9 results about "Comparative Tracking Index" patented technology

The invention discloses a high-CTI (comparative tracking index) halogen-free flame-retardant PA66 (polyamide 66) composite material and a preparation method thereof, and belongs to the technical field of high polymer materials. The composite material comprises the following components in parts by weight: 52-64 parts of PA66 resin, 20-30 parts of glass fibers, 12-15 parts of a phosphorus-based flame retardant, 0.5-1.5 parts of a flame-retardant synergist, 0.3-0.7 part of a lubricant and 0.1-0.5 part of an antioxidant, and the flame-retardant synergist is aliphatic dicarboxylic acid with the carbon atom number greater than or equal to 8. The material surface energy is reduced and electrolyte is repelled through long-carbon-chain hydrophobic groups, and meanwhile, the CTI value is increased to 600 V or above while it is guaranteed that the material reaches the UL94 V0 flame retardant grade (1.6 mm) by utilizing interaction of carboxyl and a PA66 matrix and cooperating with a phosphorus flame retardant. The invention also provides a preparation method of the material, the process is simple, the material is suitable for industrial production, and the product can be widely applied to electronic and electrical components with high safety requirements.

The invention discloses a high-CTI (comparative tracking index) flame-retardant PBT (polybutylene terephthalate) material and a preparation method thereof, and relates to the technical field of engineering plastics. The high-CTI flame-retardant PBT material disclosed by the invention is prepared from the following raw material components in parts by weight: 100 parts by mass of PBT, 16 to 24 parts by mass of compound flame retardant, 1 to 2 parts by mass of laser carving color master batch, 0.9 to 1.1 parts by mass of compatilizer, 9 to 11 parts by mass of glass fiber, 9 to 11 parts by mass of reinforcing filling aid and 0.2 to 0.3 part by mass of antioxidant, the compound flame retardant comprises the following raw material components in parts by weight: 16 parts by mass of modified brominated epoxy resin, 7-9 parts by mass of an MCA flame retardant and 6-8 parts by mass of antimony trioxide; the reinforcing filling auxiliary agent is pentaerythritol modified mica or pentaerythritol modified talcum powder; the modified brominated epoxy resin is obtained by modifying epoxy resin with phosphorus oxychloride.

The invention discloses a high-CTI (comparative tracking index) thin-wall flame-retardant PC (polycarbonate) compound which comprises the following components in percentage by weight: 70-95% of polycarbonate; 1-5% of a toughening agent; 1-10% of an inorganic filler; 1-5% of a compound flame retardant; 0.5 to 2 wt% of polytetrafluoroethylene; and 0.5-5 wt% of other additives. The invention further discloses a preparation method of the high-CTI thin-wall flame-retardant PC compound. The polycarbonate composite material obtained by the invention can achieve the balance of high CTI (Comparative Tracking Index) and thin-wall halogen-free flame retardance, and has good mechanical properties.

A connector (1) includes a plurality of terminals (10), a first member (20) made of a first resin to cover a part of a surface of each of the plurality of terminals (10), and a second member (30) made of a second resin to cover a part of a surface of each of the plurality of terminals (10) and a surface of the first member (20) on a side opposite to each of the terminals (10). The plurality of terminals (10) protrude to be exposed from a surface of the second member (30). A breaking energy in a transverse direction of the first resin is 2 J or more. A comparative tracking index of the second resin is 400 V or more.

The invention provides a low-friction and high-CTI (comparative tracking index) polyphenylene sulfide composite material and a preparation method thereof. The low-friction and high-CTI polyphenylene sulfide composite material comprises the following components in parts by weight: 30-60 parts of polyphenylene sulfide; 20 to 40 parts of glass fiber; 10 to 20 parts of a carbonization inhibitor; 5 to 20 parts of fluororesin; 0.1 to 5 parts of other auxiliary agents; wherein the carbonization inhibitor is one or a mixture of more than one of magnesium hydroxide, aluminum hydroxide and calcium carbonate, and the carbonization inhibitor is powder with the mesh number ranging from 1250 meshes to 3000 meshes; the fluororesin is one or a mixture of more than one of PTFE (polytetrafluoroethylene), PFA (perfluoroalkoxy) and FEP (fluorinated ethylene propylene), and the fluororesin is powder with the mesh number of 3000-6000; the weight ratio of the carbonization inhibitor to the fluororesin is (1-2): 1. According to the invention, the preparation of the polyphenylene sulfide composite material which has low friction and high CTI (Comparative Tracking Index) performance and also keeps the mechanical properties such as tensile strength of the material is realized.

The invention relates to the technical field of polymer compositions, and discloses a high-CTI-value arc-resistant modified polyphenyl ether composition for a new energy battery, which comprises polyphenyl ether resin, high-impact polystyrene resin, hexaphenoxy cyclotriphosphazene, active modified nano hexagonal boron nitride and a maleic anhydride grafted elastomer, wherein hexaphenoxy cyclotriphosphazene wets and coats the surface of active modified nano hexagonal boron nitride to form a core-shell structure intermediate, the core-shell structure intermediate is directionally distributed and anchored at a continuous phase interface of polyphenyl ether under the action of polar traction, and a continuous non-conductive isolation strip is constructed on the periphery of a matrix. Decoupling of insulation performance and mechanical toughness is achieved through an interface targeted protection mode, component migration and precipitation are inhibited while qualitative change of tracking resistance is improved, and electrical safety and structural reliability of the new energy battery module in the whole life cycle are guaranteed.

Polycarbonate compositions include: (a) from about 45 wt% to about 90 wt% of a polycarbonate homopolymer; (b) from about 1 wt% to about 25 wt% of a polycarbonate copolymer; (c) from about 0.1 wt% to about 20 wt% of a first flame retardant component including a brominated flame retardant; (d) from about 0.01 wt% to about 1 wt% of a second flame retardant component including an alkyl sulfonate salt, an aromatic sulfone sulfonate, an aromatic sulfonate salt, or a combination thereof; and (e) from about 0.1 wt% to about 20 wt% of a siloxane-free acrylic core-shell impact modifier. The combined weight percent value of all components does not exceed 100 wt%, and all weight percent values are based on the total weight of the composition.

The invention relates to the technical field of semiconductor packaging materials, and discloses an epoxy resin composition and a preparation method and application thereof. The epoxy resin composition contains epoxy resin, a curing agent, an accelerant, an inorganic filler, a flame retardant, a release agent, a coupling agent, a modifier and a coloring agent, wherein the epoxy resin is a combination of naphthalene type structure epoxy resin and biphenyl type structure epoxy resin or bisphenol F type structure epoxy resin; the curing agent is a combination of XY-lock type phenolic resin and polyfunctional group type phenolic resin. The epoxy resin composition can pass a test that the comparative tracking index CTI is greater than or equal to 600 while ensuring high reliability and excellent operability, has excellent surface anti-creepage tracking endurance capability under wet and dirty working conditions, and has a wide application prospect in the field of semiconductor packaging.

To provide a resin molding material with excellent tracking resistance, heat resistance, and moldability. [Solution] The resin molding material of the present invention contains a diallyl phthalate resin, and is characterized in that the comparative tracking index according to (Method 1) below is 800V or higher, and the glass transition temperature is 200°C or higher and 300°C or lower. (Method 1) A resin molding material is transfer molded under the conditions of a mold temperature of 165°C, an injection pressure of 5MPa, and a curing time of 240 seconds to obtain a circular molded body with a diameter of 50mm and a thickness of 3mm. The comparative tracking index of the obtained molded body is then measured. At voltages of 600V or less, the measurement is performed in accordance with the test method specified in the international standard IEC60112. At voltages exceeding 600V, the electrode is fixed in accordance with the test method specified in the international standard IEC60112 by rotating it 180° with the longitudinal direction of the electrode as the axis of rotation, so that the angle between the molded body and the electrode is 30°.