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Halogen-free resin composition and resin-coated copper foil and copper-clad plate prepared from same

A resin composition and resin coating technology, applied in the directions of layered products, metal layered products, chemical instruments and methods, etc., can solve the problems of low thermal decomposition temperature, poor alkali resistance, poor heat resistance of resin-coated copper foil, etc. Achieve the effect of excellent alkali resistance, good heat resistance, and excellent tracking resistance

Active Publication Date: 2011-05-11
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Currently known resin-coated copper foils with high tracking index mostly adopt the method of adding aluminum hydroxide filler. Although the resin-coated copper foil with high tracking index prepared by this method can meet the requirements of high However, due to the low thermal decomposition temperature of the aluminum hydroxide filler, the resin-coated copper foil prepared in this way has poor heat resistance and poor alkali resistance.

Method used

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  • Halogen-free resin composition and resin-coated copper foil and copper-clad plate prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The total weight part is based on 100 parts, and the halogen-free resin composition includes: 30 parts of phosphorus-containing epoxy resin, 15 parts of bisphenol A epoxy resin, 8.5 parts of novolac epoxy resin, 10 parts of phenoxy resin, 35 parts of barium sulfate filler part, 1.5 parts of dicyandiamide. Add appropriate amount of accelerator and solvent to the composition to form glue, stir the above glue for 1 hour, and after 20 minutes of high-speed shearing by filler dispersing equipment, apply the dispersed glue on the coating machine On the electrolytic copper foil, bake it in an oven at 155 degrees for 6 minutes to obtain a resin-coated copper foil. Take 8 sheets of FR-4 adhesive sheets (model: S1155) and stack them up, and cover the top and bottom with a resin-coated copper foil prepared above, and laminate them in a laminator at 190 degrees for 90 minutes to obtain a copper-clad laminate. The detection performance is shown in Table 1.

Embodiment 2

[0023] The total weight part is based on 100 parts, and the halogen-free resin composition includes: 20 parts of phosphorus-containing epoxy resin, 5 parts of bisphenol A epoxy resin, 5 parts of novolac epoxy resin, 19.5 parts of phenoxy resin, 50 parts of barium sulfate filler part, 0.5 part of dicyandiamide. Add appropriate amount of accelerator and solvent to the composition to form glue, stir the above glue for 1 hour, and after 20 minutes of high-speed shearing by filler dispersing equipment, apply the dispersed glue on the coating machine On the electrolytic copper foil, bake it in an oven at 155 degrees for 6 minutes to obtain a resin-coated copper foil. Take 8 sheets of FR-4 adhesive sheets (model: S1155) and stack them up, and cover the top and bottom with a resin-coated copper foil prepared above, and laminate them in a laminator at 190 degrees for 90 minutes to obtain a copper-clad laminate. The detection performance is shown in Table 1.

Embodiment 3

[0025] The total weight part is based on 100 parts, and the halogen-free resin composition includes: 25 parts of phosphorus-containing epoxy resin, 9 parts of bisphenol A epoxy resin, 10 parts of novolac epoxy resin, 15 parts of phenoxy resin, 40 parts of barium sulfate filler part, 1 part of dicyandiamide. Add appropriate amount of accelerator and solvent to the composition to form glue, stir the above glue for 1 hour, and after 20 minutes of high-speed shearing by filler dispersing equipment, apply the dispersed glue on the coating machine On the electrolytic copper foil, bake it in an oven at 155 degrees for 6 minutes to obtain a resin-coated copper foil. Take 8 sheets of FR-4 adhesive sheets (model: S1155) and stack them up, and cover the top and bottom with a resin-coated copper foil prepared above, and laminate them in a laminator at 190 degrees for 90 minutes to obtain a copper-clad laminate. The detection performance is shown in Table 1.

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Abstract

The invention relates to a halogen-free resin composition and a resin-coated copper foil and copper-clad plate prepared from the same. The halogen-free resin composition comprises the following components in parts by weight: 20-30 parts of phosphorous epoxy resin, 5-15 parts of bisphenol A epoxy resin, 10-20 parts of novolac epoxy resin, 10-20 parts of phenoxy resin, 35-50 parts of barium sulphate filler and 0.5-1.5 parts of dicyandiamide; the resin-coated copper foil prepared from the resin composition comprises a copper foil and the halogen-free resin composition coated on the copper foil; and the copper-clad plate prepared from the halogen-free resin composition comprises a plurality of superimposed bonding sheets and the resin-coated copper foil compounded at one side or the two sides of the bonding sheets. The halogen-free resin composition provided by the invention has excellent tracking resistance, heat resistance and alkali resistance; the resin-coated copper foil and copper-clad plate prepared from the halogen-free resin composition have high comparative tracking index, thus meeting the requirement of high comparative tracking index; and meanwhile, the heat resistance and alkali resistance are excellent, thus meeting the halogen-free flame retarding requirement.

Description

technical field [0001] The invention relates to a resin composition, in particular to a halogen-free resin composition and a resin-coated copper foil and a copper-clad board made by using the resin composition. Background technique [0002] Resin-coated copper foil (RCC) is the most important insulating dielectric material for laminated multilayer boards. With the rapid development of laminated multilayer board technology, it has become an important high-grade electronic substrate. It is to coat one or two layers of resin glue on the roughened surface of thin electrolytic copper foil (generally ≤18um in thickness), usually epoxy resin (and a small amount of other high-performance special resin), and remove the solvent by heating in an oven , The resin is semi-cured to reach the B stage. The thickness of the resin layer is generally 40-100 μm. In the production process of laminated multilayer boards, it replaces the role of the traditional bonding sheet and copper foil. As ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08K13/02C08K3/30C08K5/315B32B15/08
Inventor 汪青刘东亮
Owner GUANGDONG SHENGYI SCI TECH
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