Epoxy resin pouring sealant and preparation method thereof

A technology of epoxy resin and potting glue, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of operators feeling uncomfortable, poor compatibility of epoxy resin, high viscosity of nitrile rubber, etc. Achieve the effects of reducing CTE, avoiding cracking, and improving aging hard and brittle life

Inactive Publication Date: 2017-09-15
COLLTECH DONGGUAN BONDING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, unmodified epoxy resin has high rigidity, poor toughness under high and low temperature impact, easy cracking of adhesive layer, poor dimensional stability caused by thermal expansion and contraction under high and low temperature
[0003] The commonly used modification method is to increase the toughness of liquid polysulfide rubber and nitrile rubber. Polysulfide rubber has a special odor, which often makes operators feel uncomfortable. Nitrile rubber has high viscosity and poor compatibility with epoxy resin. It often requires a specific process to improve the compatibility of the two, which increases the construction process, and the best curing condition is temperature rise curing, which also requires a lot of energy consumption during use.

Method used

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  • Epoxy resin pouring sealant and preparation method thereof
  • Epoxy resin pouring sealant and preparation method thereof
  • Epoxy resin pouring sealant and preparation method thereof

Examples

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preparation example Construction

[0048] A kind of preparation method of epoxy resin encapsulant that another embodiment of the present invention proposes, it comprises:

[0049]1) Mix 40-70 parts of bisphenol F epoxy resin, 20-50 parts of active polyurethane toughening agent, 10-20 parts of reactive diluent, 30-50 parts of inorganic filler, 0.1-0.5 parts of defoamer, thixotropic agent 1-3 parts, mixed with 0.5-1 coupling agent, stirred under 800-1500rpm high-speed disperser for 0.5-1.5h to disperse the glue evenly, vacuum stirred in the stirring tank for 1-2 hours to discharge air bubbles, and obtained A component;

[0050] 2) Heat 50 parts of isophorone diamine to 60-65°C under nitrogen atmosphere, slowly add 20 to 40 parts of 1,4-butanediol diglycidyl ether under low-speed stirring condition, heat to 85-95°C, Stir and react under nitrogen for 2-2.5 hours, take samples and titrate the amine value according to QB / T2853-2007, the range of amine value is 300-350mgKOH, the modified alicyclic amine can be obtaine...

Embodiment

[0053] A kind of preparation method of epoxy resin encapsulant that one embodiment of the present invention proposes, it comprises:

[0054] 1) Mix 50 parts of bisphenol F epoxy resin, 40 parts of active polyurethane toughening agent, 10 parts of triglycidyl ether, 30 parts of inorganic filler, 0.3 parts of defoamer, 2 parts of thixotropic agent, and 1 part of coupling agent , Stir for 1 hour under the 800-1500rpm high-speed disperser to disperse the glue evenly, and vacuum stir in the stirring tank for 1-2 hours to discharge the air bubbles, and obtain A component;

[0055] 2) 70 parts of modified alicyclic amine, 30 parts of polyether amine, 10 parts of DMP-30 accelerator are added dropwise, and vacuum stirring is performed to remove air bubbles to obtain component B;

[0056] 3) Mix the A component and the B component in a weight ratio of 3:1 to obtain an epoxy resin potting compound.

[0057] An epoxy resin potting compound proposed by an embodiment of the present inventi...

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Abstract

The present invention relates to an epoxy resin pouring sealant and a preparation method thereof, the epoxy resin pouring sealant includes A and B components, the A component includes, by weight, 40-70 parts of bisphenol F epoxy resin, 20-50 parts of an active polyurethane toughening agent, 10-20 parts of an active diluent, 30-50 parts of an inorganic filler and 1-10 parts of an additive; the B component includes, by weight, 40-70 parts of modified alicyclic amine; 30-60 parts of polyetheramine and 3-10 parts of a promoter. The weight ratio of A to B is 2-4:1. The epoxy resin pouring sealant has better aging resistance and strong resistance to cold and hot impact, and meets the high temperature and cold impact requirement of electronic sealing.

Description

technical field [0001] The invention relates to a potting glue and a preparation method thereof, in particular to an epoxy resin potting glue and a preparation method thereof. Background technique [0002] Due to its good mechanical properties and cohesiveness, room temperature curing epoxy resin potting adhesive is widely used in the bonding, potting and packaging of electronic components, and plays an important role in the fixing, moisture-proof and anti-corrosion of electronic components. . However, unmodified epoxy resin has high rigidity, poor toughness under high and low temperature impact, easy cracking of the adhesive layer, and poor dimensional stability caused by thermal expansion and contraction under high and low temperature. [0003] The commonly used modification method is to increase the toughness of liquid polysulfide rubber and nitrile rubber. Polysulfide rubber has a special odor, which often makes operators feel uncomfortable. Nitrile rubber has high visc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04C08G59/50
Inventor 刘远琼黄成生
Owner COLLTECH DONGGUAN BONDING TECH CO LTD
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