14results about How to "Curing shrinkage is small" patented technology

The application belongs to the technical field of putty, and particularly relates to a high-temperature-resistant CHPO curing putty with good polishing performance and a preparation method thereof. The high-temperature-resistant CHPO curing putty with good polishing performance comprises an A component and a B component. The A component comprises the following raw materials in parts by weight: linseed oil modified unsaturated polyester resin 140-160 parts, oleic acid modified air-drying unsaturated polyester resin 40-60 parts, dicyclopentadiene modified unsaturated polyester resin 90-110 parts, styrene 30-40 parts, drier 5-8 parts, accelerator 0.1-1.2 parts, dispersant 3-5 parts, thixotropic agent 8-12 parts, titanium white powder 12-16 parts, talc powder 400-500 parts, and pre-expanded polymer microspheres 5-10 parts. The application effectively solves the problems of poor polishing performance, poor adhesion to water-based epoxy primer and poor high-temperature resistance of traditional CHPO curing putty.

The application discloses a resin composition and application thereof, and the resin composition comprises, in terms of solid weight, 10-70 parts of a benzoxazine resin containing unsaturated bonds, and 20-100 parts of a maleimide resin; wherein the benzoxazine resin containing unsaturated bonds is a mixture of a benzoxazine resin containing double bonds and a benzoxazine resin containing triple bonds. Compared with the prior art, the resin composition and application thereof can not only control the reactivity between the maleimide resin and the benzoxazine resin, improve the crosslinking network density, but also is beneficial to controlling the production speed of prepreg, and the prepreg has good apparent quality, and meanwhile has excellent high heat resistance, high modulus, low water absorption, low thermal expansion coefficient and low curing shrinkage.

This application relates to the field of silicone rubber, and more specifically, to a high-performance weather-resistant and anti-fouling silicone rubber for encapsulation / bonding of electronic components and its preparation method. It comprises the following raw materials in weight percentages: 50-65% base compound; 20-30% insulating filler; 5-8% A synergist; 2-5% B synergist; the balance being processing aids; A synergist is a hydrogen-containing silicone resin; B synergist is composed of cage-type polysilsesquioxane containing activating groups, tetravinyltetramethylcyclotetrasilazane, and silicone wax in a weight ratio of 1:(0.5-1):(1-3); and the compound system of synergist and B synergist can bond with the silicone rubber obtained from the base compound and insulating filler to form a dense and stable three-dimensional cross-linked network after curing. This not only possesses superior physical properties but also excellent bonding strength, low shrinkage, weather resistance, and anti-fouling properties, improving the structural stability and long-term reliability of electronic components.

The invention relates to the technical field of curing adhesives, and discloses a UV curing adhesive for an FPC and a preparation method of the UV curing adhesive. Comprising the following operation steps: mixing aliphatic polyurethane acrylate, a reactive diluent and a defoaming agent, heating to 50-60 DEG C, stirring for 1-2 hours, adding modified polyurethane acrylate, a photoinitiator and an antioxidant, uniformly mixing, and filtering to obtain the UV curing adhesive. Aliphatic polyurethane acrylate is used as a base material; the flexible adhesive has good flexibility and curing speed, but is high in shrinkage rate; in the scheme, trimethylolpropane triacrylate and siloxane ethylene glycol epoxy acrylate are taken as reactive diluents, so that the curing shrinkage rate and the thermal stability are reduced; and modified polyurethane acrylate with Schiff base is introduced to synergistically further improve the thermal stability of the UV curing adhesive.

The application relates to the technical field of heat-curable crosslinking agents, in particular to vinylbenzyl fluorene containing a benzocyclobutene group and a preparation method and application thereof, wherein the preparation method of the vinylbenzyl fluorene containing the benzocyclobutene group comprises the following reaction steps: S1. adding fluorene, a solvent, a strong base and a phase transfer catalyst into a reaction container, adding 4-bromobenzocyclobutene dropwise into the reaction container under inert atmosphere, continuous stirring and constant temperature conditions, sequentially performing treatment of solvent removal under reduced pressure, extraction, washing, solvent removal under reduced pressure in the organic phase, and obtaining a target intermediate product; S2. adding the target intermediate product, 4-vinylbenzyl chloride, a solvent, a weak base and a phase transfer catalyst into a reaction container, performing reaction under inert atmosphere, continuous stirring and constant temperature conditions, sequentially performing treatment of solvent removal under reduced pressure, extraction, washing, solvent removal under reduced pressure in the organic phase and recrystallization, and obtaining the vinylbenzyl fluorene containing the benzocyclobutene group.

The present application relates to the technical field of adhesive, in particular to a high-toughness anti-fatigue acrylic structural adhesive as well as a preparation method and application thereof.The high-toughness anti-fatigue acrylic structural adhesive comprises independently packaged component A and component B;in terms of mass fraction, component A comprises: 40-60 parts of acrylic ester main monomer, 5-20 parts of acrylic ester auxiliary monomer, 3-10 parts of first epoxy resin, 8-30 parts of composite toughening agent, 0.5-5 parts of accelerator, 0.1-5 parts of functional auxiliary agent, and 0.01-0.1 parts of molecular weight regulator; the composite toughening agent comprises core-shell nano toughening agent and rubber-based toughening agent; component B comprises: 5-25 parts of second epoxy resin, 5-30 parts of crosslinking agent, 5-30 parts of initiator, 5-25 parts of auxiliary toughening agent, and 2-10 parts of inorganic filler.The high-toughness anti-fatigue acrylic structural adhesive has low-temperature mechanical properties, anti-fatigue properties and toughening properties.

The application provides a sealant and a preparation method thereof, and relates to the technical field of sealants. The sealant comprises A component and B component. The A component comprises the following raw materials: bio-based polyaspartic ester resin, modified nano zinc oxide, tea polyphenol microcapsule, filler, dispersant and defoaming agent. The B component comprises the following raw materials: bio-based isocyanate prepolymer, HDI trimer, catalyst and light stabilizer. The sealant provided by the application has the comprehensive performances of weather resistance, anti-yellowing, mechanical balance, environmental protection, safety, antibiosis and durability, and is suitable for the sealing of building gaps in the environment exposed to light and moisture for a long time.

The application provides a low-shrinkage anti-cracking water-soluble all-inorganic salt core bonding glue and a preparation method thereof, and belongs to the technical field of inorganic adhesives.The bonding glue is prepared by compounding a paste-like inorganic mortar with silica sol as a liquid-phase film-forming matrix, aluminum oxide powder as a skeleton reinforcing filler and boric acid as a flexible anti-cracking water-soluble modifier.The Si-O-B flexible crosslinking network is constructed in situ by the boric acid, and the industry problems of the traditional silica sol glue layer, such as great brittleness, easy cracking due to shrinkage during cooling, and poor cold and hot cycle stability of the pure inorganic glue, are solved;meanwhile, the all-inorganic reversible water-soluble characteristics of the system are retained, the cured glue layer can be completely powdered and removed by hot water immersion, and there is no stubborn glue layer residue.The formula of the application is simple, the construction can be carried out at room temperature, the curing shrinkage rate is extremely low, the room-temperature bonding strength is high, the cold and hot impact resistance is excellent, and the application is suitable for the room-temperature splicing of die-casting salt cores and cast water-soluble salt core components, salt core repair and repair, salt core forming positioning and fixing and the like.

The invention discloses a concrete crack epoxy resin grouting repairing system and method based on the dialysis principle, and belongs to the technical field of concrete crack repairing. The concrete crack epoxy resin grouting repairing system comprises a grouting system, a slurry pumping system and a filtering system; the grouting system comprises a grouting pump, a grouting material storage tank and a grouting pipe; the slurry pumping system comprises a slurry pumping pump, an impurity collecting tank and a slurry pumping pipe; the inlet end and the outlet end of the filtering system are connected with the impurity collecting tank and the grouting material storage tank respectively, and the filtering system comprises a rough filtering unit, a fine filtering unit and an adsorption unit which are sequentially connected in series from the inlet end to the outlet end; the grouting system, the concrete crack, the slurry pumping system and the filtering system are connected through pipelines to form a circulating flow path. According to the method, impurities in the crack are synchronously taken out and filtered through the cyclic dialysis process of'filling-extracting-filtering-refilling ', integration of impurity removal and grouting reinforcement is achieved, the bonding strength of a grouting material and the concrete crack wall is greatly improved, the repairing quality is guaranteed, and the service life of a concrete structure is prolonged.

The application discloses a transfer glue special for transfer high-gloss tipping paper and a preparation method thereof, and aims to solve the defects of poor environmental protection, insufficient water resistance, large curing shrinkage and the like of the existing transfer glue. The transfer glue is prepared from raw materials such as modified acrylate copolymer emulsion and epoxy modified polyurethane dispersion, wherein the modified acrylate copolymer emulsion is prepared through seed emulsion polymerization, and a composite emulsifier is prepared from an anion and a nonionic emulsifier. The preparation method comprises two steps of modified acrylate copolymer emulsion preparation and transfer glue finished product preparation. The transfer glue is environment-friendly and non-toxic, has high adhesive strength, low curing shrinkage and excellent flow leveling property, can realize complete transfer of an aluminized layer, and guarantees high-gloss texture of the tipping paper; and the preparation process is simple and controllable, and is suitable for industrial production.

A compound for an optical element adhesive is represented by formula [1]. In formula [1], X1 represents a structure selected from formulae [1-a] to [1-g]. TA represents a hydrogen atom or a benzene ring, and * represents a bond. X2 represents a linear alkylene group having 2-14 carbon atoms, and the alkylene group may be substituted by at least one of (i) and (ii). (i) any-CH2-, which is not adjacent to X1 or X3, in the alkylene group is substituted by-O-,-CO-,-COO-,-OCO-,-CONH-,-NHCO-,-NH-, a benzene ring or a cyclohexane ring; (ii) Any-CH2-in the alkylene group is substituted by-CH (CH3)-. And X3 represents-CO <->,-COO <->,-OCO <->,-CONH <->,-NHCO <-> or-NH <->. And X4 represents a branched alkyl group having 12 to 40 carbon atoms.

This invention discloses a single-component photo- and thermally curable adhesive and its preparation method. The adhesive comprises the following components in parts by weight: 20–80 parts of a polymerizable acrylic compound; 1–10 parts of a macromolecular photoinitiator; 0.1–5 parts of a thermal initiator; 0.1–3 parts of a peroxide; 5–61 parts of filler; 0–5 parts of a light stabilizer; and 0.1–5 parts of additives. The macromolecular photoinitiator generates free radicals under ultraviolet light irradiation, achieving rapid curing of the irradiated area. The thermal initiator releases acid and promotes the decomposition of the peroxide under heating conditions, enabling the system to generate free radicals at a low temperature of 50–90 °C, thereby completing the curing of the light-shielded area. By introducing fillers and stabilizers into the system, the curing shrinkage rate can be reduced, and dimensional stability and long-term storage stability can be improved.

The present application relates to a kind of laminated optical films, it is sequentially laminated with the 1st optical film, the 1st adhesive layer, the 2nd optical film, the 2nd adhesive layer and the 3rd optical film, wherein, the 1st adhesive layer and the 2nd adhesive layer are the cured product layer of laminated optical film adhesive composition containing curable component and metal oxide particles.It is preferable that the refractive index of the 1st adhesive layer and the 2nd adhesive layer is 1.55 or more.It is preferable that the refractive index of the 1st optical film and the 2nd optical film is 1.55 or more.It is preferable that the 1st optical film and the 2nd optical film are both phase difference films of liquid crystal type, and it is preferable that the 3rd optical film is at least a polarizing film with polarizer.

This invention relates to the field of epoxy adhesive technology, and discloses an epoxy adhesive for semiconductor chip packaging and its preparation process; including the following steps: Step 1: Epoxy resin and 3-(perfluorohexyl)epoxypropane are added to ethanol and mixed evenly, then 2-imidazolium-1-ethylamine is added, and the mixture is reacted at 50~60℃ for 4~6 hours to obtain modified epoxy resin; Step 2: Modified epoxy resin, modified polyurethane, defoamer, and diluent are vacuumed and stirred at 800~1200 rpm / min for 40~50 minutes, then nano zinc oxide and curing agent are added sequentially, and the stirring speed is reduced to 200~400 rpm / min for 1~2 hours to obtain epoxy adhesive.