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Epoxy resin composition and application thereof

A technology of epoxy resin and composition, which is applied in the field of laminates, can solve the problems of heat resistance, moisture resistance and alkali resistance of the board, unsatisfactory product adhesion, and decreased flame retardancy of the board, etc., to achieve good resistance. Burning effect, improve designability, improve the effect of poor heat resistance

Active Publication Date: 2016-01-27
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

In the resin formulation of halogen-free copper clad laminates, phosphorus-containing epoxy resin is often used as the main resin, and then dicyandiamide, phenolic resin or benzoxazine is used as the curing agent. However, the use of phosphorus-based flame retardants has the following problems : 1) If the phosphorus content in the formula is too low, the flame retardancy of the board will decrease and cannot reach the V-0 level, so the phosphorus content in the formula must reach more than 2.5%; however, when the phosphorus content is too high, the heat resistance of the board, Moisture resistance and alkali resistance will decrease; 2) The adhesion of the product is not ideal, the brittleness is large, and the processability is poor; 3) Compared with brominated flame-retardant resins, the cost of phosphorus-containing epoxy resins is higher

Method used

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  • Epoxy resin composition and application thereof
  • Epoxy resin composition and application thereof
  • Epoxy resin composition and application thereof

Examples

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preparation example 1

[0056] Preparation Example 1 Synthesis of Bisphenol A Type Phosphorus and Bromine-Containing Epoxy Resins (1)

[0057] By weight, 100 parts of EPIKOTE828EL and 10.8 parts of DOPO-HQ were mixed together and heated, and when heated to 130°C, 0.05-0.15 part of ethyl triphenylphosphine bromide was added, and the heating was continued at 135-150° C. React for 1 to 3 hours, cool down to below 135°C, add 50 parts of TBBPA and mix evenly, add 0.05 to 0.15 parts of ethyltriphenylphosphine bromide when heated to 130°C, and react at 135-150°C for 2 to 4 hours, Then, the temperature is lowered to below 130° C., and methyl ethyl ketone (MEK) is added to dissolve it into a MEK solution with a solid content of 80% to obtain a bisphenol A type epoxy resin containing phosphorus and bromine. The bromine content of the resin is 18.0% and the phosphorus content is 0.63%.

[0058] Preparation example 2 Synthesis of bisphenol A type phosphorus and bromine-containing epoxy resin (two)

[0059] ...

preparation example 3

[0060] Synthesis of preparation example 3 phenol formaldehyde type phosphorus and bromine-containing epoxy resin (1)

[0061] By weight, 100 parts of PNE177 and 33.5 parts of DOPO were mixed together and heated, and when heated to 130 °C, 0.05-0.15 parts of ethyl triphenylphosphine bromide was added, and the heating was continued, and the reaction was carried out at 145-160 ° C for 2 ~4 hours, cool down to below 135°C, add 28 parts of TBBPA and mix evenly, add 0.05-0.15 parts of ethyltriphenylphosphine bromide when heated to 130°C, react at 135-150°C for 2-4 hours, then cool down When the temperature is below 130° C., butanone (MEK) is added to dissolve it into a MEK solution with a solid content of 70% to obtain a phenol formaldehyde type epoxy resin containing phosphorus and bromine. The bromine content in the resin is 10% and the phosphorus content is 3.0%.

preparation example 4

[0062] Synthesis of preparation example 4 phenol formaldehyde type epoxy resin containing phosphorus and bromine (two)

[0063] By weight, 100 parts of PNE177 and 30 parts of DOPO were mixed together and heated, and when heated to 130 °C, 0.05-0.15 parts of ethyltriphenylphosphine bromide was added, and the heating was continued, and the reaction was carried out at 145-160 °C for 2 ~4 hours, cool down to below 135°C, add 15 parts of TBBPA and mix well, add 0.05-0.15 parts of ethyl triphenylphosphine bromide when heated to 130°C, react at 135-150°C for 2-4 hours, then cool down When the temperature is below 130° C., butanone (MEK) is added to dissolve it into a MEK solution with a solid content of 70% to obtain a phenol formaldehyde type epoxy resin containing phosphorus and bromine. The bromine content in the resin is 6.0% and the phosphorus content is 3.0%.

[0064] Preparation method of copper-clad laminate of embodiment and comparative example

[0065] (1) Preparation...

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Abstract

The invention relates to an epoxy resin composition and application thereof. The epoxy resin composition is prepared from epoxy resin containing phosphorus and bromine, and can be used for preparing preimpregnation materials and copper-foil-covered laminated plates. The epoxy resin containing phosphorus and bromine is adopted, phosphorus and bromine in the epoxy resin are set at the specific content and proportions to obtain the epoxy resin composition, and thus the fire resistance of the epoxy resin composition can reach UL94 V-0 grades; the preimpregnation materials and the laminated plates prepared through the epoxy resin composition have low moisture absorption, good heat resistance, cohesiveness, reactivity and processability, and compared with traditional high CTI plates filled with a large amount of aluminum hydroxide, it can be achieved that the comparative tracking index (CTI) is larger than or equal to 600 V with a small amount of aluminum hydroxide or without aluminum hydroxide.

Description

technical field [0001] The present invention relates to the technical field of laminates, in particular to an epoxy resin composition, in particular to an epoxy resin composition for printed circuit boards and a prepreg made of the same, a laminate and a printed circuit board. Background technique [0002] With the formal implementation of EU directives WEEE (Waste Electric and Electronic Equipment) and RoHS (Restriction of Hazardous Substances), the global electronics industry has entered the era of lead-free soldering. Due to the increase in lead-free soldering temperature, higher requirements are placed on the heat resistance and thermal stability of printed circuit boards. The original component soldering process is replaced by lead-free soldering process, and the soldering temperature is more than 20 ℃ higher than before, which puts forward higher requirements on the heat resistance and reliability of printed circuit boards and substrates. [0003] At present, the main...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/20B32B15/092B32B27/04H05K1/03
CPCB32B15/092B32B27/04C08G59/20C08L63/00H05K1/03
Inventor 林伟范华勇徐莹
Owner GUANGDONG SHENGYI SCI TECH
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