105results about How to "Low CTE" patented technology

The invention provides a liquid thermosetting resin composition. The composition comprises the components in weight percentage: 30 to 80 percent of epoxide resin, 2 to 25 percent of firming agent, 20 to 80 percent of filling material, 0.001 to 5 percent of thixotropic agent, 0.001 to 5 percent of visbreaking dispersant, 0 to 5 percent of foam suppressor and a catalyst the weight of which is no more than 0.5 percent of the total weight of the epoxide resin and the firming agent; the components are mixed and evenly stirred; the liquid thermosetting resin composition has the advantages of good fluidity and metallic wettability, higher Tg, lower CTE and good self deaeration performance, and can overcome the defects of shrinkage in a hole, cracking in the hole, bubble in the hole and the connection of resins between holes. The invention also provides a method for manufacturing a printed circuit board by using the liquid thermosetting resin composition, which aims to improve the defects of the insufficient rubber filling after plate pressing and the cracking or the layering of resins after thermal shock and improve the credibility such as the heat reliability, etc. of the thick copper printed circuit board.

A multiphase polymeric material comprises a first rigid continuous phase and a second elastic phase dispersed in the first phase. The multiphase polymeric material may be formed into polymeric strips and used to make a cellular confinement system which is suitable for use in cold areas.

The invention belongs to the technical field of copper clad laminates and particularly relates to a resin composition, prepreg using the resin composition and a laminate. The resin composition contains the ingredients in percentage by weight: 15-55% of amine modified bismaleimide (BMI), 10-45% of benzoxazine resin and 0-75% of epoxy resin. According to the resin composition, through further reaction of benzoxazine (BOZ) and amine modified bismaleimide (BMI), performance advantages of two kinds of high-performance resin, namely BMI and BOZ, are excellently exerted, so that the prepreg and the copper clad laminates, manufactured from the resin composition, have the properties of high Tg, relatively high peeling strength, relatively low CTE, relatively low water absorbing capacity, relatively low dielectric loss, relatively high elastic modulus high-temperature retention rate, relatively good resistance to hot and damp and the like, and reach a flame-retardant level UL94-V0.

This invention relates to a resin composition with enhanced heat-releasing properties, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and graphene oxide as a filler, and to a heat-releasing film for an electronic device, an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.

Disclosed is a polyimide film, which is colorless and transparent, with superior mechanical properties and high thermal stability.

The invention provides a thermosetting resin composition as well as a prepreg, a laminated board and a circuit carrier containing the same. The thermosetting resin composition comprises thermosetting resin, a laser direct forming additive, an inorganic filler, and a silane coupling agent with 2-3 groups capable of being hydrolyzed at each of two ends of a molecular chain. The laser direct forming additive is added in the thermosetting resin composition provided by the present invention to ensure that a circuit can be formed on thermosetting resin after laser irradiation and metallization, the CTE of the composition can be reduced and the absorption of laser energy by a matrix can be enhanced by adding the inorganic filler and the silane coupling agent with 2-3 groups capable of being hydrolyzed at each of the two ends of the molecular chain, the activation rate of an LDS auxiliary agent is effectively improved, the attachment and the sedimentary thickness of the matrix to copper are obviously enhanced at the same time, and three types of components mutually cooperate with the thermosetting resin to ensure that the thermosetting resin composition has a low coefficient of thermal expansion, thereby making the prepared circuit carrier have relatively good quality of signal transmission.

The present invention relates to an epoxy resin pouring sealant and a preparation method thereof, the epoxy resin pouring sealant includes A and B components, the A component includes, by weight, 40-70 parts of bisphenol F epoxy resin, 20-50 parts of an active polyurethane toughening agent, 10-20 parts of an active diluent, 30-50 parts of an inorganic filler and 1-10 parts of an additive; the B component includes, by weight, 40-70 parts of modified alicyclic amine; 30-60 parts of polyetheramine and 3-10 parts of a promoter. The weight ratio of A to B is 2-4:1. The epoxy resin pouring sealant has better aging resistance and strong resistance to cold and hot impact, and meets the high temperature and cold impact requirement of electronic sealing.

The present invention is a substrate for a display, the substrate having a film B including a polysiloxane resin on at least one surface of a film A including a polyimide resin, wherein the film B contains inorganic oxide particles therein, and the present invention has an object to provide a substrate for a display: being able to be applied to a color filter, an organic EL element, or the like without the need to carry out any complex operations; allowing high-definition displays to be manufactured; and being provided with a low CTE, a low birefringence, and flexibility.

Disclosed is a method or process for forming a glass wiring board substrate for integrated circuit wiring boards, including providing a first molding surface (20) positioned on a first mold (22) having truncated conical pins (24) protruding therefrom, the pins (24) having a diameter at the top end (26) thereof of 150 micrometers or less, and a minimum pitch (28) of 400 micrometers or less, providing a glass sheet (30) having first and second surfaces (32,34) on opposite major sides thereof, pressing the first surface (32) of the glass sheet against the molding surface (20), heating the glass sheet (30) and the first molding surface (20) together to a temperature sufficient to soften a glass of which the glass sheet (30) is comprised, such that the pattern of the first molding (20) surface is replicated in the first surface (32) of the glass sheet (30), thereby producing a formed glass sheet (30′) having an array of holes (40) therein, cooling the formed glass sheet (30′) and the molding surface (20) together to a temperature below the softening point of said glass, and separating the formed glass sheet (30) from the molding surface (20). The forming may press the glass sheet using one mold surface or two mold surfaces simultaneously. For embodiments using a single mold, the holes may be blind holes after pressing, and may then be opened to form through-holes by back side lapping. Alternatively, the glass is pressed up to through-hole formation, avoiding the need of back side lapping.

A thermosetting adhesive film comprising a uniform adhesive matrix containing a thermosetting resin and a curing agent therefor, and a thermoplastic resin; and a filler material dispersed in the adhesive matrix, wherein the filler material comprises an inorganic material and a domain to incorporate the inorganic material, the domain consisting of an elastic polymer which is elongated and oriented in one direction substantially perpendicular to the thickness direction of the adhesive film. This adhesive film provides good properties of coefficient of thermal expansion and elastic modulus, without exhibiting reduced adhesive force which would be otherwise observed in association with the addition of large amounts of filler material.

The invention discloses a halogen-free resin composition. The composition is prepared by fully mixing hydrogenated bisphenol A type epoxy resin, alicyclic epoxy resin, novolac epoxy resin curing agent, aluminum hydroxide serving as an inorganic filler and organic solvent uniformly. The invention also discloses a copper clad plate prepared from the halogen-free resin composition. The copper clad plate has good thermal stability and creepage tracing property. The halogen-free resin with high comparative tracking index (CTI) resin is adopted, and the consumption of the aluminum hydroxide servingas the inorganic filler is reduced, so that the composition has high CTI value, avoids series problems caused by using excessive aluminum hydroxide and simultaneously realizes halogen-free and environment-friendly properties.

A method for providing improved gettering in a vacuum encapsulated microdevice is described. The method includes designing a getter alloy to more closely approximate the coefficient of thermal expansion of a substrate upon which the getter alloy is deposited. Such a getter alloy may have a weight percentage of less than about 8% iron (Fe) and greater than about 50% zirconium, with the balance being vanadium and titanium, which may better match the coefficient of thermal expansion of a silicon substrate. In one exemplary embodiment, the improved getter alloy is deposited on a silicon substrate prepared with a plurality of indentation features, which increase the surface area of the substrate exposed to the vacuum. Such a getter alloy is less likely to delaminate from the indented surface of the substrate material during heat-activated steps, such as activating the getter material and bonding a lid wafer to the device wafer supporting the microdevice.

The invention discloses low-expansion high-strength thin-wall cordierite honeycomb ceramic and a preparation method thereof. Content of cordierite in ceramic is greater than 95%, and the ceramic is prepared from the following chemical components in percentage by mass: 47.5-52.5% of SiO2, 32.7-37.7% of Al2O3 and 11.5-15.5% of MgO; porosity of honeycomb ceramic is greater than or equal to 16%, and awater absorption rate is 14%-30%; bending strength of the honeycomb ceramic is greater than or equal to 1.6 MPa; and a thermal expansion coefficient at the room temperature of 800 DEG C is smaller than or equal to 5*10<-7>/DEG C. According to the preparation method, aluminum hydroxide prepared by a special preparation method is led, so that the product has low CTE (Coefficient of Thermal Expansion), high strength and low cost.

Disclosed are porous ceramic honeycomb articles, such as filters, which are composed predominately of a cordierite composition. The ceramic honeycomb articles possess a porous microstructure characterized by a unique combination of relatively high porosity (>45%), and moderately narrow pore size distribution wherein greater than 15% and less than 38% of the total porosity exhibits a pore diameter less than 10 μm, and low CTE wherein CTE≦6.0×10⁻⁷/° C. (from 23° C. to 800° C.). The articles exhibit high thermal durability and high filtration efficiency coupled with low pressure drop. Such ceramic articles are particularly well suited for use in filtration applications, such as in diesel exhaust filters. Also disclosed are methods for manufacturing the porous ceramic honeycomb article.

This invention relates to a resin composition with good workability, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and an inorganic filler having a nanocone shape, and to an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.

The invention discloses polyamide acid slurry, a preparation method thereof and a polyimide film, excessive dianhydride reacts with diamine containing an imidazole structure, and then alcohol is added to obtain an ester-terminated polyamide acid composition; by adding a second part of dianhydride monomer and diamine monomer into the solution, a polyamide acid solution in which the molar weight of the dianhydride monomer is basically close to the molar weight of the diamine monomer is obtained; when the first part of dianhydride or diamine monomer and the second part of dianhydride or diamine monomer are different in type, polyamic acid of a block structure can be obtained, the polyamic acid is further cured to obtain the polyimide film of the block structure, the viscosity is small and controllable in the reaction process, the ratio of the dianhydride to the diamine monomer can be increased, batch solution feeding is achieved, a high-molecular-weight low-viscosity imidazole structure-containing block type polyamide acid solution is prepared, and due to the action of an imidazole structure, a substrate hydrogen bond and the like, a film cured at a high temperature is excellent in comprehensive performance, and the adhesive force of the film and a coated substrate is greatly improved.

The invention provides a needle coke preparation method and device. The preparation method comprises mixing raw oil and a part of coker gas oil, preheating the mixture, feeding the mixture into a pretreatment reactor with a stirring function, wherein the upper part of the reactor is provided with gas vents and the rear part of the reactor is provided with a buffer tank, buffering the reactor distillate through the buffer tank, feeding the reactor distillate into a coking heating furnace, carrying out heating, feeding the material into a delayed coking device and preparing needle coke. A relaxative reaction zone is built in front of the coking device, a stirring process always keeps a uniform state of a system and a high activity component polymerization rate is effectively controlled. Through control of raw material pretreatment conditions, in the reaction system, a lot of an intermediate phase precursor is produced. The number of the intermediate phase precursor is large, volume is small and dispersion is uniform so that the high-quality needle coke product can be prepared.