dropwise into the reaction container under inert atmosphere, continuous stirring and constant temperature conditions, sequentially performing treatment of solvent removal under reduced pressure, extraction, washing, solvent removal under reduced pressure in the organic phase, and obtaining a target intermediate product; S2. adding the target intermediate product, 4-vinylbenzyl chloride, a solvent, a weak base and a phase transfer catalyst into a reaction container, performing reaction under inert atmosphere, continuous stirring and constant temperature conditions, sequentially performing treatment of solvent removal under reduced pressure, extraction, washing, solvent removal under reduced pressure in the organic phase and recrystallization, and obtaining the vinylbenzyl fluorene containing the benzocyclobutene group.

The invention discloses a flexible graphite bipolar plate micropore plugging agent which comprises the following components in parts by weight: 20-40 parts of a (methyl) acrylate ring-opening compound of epoxy cyclohexyl ethyl cyclotetrasiloxane, 60-80 parts of a high-Tg methacrylate monomer, 0.5-2 parts of a flatting agent and 0.2-1.0 part of a free radical thermal initiator, and the sum of the parts by weight of the (methyl) acrylate ring-opening compound and the high-Tg methacrylate monomer is 100. The plugging agent has an organic siloxane structure and has excellent ethylene glycol resistance, each molecule of a (methyl) acrylated ring-opening compound of epoxy cyclohexyl ethyl cyclotetrasiloxane contains four (methyl) acryloyloxy groups capable of being subjected to free radical polymerization, the crosslinking density is high, and the plugging agent has good plugging performance. And after being copolymerized with a high-Tg methacrylate monomer, the bipolar plate has high heat resistance, low curing shrinkage rate and small residual stress, and favorable bending strength of the bipolar plate at high temperature can be maintained.

The present application relates to the technical field of adhesive, in particular to a high-toughness anti-fatigue acrylic structural adhesive as well as a preparation method and application thereof.The high-toughness anti-fatigue acrylic structural adhesive comprises independently packaged component A and component B;in terms of mass fraction, component A comprises: 40-60 parts of acrylic ester main monomer, 5-20 parts of acrylic ester auxiliary monomer, 3-10 parts of first epoxy resin, 8-30 parts of composite toughening agent, 0.5-5 parts of accelerator, 0.1-5 parts of functional auxiliary agent, and 0.01-0.1 parts of molecular weight regulator; the composite toughening agent comprises core-shell nano toughening agent and rubber-based toughening agent; component B comprises: 5-25 parts of second epoxy resin, 5-30 parts of crosslinking agent, 5-30 parts of initiator, 5-25 parts of auxiliary toughening agent, and 2-10 parts of inorganic filler.The high-toughness anti-fatigue acrylic structural adhesive has low-temperature mechanical properties, anti-fatigue properties and toughening properties.

The invention discloses an anti-oil-spitting UV transparent primer as well as a preparation process and a test method thereof, and relates to the technical field of paints.The anti-oil-spitting UV transparent primer comprises the following components in parts by mass: 20-50 parts of hyperbranched polyester acrylate, 5-20 parts of trifunctional polyurethane acrylate resin, 5-20 parts of special modified acrylate adhesive force resin, 0.5-1 part of a dispersing agent, 0.1-0.3 part of a defoaming agent and 0.1-0.3 part of fumed silica. The coating is prepared from the following components in parts by weight: 20-30 parts of acrylic acid, 0.1-0.2 part of bentonite, 0.2-0.3 part of bis (2, 4, 6-trimethylbenzoyl) phenylphosphine oxide, 3-4 parts of 2-hydroxy-2-methyl-1-phenyl-1-acetone, 1-2 parts of zinc stearate, 0.2-0.3 part of an acrylate flatting agent, 0.1-0.3 part of a liquid rheological agent and 5-15 parts of trimethylolpropane triacrylate. The UV transparent primer is specially used for natural pine base materials in the calibration tool market, the problems that common UV transparent primer in the current market is free of adhesion, a paint film is prone to blistering, scabs are prone to whitening and falling off, and the storage time is short are solved, and meanwhile the practical problems of tolerance, paint film physical performance and the like brought forward by a user to a product are solved.

The invention discloses a high-heat-resistance flexible graphite bipolar plate micropore plugging agent which comprises the following components in parts by weight: 20-40 parts of a (methyl) acrylate ring-opening compound of glycidyl ether oxypropyl cyclotetrasiloxane, 60-80 parts of a high-Tg methacrylate monomer, 0.5-2 parts of a flatting agent and 0.2-1.0 part of a free radical thermal initiator, and the sum of the parts by weight of the (methyl) acrylate ring-opening compound and the high-Tg methacrylate monomer is 100. The plugging agent has an organic siloxane structure and has excellent ethylene glycol resistance, each molecule of the (methyl) acrylated ring-opening compound of the glycidyl ether oxypropyl cyclotetrasiloxane contains four (methyl) acryloyloxy groups capable of being subjected to free radical polymerization, the crosslinking density is high, and the plugging agent has good plugging performance. And after being copolymerized with a high-Tg methacrylate monomer, the bipolar plate has high heat resistance, low curing shrinkage rate and small residual stress, and favorable bending strength of the bipolar plate at high temperature can be maintained.

The application provides a sealant and a preparation method thereof, and relates to the technical field of sealants. The sealant comprises A component and B component. The A component comprises the following raw materials: bio-based polyaspartic ester resin, modified nano zinc oxide, tea polyphenol microcapsule, filler, dispersant and defoaming agent. The B component comprises the following raw materials: bio-based isocyanate prepolymer, HDI trimer, catalyst and light stabilizer. The sealant provided by the application has the comprehensive performances of weather resistance, anti-yellowing, mechanical balance, environmental protection, safety, antibiosis and durability, and is suitable for the sealing of building gaps in the environment exposed to light and moisture for a long time.

The application provides a low-shrinkage anti-cracking water-soluble all-inorganic salt core bonding glue and a preparation method thereof, and belongs to the technical field of inorganic adhesives.The bonding glue is prepared by compounding a paste-like inorganic mortar with silica sol as a liquid-phase film-forming matrix, aluminum oxide powder as a skeleton reinforcing filler and boric acid as a flexible anti-cracking water-soluble modifier.The Si-O-B flexible crosslinking network is constructed in situ by the boric acid, and the industry problems of the traditional silica sol glue layer, such as great brittleness, easy cracking due to shrinkage during cooling, and poor cold and hot cycle stability of the pure inorganic glue, are solved;meanwhile, the all-inorganic reversible water-soluble characteristics of the system are retained, the cured glue layer can be completely powdered and removed by hot water immersion, and there is no stubborn glue layer residue.The formula of the application is simple, the construction can be carried out at room temperature, the curing shrinkage rate is extremely low, the room-temperature bonding strength is high, the cold and hot impact resistance is excellent, and the application is suitable for the room-temperature splicing of die-casting salt cores and cast water-soluble salt core components, salt core repair and repair, salt core forming positioning and fixing and the like.

The invention discloses a preparation method of acrylic resin with high adhesive force, and relates to the technical field of acrylic resin preparation, and the preparation method comprises the following preparation steps: step 1, sequentially adding fatty alcohol-polyoxyethylene ether and lauryl sodium sulfate into distilled water, after the fatty alcohol-polyoxyethylene ether and the lauryl sodium sulfate are completely dissolved, adding a core monomer mixed solution, heating to 45-50 DEG C, and reacting for 1-2 hours; the preparation method comprises the following steps: adding a shell monomer into a reaction kettle, reacting for 30-35 minutes, dropwise adding half of an initiator, heating to 75-80 DEG C after dropwise adding, reacting for 2-2.2 hours, adding the rest of a mixed solution of the initiator and the shell monomer, reacting for 1.9-2 hours at the temperature of 80-85 DEG C, and cooling to room temperature to obtain a mixed solution A; according to the preparation method of the acrylic resin with the high adhesive force, nano silicon dioxide is modified, so that the dispersity and compatibility of nano particles are effectively improved, and after the nano silicon dioxide is added into the acrylic resin, the curing shrinkage rate of the acrylic resin can be reduced, so that the photoetching precision of photoresist is improved; and more accurate micro-nano processing is realized.

The invention discloses a UV moisture dual-curing sealant and a preparation method thereof. The sealant comprises A) an epoxy acrylic prepolymer, B) an epoxy resin prepolymer containing a rigid ring structure, C) an alicyclic epoxy compound, D) an oxetane compound, E) a silane-terminated polyether, F) an alkoxy silane compound, G) a free radical photoinitiator, and H) a cationic photoinitiator. B, C, and D form a continuous sea structure after curing, and E forms an island structure after curing, which is distributed in the continuous sea structure. F is used as a connector between the sea structure and the island structure. The sealant composition has a low thermal expansion coefficient and can avoid the cracking of the bonding interface with the substrate to cause a decrease in bonding strength or falling off, or can avoid the sealant being too rigid to form gaps or microcracks under stress so that moisture can pass through the gaps and cracks to damage internally packaged devices. At the same time, the step-curing design of the technology makes the whole process release heat slowly.