Halogen-free resin composition and copper clad plate prepared from composition

A technology of resin composition and epoxy resin, applied in the field of copper clad laminate and halogen-free resin composition, can solve the problems of reducing hydroxyl concentration, easy to wear drill bit, poor adhesion between copper foil and base material, etc. Dimensional stability, thermal expansion coefficient reduction, heat resistance improvement effects

Active Publication Date: 2011-12-21
ZHEJIANG WAZAM NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

2AL(OH)3→AL2O3+3H2O); In addition, it also affects the peel strength of the sheet
Because the addition of fillers reduces the amount of resin in contact between the base material and the copper foil, thereby reducing the concentration of hydroxyl groups and making the adhesion between the copper foil and the base material worse; if the amount of filler is too high, it will also affect the PCB drilling process and easily wear the drill bit , the amount of drilling slag becomes larger

Method used

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  • Halogen-free resin composition and copper clad plate prepared from composition
  • Halogen-free resin composition and copper clad plate prepared from composition
  • Halogen-free resin composition and copper clad plate prepared from composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] According to the amount of each component in the following table 2 (according to parts by weight), each component is fully mixed evenly, and stirred in a high-speed disperser for 4 hours; then use 7628 glass fiber cloth for gluing, and dry in a vertical gluing machine to obtain For the prepreg, the speed of the gluing machine is 15m / min, and the parameters of the prepared prepreg are: the gelation time is 75S; the resin content is 40%; the kinematic viscosity of the resin powder is 470P; Laminated with copper foil, pressed and formed in a vacuum press to obtain a copper-clad laminate. The pressing parameters are: vacuum degree 0.01MPa; pressure 400PSI; hot plate temperature 120-220°C; pressing time 145min. The Td, T260, T288 and CTI values ​​of the copper clad laminates are tested, and the test results are listed in Table 2; the thermal expansion properties of the copper clad laminates are tested, and the test results are listed in Table 4.

Embodiment 2

[0038] Repeat Example 1 according to the amount of each component specified in Table 2 below (by weight), and the test results are listed in Table 2.

Embodiment 3

[0040] Repeat Example 1 according to the amount of each component specified in Table 2 below (by weight), and the test results are listed in Table 2.

[0041] Table 2

[0042]

[0043]

[0044] figure 1 It is a comparison chart of the CTI value of the copper clad laminate of the embodiment and the conventional FR-4. It can be seen from the figure that the CTI of the conventional FR-4 is about 225V, while the CTI value of the present embodiment can withstand 600V.

[0045] Table 3 is a comparison of the performance of the copper clad laminates prepared in the examples and conventional FR-4.

[0046] Table 3 shows the performance comparison between the copper clad laminate of the example and the conventional FR-4.

[0047] project

Conventional FR-4

The copper clad laminate of this embodiment

T260

30min

>60min

T288

3min

>10min

CTI

＜225V

≥600V

Td

305℃

≥340℃

[0048] The above ...

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Abstract

The invention discloses a halogen-free resin composition. The composition is prepared by fully mixing hydrogenated bisphenol A type epoxy resin, alicyclic epoxy resin, novolac epoxy resin curing agent, aluminum hydroxide serving as an inorganic filler and organic solvent uniformly. The invention also discloses a copper clad plate prepared from the halogen-free resin composition. The copper clad plate has good thermal stability and creepage tracing property. The halogen-free resin with high comparative tracking index (CTI) resin is adopted, and the consumption of the aluminum hydroxide servingas the inorganic filler is reduced, so that the composition has high CTI value, avoids series problems caused by using excessive aluminum hydroxide and simultaneously realizes halogen-free and environment-friendly properties.

Description

technical field [0001] The invention relates to the technical field of circuit board materials, in particular to a halogen-free resin composition and a copper-clad laminate made of the composition. Background technique [0002] European WEEE (Waste Electrical and Electronic Equipment) Act, ROHS (Restricted Use of Hazardous Substances in Electrical and Electronic Equipment) Act, such as polybrominated biphenyls PBB, polybrominated diphenyl ethers PBDE, etc., especially halogen-containing polybrominated diphenyl ethers headed Flame retardants are restricted. In February 2003, it was stipulated that from January 1, 2006, when exporting products to the European market, halogen-containing compound flame retardants would be restricted; "The symposium promised to realize Intel's products without halogenation within a few years, and this once again set off an upsurge in the non-halogenated CCL market. [0003] Affected by laws and regulations, printed circuit board (PCB) manufactu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08G59/24C08G59/62C08K13/06C08K9/10C08K3/22B32B15/092H05K1/03
Inventor 郭江程沈宗华周长松张磊
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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