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Epoxy compound having alkoxysilyl group, method for manufacturing same, composition and cured product including same, and use thereof

A technology of alkoxysilyl and epoxy compounds, which is applied in the field of epoxy compounds and can solve problems such as differential thermal properties, high CTE, and manufacturing restrictions

Active Publication Date: 2015-11-18
KOREA INST OF IND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of using inorganic particles having a large average particle diameter, the frequency of insufficient filling of a composition comprising a resin and inorganic particles may increase
While the CTE can be substantially reduced in the case of compositions comprising organic resins and fibers used as fillers, the CTE may still be high compared to silicon chips etc.
[0006] As mentioned above, the manufacture of highly integrated and high-performance electronic components for next-generation semiconductor substrates as well as PCBs and the like may be limited due to technical limitations in forming epoxy-resin compounds
Therefore, there is a need to develop epoxy composites with improved brittleness and viscosity as well as improved heat resistance (i.e., low CTE and high glass transition temperature), thereby overcoming the high CTE and processability of conventional epoxy composites. poor thermal properties

Method used

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  • Epoxy compound having alkoxysilyl group, method for manufacturing same, composition and cured product including same, and use thereof
  • Epoxy compound having alkoxysilyl group, method for manufacturing same, composition and cured product including same, and use thereof
  • Epoxy compound having alkoxysilyl group, method for manufacturing same, composition and cured product including same, and use thereof

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Embodiment approach

[0289] Hereinafter, the present invention will be described in detail with reference to examples. The following examples are for illustration, but the present invention is not limited thereto.

[0290] (synthesis example)

[0291] Synthetic Example 1: Synthesis of Naphthalene Epoxy Compound A': with CH 3 CH 2 -OH reaction

[0292]

[0293] (1) Step 1

[0294] 20g of 2,2'-((1,5-bis(oxirane-2-ylmethoxy)naphthalene-2,6-diyl)bis(methylene))bis(oxirane ), 2.92g of NaOH, 3.54g of tetraethylammonium bromide (NEt 4 Br), 70ml of tetrahydrofuran (THF), 70mL of CH 3 CN, and 82 mL of ethanol (EtOH) were added into the two-necked flask at room temperature, followed by stirring at 26° C. for 5 hours and 30 minutes. Then, 5 mL of saturated ammonium chloride (NH4 Cl) solution, followed by stirring for 3 minutes. The solvent was removed using a rotary evaporator and the organic layer was separated by the action of 400 mL of ethyl acetate (EA) and 300 mL of water. Add MgSO to the se...

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Abstract

The present invention relates to an alkoxysilyl group epoxy compound, a method for producing the same, a composition including the same, and a hardening material, wherein the compound has excellent heat resistance, particularly exhibits a low coefficient of thermal expansion (CTE) and a high glass transition ascending effect in the composition and / or exhibits excellent flame retardance in the hardened material, and a separate silane coupling agent is not needed. By means of the present invention, provided are: an epoxy compound having a core including an epoxy group and at least one alkoxysilyl group which is an S1 substituent independently selected from the group consisting of Chemical Formula S11 to S15 or an S2 substituent independently selected from the group consisting of Chemical Formula S21 to S25; a method for producing the alkoxysilyl-based epoxy compound produced through the epoxy ring-opening reaction and alkoxysilylation of a start material; an epoxy composition including the epoxy compound; a hardened material of the same; and a use of the same. The hardened material which is a composite of the composition including the novel alkoxysilyl group epoxy compound by means of the present invention has the improved chemical bond of the alkoxysilyl group from the epoxy compound and a filling agent. Coupling and bonding efficiency is also improved when a composite is produced by means of the coupling and bonding of alkoxysilyl groups of the epoxy compound having the alkoxysilyl group. Accordingly, excellent heat resistance properties such as a low CTE and a high glass transition temperature are exhibited in the composite, and / or excellent flame retardance is exhibited in the hardened material.

Description

technical field [0001] The present invention relates to epoxy compounds having alkoxysilyl groups (hereinafter referred to as "alkoxysilylated epoxy compounds"), composites of such epoxy compounds exhibiting good heat resistance and / or A cured product of the epoxy compound exhibiting good flame retardancy, a preparation method thereof, a composition comprising the same, a cured product thereof, and uses thereof. More specifically, the present invention relates to alkoxysilylated epoxy compounds, composites of such epoxy compounds exhibiting good thermal resistance, in particular low coefficient of thermal expansion (CTE) and high glass transition temperature (including no transition temperature (no Tg) state), which means that the composite does not have a glass transition temperature), and without a separate coupling agent, the present invention also relates to its preparation method, its composition, its cured product and its uses. Background technique [0002] The coeff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07F1/08C07F7/10C09J163/00
CPCC09J163/00C07F7/1804Y10T428/239C07D303/12C07D303/36C07D405/06C08G59/06C08G59/306C08G59/02C08L63/00C09D163/00
Inventor 全贤爱朴成桓金闰柱朴秀珍朴淑延卓相镕
Owner KOREA INST OF IND TECH
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