Polyamide acid slurry, preparation method thereof and polyimide film

A technology of polyamic acid and slurry, which is applied in the fields of polyamic acid slurry and its preparation, polyimide precursor polyamic acid, and polyimide film, can solve the problem that the performance of polyimide film is greatly affected. , The preparation process is difficult to control, the polymerization reaction speed is fast, etc., to solve the difficulty of filtration, reduce the large particles of agglomeration or encapsulation, and improve the yield.
CN112876680AActive Publication Date: 2021-06-01武汉柔显科技股份有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
武汉柔显科技股份有限公司
Publication Date
2021-06-01

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Abstract

The invention discloses polyamide acid slurry, a preparation method thereof and a polyimide film, excessive dianhydride reacts with diamine containing an imidazole structure, and then alcohol is added to obtain an ester-terminated polyamide acid composition; by adding a second part of dianhydride monomer and diamine monomer into the solution, a polyamide acid solution in which the molar weight of the dianhydride monomer is basically close to the molar weight of the diamine monomer is obtained; when the first part of dianhydride or diamine monomer and the second part of dianhydride or diamine monomer are different in type, polyamic acid of a block structure can be obtained, the polyamic acid is further cured to obtain the polyimide film of the block structure, the viscosity is small and controllable in the reaction process, the ratio of the dianhydride to the diamine monomer can be increased, batch solution feeding is achieved, a high-molecular-weight low-viscosity imidazole structure-containing block type polyamide acid solution is prepared, and due to the action of an imidazole structure, a substrate hydrogen bond and the like, a film cured at a high temperature is excellent in comprehensive performance, and the adhesive force of the film and a coated substrate is greatly improved.
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Description

technical field

[0001] The invention relates to polyimide precursor polyamic acid and polyimide film, in particular to a polyamic acid slurry and a preparation method thereof and a polyimide film. Background technique

[0002] Polyimides are generally prepared from polyamic acid precursors. In order to obtain a polyimide resin or film with excellent comprehensive properties, it is generally required that the molecular weight of the polyimide be as high as possible, so the molecular weight of the polyamic acid precursor is required to be as high as possible. However, with the increase of the molecular weight of the polyamic acid, the viscosity of the polyamic acid solution increases greatly, which deteriorates the processing characteristics and film-forming characteristics of the polyamic acid solution, and at the same time increases the difficulty of synthesis. The optimization of the preparation of the feeding process and the synthesis conditions is very meaningful. [00...

Claims

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