Black resin composition, prepreg and laminated plate

Abstract

The invention belongs to the field of resin materials for printed circuit boards, in particular to a black resin composition, a prepreg and a laminated plate, wherein the black resin composition comprises the following components in parts by weight: 100 parts of epoxy resin; 0.001-60 parts of curing agents; 0.001-5 parts of curing accelerators; 10-100 parts of fillers; 0.001-50 parts of modified black additives; and 0.001-50 parts of additives. The resin composition improves the defects of difficult dispersion of the resin system, weak light shielding strength of the prepreg and the laminatedplate and large dust adsorption by modifying the black additive, and has good processability.

Description

technical field [0001] The invention belongs to the field of resin materials for printed circuit boards, and in particular relates to a black resin composition, a prepreg and a laminated board. Background technique [0002] In recent years, with the rapid development of the PCB industry, the market demand for high-performance copper-clad laminates is increasing day by day. In the pursuit of heat resistance and high Tg of materials, it can meet the needs of various high-end products such as multi-layer boards, HDI, and LED light sources. At the same time, there are also requirements for the shading and color of the substrate material, and the shading performance and application fields of black boards are generally greater than those of other colors. Therefore, black copper clad laminates have become a major research direction in the PCB industry. [0003] Conventional black boards basically use carbon black and black fillers (for example, the patent document whose publicatio...

AI Technical Summary

Problems solved by technology

As we all know, the basic components of general carbon black and black fillers are graphite, which has high conductivity and large particle size, and is easy to absorb powder, which makes it difficult to disperse or even agglomerate during the mixing process of the glue, which increases the production process of the product. The length and difficulty of the process, and the insulation performance of the laminated board after lamination is poor, it is easy to produce micro-short, and even direct conduction phenomenon, which seriously limits its application in high-end products

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