Resin composition, prepreg using resin composition and laminate

A resin composition and resin technology, applied in the fields of resin composition, prepreg, laminate and printed circuit board, can solve the problems of low water absorption, high high temperature retention rate of elastic modulus, large expansion coefficient, etc. Good heat and humidity resistance, improved humidity and heat resistance, and high temperature retention

Active Publication Date: 2015-06-24
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, one of the purposes of the present invention is to provide a resin composition, which uses BOZ and amine-modified BMI to further react, and well exerts the performance advantages of the two high-performance resins of BMI/BOZ, overcoming the existing A series of problems in the application of BMI in the field of copper clad laminates, such as the high cost of the BT system, high technical difficulty or harsh curing conditions for the allyl-modified BMI sys

Method used

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  • Resin composition, prepreg using resin composition and laminate
  • Resin composition, prepreg using resin composition and laminate
  • Resin composition, prepreg using resin composition and laminate

Examples

Experimental program
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Example Embodiment

[0059] (2) Preparation of resin composition

[0060] Add the benzoxazine resin, optionally epoxy resin, optionally toughening agent, optionally curing agent, optionally curing accelerator and solvent to a beaker of suitable capacity, and stir to dissolve at high speed for 30-60 Minutes, after dissolving, add amine-modified BMI, optional flame retardant and optional filler, stir for 2h to mature, the solid content and solution viscosity of the resin composition are adjusted by the amount of solvent.

[0061] (3) Production of prepreg

[0062] The prepreg is made by heating and drying the above-mentioned resin composition, and it uses non-woven fabric or other fabrics as the base material, such as natural fibers, organic synthetic fibers and inorganic fibers. Use the above resin composition, prepreg glass cloth and other fabrics or organic fabrics, and then pass the glass cloth through a roller clamp to remove part of the liquid resin, control the weight of the resin glued on the glas...

Example Embodiment

[0065] Example 1:

[0066] (1) Preparation of amine modified BMI

[0067] Diaminodiphenylmethane (DDM) and 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide (BMI) B239 by weight ratio 1:10 feeding (molar ratio is about 1:4.5), put it into a three-necked flask, and then add an appropriate amount of dimethylacetamide (DMAc) solvent to stir and disperse, blow nitrogen, and gradually heat up while stirring to further dissolve, and The temperature is maintained at 100-115 degrees, and the reaction is refluxed for 2-4 hours, and then cooled to obtain DDM modified BMI. The solid content of the DDM modified BMI solution is controlled to 60% by the amount of solvent.

[0068] (2) Preparation of resin composition

[0069] According to the material dosage ratio (solid weight) in Table 1 (except for solvent, all refers to solid dosage, including DDM modified B239), the specific preparation method is: add 23928 parts of DDM modified B, D12515 parts to a 1000ml beaker, PS -63135 parts,...

Example

[0074] Example 2, Example 3 and Example 4:

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Abstract

The invention belongs to the technical field of copper clad laminates and particularly relates to a resin composition, prepreg using the resin composition and a laminate. The resin composition contains the ingredients in percentage by weight: 15-55% of amine modified bismaleimide (BMI), 10-45% of benzoxazine resin and 0-75% of epoxy resin. According to the resin composition, through further reaction of benzoxazine (BOZ) and amine modified bismaleimide (BMI), performance advantages of two kinds of high-performance resin, namely BMI and BOZ, are excellently exerted, so that the prepreg and the copper clad laminates, manufactured from the resin composition, have the properties of high Tg, relatively high peeling strength, relatively low CTE, relatively low water absorbing capacity, relatively low dielectric loss, relatively high elastic modulus high-temperature retention rate, relatively good resistance to hot and damp and the like, and reach a flame-retardant level UL94-V0.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a resin composition and a prepreg, a laminate and a printed circuit board using the resin composition. Background technique [0002] BMI is currently widely used in BT copper clad laminates for high-end packaging, but BMI in BT resins generally cannot directly react with cyanate (CE) resins, requiring special manufacturing processes, which is very difficult. At present, the manufacturing and market supply of BT copper clad laminates in the world are mainly monopolized by a few Japanese companies. In addition, the cost of CE is high, and the supply of CE market with special structure is limited, which greatly limits the application and technology development of BMI, and also limits the packaging. Further development of technology and industry. [0003] BMI system copper clad laminates modified by allyl compounds such as allyl bisphenol A, due to the intr...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L79/04C08L79/08B32B27/04B32B27/38B32B15/092B32B15/20H05K1/03
Inventor 陈振文
Owner GUANGDONG SHENGYI SCI TECH
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