Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same

Abstract

The invention provides a liquid thermosetting resin composition. The composition comprises the components in weight percentage: 30 to 80 percent of epoxide resin, 2 to 25 percent of firming agent, 20 to 80 percent of filling material, 0.001 to 5 percent of thixotropic agent, 0.001 to 5 percent of visbreaking dispersant, 0 to 5 percent of foam suppressor and a catalyst the weight of which is no more than 0.5 percent of the total weight of the epoxide resin and the firming agent; the components are mixed and evenly stirred; the liquid thermosetting resin composition has the advantages of good fluidity and metallic wettability, higher Tg, lower CTE and good self deaeration performance, and can overcome the defects of shrinkage in a hole, cracking in the hole, bubble in the hole and the connection of resins between holes. The invention also provides a method for manufacturing a printed circuit board by using the liquid thermosetting resin composition, which aims to improve the defects of the insufficient rubber filling after plate pressing and the cracking or the layering of resins after thermal shock and improve the credibility such as the heat reliability, etc. of the thick copper printed circuit board.

Description

technical field [0001] The invention relates to a liquid thermosetting resin composition applied to double-sided or multi-layer boards (including HDI high-density multi-layer boards) through holes, blind holes or micro-hole plug holes, and its application to thick copper printed circuit boards Manufacturing method. Background technique [0002] With the development of terminal electronic products in the direction of lightness, thinness, shortness and smallness, the rapid development of printed circuit board (referred to as PCB) design or processing technology is driven. For example, the line width / line spacing of PCB is getting smaller and smaller, PCB The thinner and thinner the thickness of the BGA (packaged memory) and the changes in the soldering process of components, etc., thus speeding up the application of the plugging process and resin, at the same time, it is forced by the EU RoHS directive and the environment of various countries around the world. With the promul...

AI Technical Summary

Problems solved by technology

[0003] Due to the high coefficient of expansion (CTE) of the current plugging resin, and the relatively low CTE of the substrate and prepreg resin, the CTEs of the two do not match. When using the plugging process in Figure 1 or Figure 2, after high temperature such as reflow After the process, it is easy to cause the resin shrinkage of the plug hole in Figure 3 and the hole is not filled, or the resin crack phenomenon in Figure 4 to occur

Even due to the poor thixotropic performance of the plugging resin, the plugging holes in Figure 5 are connected into sheets, or because the viscosity of the plugging resin is too high and the self-defoaming performance is poor, the bubble phenomenon in the hole in Figure 6 will appear after the plugging.

The above phenomena have a greater negative impact on the reliability of the PCB

In addition, the plugging resin currently on the market is very expensive, which is not conducive to the promotion of large-volume and multi-purpose applications of PCBs.

[0004] In addition, with the rapid increase in demand for power supplies, the demand for thick copper PCBs continues to grow, but the process before lamination of thick copper plates still adopts the traditional process (core boards and prepregs are laminated and laminated alternately), such as Figure 7 , after lamination of multi-layer boards, due to the deep gap between the lines of thick copper (especially thick copper with a thickness of more than 5oz), more resin needs to be filled, which is prone to insufficient glue filling, or due to glass cloth filling The deformation after gluing produces a large stress, and then cracks (crack) or even delamination (Delamination) are prone to occur after thermal shock. At present, the pressing bottleneck has been encountered.

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