High-reliability fast-curing filling glue

Abstract

The invention relates to filling glue and a preparation method thereof, in particular to high-reliability fast-curing filling glue. The high-reliability fast-curing filling glue is prepared from the following raw materials in percentage by weight: 10-50% of epoxy resin, 5-20% of an epoxy diluent, 5-15% of epoxy resin with capability of free radical reaction, 0-10% of an olefin monomer with capability of free radical reaction, 5-20% of a toughener, 0.5-3% of a coupling agent, 0.1-5% of a cationic initiator, 0.1-5% of a radical initiator, 0-5% of filler and 0-5% of pigment. The bottom filling glue provided by the invention can fast cure, has a high glass-transition temperature (Tg), a low expansion coefficient and good repair property, and can be mainly used for flip chip bottom filling to improve the connection reliability.

Description

technical field [0001] The invention relates to a filling glue and a preparation method thereof, in particular to a fast-curing high-reliability filling glue. Background technique [0002] In the current world, due to the demand for wireless communications, portable computers, broadband Internet products and car navigation electronic products, the integration of electronic components is getting higher and higher, the chip area is expanding, and the number of integrated circuit pins is increasing. The package size is further miniaturized and miniaturized, and integrated circuits are developing in a lighter, thinner, and smaller direction, so many new packaging technologies and packaging forms have emerged. Flip chip (flip chip) interconnection technology is one of the most important packaging technologies. Flip chip technology connects IC chips and printed wiring substrates through small and thin solder bumps. However, since the thermal expansion coefficients of chips, print...

AI Technical Summary

Problems solved by technology

However, the Diels-Alder reaction rate between bismaleimide modified toughening resin and furanyl glycidyl ether is not high, so relatively high curing temperature and long curing time are required

With the development of semiconductor integrated circuit technology, the transistor density per unit area of ​​the chip is getting larger and larger, the width of the transistor gate is getting smaller and smaller, and it is more and more sensitive to temperature. Long-term high-temperature baking will greatly increase the risk of failure. Reduce the yield of finished products

In addition, today's electronic packaging industry is pursuing faster assembly efficiency, lower energy consumption costs, too high curing temperature and too long curing time can not fully meet the needs of the industry

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