57results about How to "Meeting Reliability Needs" patented technology

The invention discloses a method for monitoring a ring network on the basis of a link layer discovery protocol. The method comprises the following steps of: receiving a link layer discovery protocol LLDP message, and judging an action to be executed to the LLDP message according to the message characteristic of the LLDP message; when judging the forward action is to be executed to the LLDP message, judging whether the LLDP causes ring network storm, if so, discarding the LLDP message, and if not, forwarding the LLDP message; and when judging the report action is executed to the LLDP message, sending the LLDP message to a processor, and processing a neighbor item of link neighbor equipment of the ring network corresponding to the LLDP in a neighbor list. The invention also discloses a corresponding device. By the scheme disclosed by the invention, the monitoring and management of the ring network are more convenient, and the ring network storm can not be caused, so that the requirement for reliability of the ring network can be met.

The invention discloses a minitype intelligent bidirectional self-adaptation grid-connected photovoltaic power generation system, which comprises a photovoltaic battery board matrix and a confluence box, wherein the output end of the output end of the confluence box is connected with a storage battery controller, an inversion/rectification integrated converter and a direct-current load control switch; the storage battery controller and the direct-current load control switch are connected with a storage battery set and a local direct-current load; the output end of a converter is connected with an alternating-current load control switch and an grid-connected controller; the output end of the alternating-current load control switch is connected with a local alternating-current load; each output end is connected with a conversion module; a voltage and current sampling conversion module is connected with a signal modulation circuit; the output end of a signal modulation circuit is connected with a DSP (digital signal processor); and each control end is connected with a PWM (pulse width modulation) interface. A control method of the minitype intelligent bidirectional self-adaptation grid-connected photovoltaic power generation system comprises parameter preparation control, power generation and power supply control. The system and the method have the advantages of good reliability, convenience in installation, operation and maintenance, high stability, strong adaptivity and high solar energy utilization ratio.

The invention discloses a virtual network function reliability deployment method based on backup revenue and remapping. The method comprises the following steps: firstly, introducing a dual-sharing backup mechanism, wherein the reliability of the service function chain is effectively improved, meanwhile, resource occupation of backup is reduced as much as possible, the resource utilization rate ofthe system is improved; and then providing a reasonable and efficient virtual network function remapping method for the virtual network function which is not subjected to reliability backup in the service function chain. The method provided by the invention is used for solving the problem that the reliability of the service function chain is reduced due to the fact that the virtual network function in the service function chain is subjected to backup recovery after a fault occurs and the reliability of the virtual network function is changed after remapping for the first time.

The invention relates to filling glue and a preparation method thereof, in particular to high-reliability fast-curing filling glue. The high-reliability fast-curing filling glue is prepared from the following raw materials in percentage by weight: 10-50% of epoxy resin, 5-20% of an epoxy diluent, 5-15% of epoxy resin with capability of free radical reaction, 0-10% of an olefin monomer with capability of free radical reaction, 5-20% of a toughener, 0.5-3% of a coupling agent, 0.1-5% of a cationic initiator, 0.1-5% of a radical initiator, 0-5% of filler and 0-5% of pigment. The bottom filling glue provided by the invention can fast cure, has a high glass-transition temperature (Tg), a low expansion coefficient and good repair property, and can be mainly used for flip chip bottom filling to improve the connection reliability.

The invention discloses a data-center-oriented generalized network coding fault-tolerant storage platform and an implementation method for the same. A system mainly comprises a name node, a plurality of data nodes and a coding agent node which form the data-center-oriented distributed storage platform, and the data nodes are used for storage. The implementation method mainly includes designing a uniform processing frame on the basis of network coding; performing data coding and distributed storage processes; integrating different coding schemes; performing recovering processing. The data-center-oriented generalized network coding fault-tolerant storage platform and the implementation method have the advantages that the storage platform is data-center-oriented, the uniform processing frame on the basis of network coding is provided, and stored files are coded, so that the purpose of reducing storage redundancy of the system and a transmission bandwidth can be achieved under the condition of identical reliability of the system; the system provides integration of the different coding schemes and accordingly is extensible.

The embodiment of the invention discloses a link data processing method and device and a computer storage medium. The method comprises the following steps: obtaining reference signal intensity of a terminal; Selecting at least two links to be connected with the terminal based on the reference signal strength and a historical link selection record; And performing data distribution processing according to the number of the selected links and the link conditions corresponding to the links.

The invention relates to a multi-layer aluminum nitride substrate for highly integrated module level packaging, and a manufacturing method thereof. The structure of the substrate comprises upper and lower surface layers, wherein the upper and lower surface layers are high-precision and high-density metalized welding pads; the side walls of the substrate are fully metalized; and the substrate is internally provided with multi-layer metalized wiring. The upper and lower surface layer metalized welding pads are welded with ball gates of a silicon-based chip; the side walls are fully metalized torealize signal shielding; the multi-layer metalized wiring inside the substrate satisfies complicated circuit signal transmission and interconnection. By utilizing a multi-layer co-firing process, aluminum nitride ceramic is selected as the ceramic base body material, tungsten is used as the metallization material, a green tape binding micro-deformation process adopted, and a tungsten metal circuit layer on the surface layer is plated by adopting chemical nickel-plating and chemical gilding processes. The multi-layer aluminum nitride substrate and the manufacturing method thereof have the advantages that the aluminium nitride substrate and the silicon-based chip are highly matched in coefficients of thermal expansion, and the reliability of ball gate welding packaging of the silicon-basedchip is realized; and the thermal conductivity of the substrate is increased to 170 W/mK, thereby being capable of meeting the high power density packaging and heat dissipation requirements of the highly integrated module.

The invention relates to a high-reliability IGBT module packaging structure and a processing technology. The packaging structure comprises a direct copper-clad substrate, an IGBT chip, a quick recovery diode chip, a bottom plate, a soldering flux layer, a bonded lead, a bus, a plastic shell and two-dimensional layered hexagonal boron nitride filled enhanced encapsulated silica gel, wherein two-dimensional layered hexagonal boron nitride is grown on the upper surface of the direct copper-clad substrate in a graphic manner. A two-dimensional layered hexagonal boron nitride thin film is grown onthe upper surface of the direct copper-clad substrate in a graphic manner through a chemical vapor deposition method. By virtue of excellent in-plane thermal conduction performance, partial hot spot heat of the high-power IGBT module can be quickly and transversely dissipated, heat can be conducted outwardly through the direct copper-clad substrate, and the highest temperature of the module is lowered; and meanwhile, by adopting the two-dimensional layered hexagonal boron nitride filled enhanced encapsulated silica gel for encapsulating, the thermal conduction performance of the conventional silica gel is improved, and module reliability is improved effectively.

The invention discloses a method for bonding metallization modification on a semiconductor unpacked chip. The method comprises the following steps: putting a deoiled semiconductor unpacked chip surface or a wafer into a mixed solution of sulfuric acid and hydrogen peroxide, performing reaction for 60-90 seconds at 30-40 DEG C, dehydrating, performing primary zinc activation, performing acid corrosion, performing secondary zinc activation, performing deposition on the surface of the unpacked chip or the wafer after secondary zinc activation so as to form an Ni layer; depositing a Pd layer on the Ni layer; depositing an Au layer on the Pd layer. By using a chemical nickel and palladium plating gold leaching process, three layers of metallization layers of nickel, palladium and gold compatible with gold thread bonding are prepared on the surface of the deoiled semiconductor unpacked chip, the adhesion strength and the stability of a membrane layer meet application requirements of packaging processes, various electric parameters of the modified chip are not greatly different from those before modification, and gold thread bonding implemented on the surface of the modified nickel, palladium and gold layer can meet high-temperature environment application and reliability requirements of long-service life application of devices.

The invention discloses a component software reliability analysis method capable of considering limitation of debugging resources based on an HFSQM (Hybrid Finite Server Queuing Model), which relates to software reliability analysis methods, and overcomes the defects that infinite debugging resources are impossible in practical application and the newly detected failures have to wait in a queue when all the debugging staffs are busy. The method is realized by the following three steps of: resource allocation, failure detection and failure recovery. The resource allocation step is to allocate appropriate resources for the failures waiting for the debugging resources in the HFSQM; the failure detection process is used for executing an integration test on the entire application based on an operating profile of the component software application; and the failure recovery process is used for recovering the failures occupying the debugging resources in the HFSQM. Thus, a basis for software release and rational configuration of test resources is provided, the software can be punctually released on schedule, user demands on the reliability can be satisfied, and the total cost of the software is lowered. So, an HFSQM-based simulation method has important directive significance for component software tests and further for software marketing decisions.

The embodiment of the invention provides a base station configuration method and a base station. The base station suitable for the method comprises a main control board and a plurality of baseband boards, and the plurality of baseband boards comprise a plurality of main baseband boards and a common baseband board. The method comprises the following steps: the main control board controls each mainbaseband board in the plurality of main baseband boards to establish connection with an RRU of one communication system in a plurality of communication systems, and controls each main baseband board to load software of the communication system of each main baseband board; and the main control board controls the common baseband board to establish connection with the RRU of each communication systemin the plurality of communication systems. The present invention can improve the utilization rate of baseband resources.

The invention relates to an exhaust valve seat for an automobile engine, which is made of a material containing chemical compositions. The material comprises the following chemical compositions in percentage by weight: 0.7 to 1.4 percent of C, 3.0 to 6.6 percent of Mo, 3.0 to 6.6 percent of Cr, 5.0 to 8.5 percent of Co, 1.2 to 3.0 percent of Ni, 0.2 to 1.0 percent of V, less than or equal to 1.0 percent of Cu, and the balance of Fe. The exhaust valve seat made of the material has high crushing strength and fatigue strength and reliable quality, has lower cost than a copper-infiltrated valve seat, and meets the requirements of high-performance engines.

The invention provides a memory error correction method, a memory controller and electronic equipment, and the method comprises the steps: carrying out the unified reading and writing of a plurality of channels of a memory in a precise synchronization mode, wherein the memory is a memory with a redundancy ratio greater than or equal to 1: 4; and reading data of each memory particle in each channel, when wrong memory particles are found through an ECC error correction algorithm according to the read data, replacing the wrong memory particles with redundant memory particles, and performing useless processing on the wrong memory particles. In this way, redundant memory particles are adopted to replace wrong memory particles to work, and therefore normal operation of the channel can be guaranteed. Each channel is replaced by redundant memory particles, so that error correction of a plurality of wrong memory particles can be realized in the implementation process.

Provided in embodiments of the present invention are a method for sending a sidelink HARQACK, and a method and device for determining a PSFCH resource. The method comprises steps of determining a first PUCCH resource according to PUCCH configuration information and/or DCI sent by a network side; determining an HARQ codebook according to a first identifier or according to an indication of a networkside, the first identifier being used for indicating priority information or QoS of a sidelink data packet; and sending the HARQ codebook on the first PUCCH resource. The method is advantaged in thatthe time delay of the Sidelink HARQACK of different services can be ensured, and reliability can be satisfied.

An embedded multimedia device and communication equipment for vehicle-mounted remote communication processor are provided. The embedded multimedia device is applied to the communication equipment of a vehicle-mounted remote communication processor T-BOX and comprises a startup disk partition, a high-reliability disk partition and a user data disk partition, and the startup disk partition stores boot program of the vehicle-mounted T-BOX in a manner of storing one bit data in each unit storage space. The high-reliability disk partition adopts mode of storing one bit of data in each unit storage space to store initialization information of hardware equipment included in the vehicle-mounted T-BOX and configuration file of the vehicle-mounted T-BOX. The user data disk partitions are used for storing data of application programs installed in the vehicle-mounted T-BOX to reduce cost of the storage module of the vehicle-mounted T-BOX on the premise of meeting high storage capacity and data reliability of the vehicle-mounted T-BOX.

Provided are a method and a device for selecting a transmission mode. The method comprises: determining first indication information, the first indication information being used to indicate a changedtransmission mode, and/or being used to indicate a change of the transmission mode; and sending the first indication information to terminal device. When the data packet copied on the PDCP layer is transmitted, a plurality of transmission modes can be provided. That is to say, the repetition of the PDCP can have a plurality of modes. The transmission mode selection can be realized through the first indication information, for example, under the condition that the reliability of one repeated mode of the PDCP is not high, the other transmission mode can be selected through the first indication information, so that the reliability requirement of the service is met as much as possible, and the transmission quality of the service is improved.

The invention discloses a pressure sensor system for compressor outlet dynamic pressure measurement. Compressor outlet pressure is collected and output as a voltage signal by a pressure sensitive device through a short measuring tube, and the voltage signal is processed by a signal processing module into a temperature compensated voltage signal to be output. A compressor outlet dynamic pressure sensor system is jointly formed based on the short measuring tube, the pressure sensitive device, the signal processing module, a pressure shell, a fixed seat and an output signal line connector. The system can reliably and accurately obtain the dynamic total pressure at high temperature, and has important significance for engine fault diagnosis.

The invention relates to a wake flow bubble unit detection device. The invention belongs to the technical field of ship wake flow bubble detection. The device comprises a receiving window, a receivinglens, a receiving detector, a box body cover plate, a box body, a laser, a transmitting lens, a transmitting window, a sealing system, a power supply system, an inclination angle mechanism, a delayer, a data acquisition system and an industrial personal computer. A laser emits pulsed light which is collimated by an emission optical system and then irradiates bubbles in wake flow, and then back scattered light is focused on a unit linear APD focal plane through a receiving optical system; the laser power supply outputs a Q-switched trigger pulse, and after a certain time delay, the trigger unit APD works, so that the laser echo and the detector work synchronously. Even if the light spot shape is expanded and distorted at the edge, the received light is basically not distorted, and the uniformity of the image surface of the detector is very high. In addition, the purpose of detecting different distances can be achieved by adjusting the position of the detector.

The invention discloses a wireless transmitting power prediction control method for reliability demand constraint of an intelligent substation, and the method comprises the steps: constructing a wireless signal propagation state space equation with state observation through the analysis of the relation among reliability, a signal-to-noise ratio and transmitting power and the utilization of a lossmodel and a Kalman filter of wireless signal propagation; performing expected signal-to-noise ratio compensation by estimating a confidence interval of signal-to-noise ratio fluctuation in real time;finally, defining a quadratic cost function taking the difference between the transmitting power and the actual signal-to-noise ratio and the expected signal-to-noise ratio as a target, and realizingoptimal control of the transmitting power through a dynamic programming algorithm. According to the invention, the problem of coordination between the transmitting power of the wireless sensor networkand the wireless communication reliability in the transformer substation environment can be solved, so that the transmitting power of the node is reduced as much as possible while the wireless communication reliability is ensured.

The invention discloses an optimization method and system for distributed prediction power grid. The method comprises the following steps: S1, monitoring a power supply parameter provided for a power distribution network load by each distributed power supply in a power distribution network in real time, and calculating the contribution degree of the distributed power supply based on the power supply parameter; and S2, predicting the contribution degree of the distributed power supply at the future moment, and constructing a distribution model for the contribution degree of the distributed power supply in the power distribution network, wherein the distribution model is used for carrying out coordinated distribution on the contribution degree of the distributed power supply in the power distribution network, so that the distributed power supply meets the load power demand of the power distribution network, and meanwhile, the power consumption cost is reduced and the cleaning benefit is improved. The distributed power supplies are dynamically adjusted until the predicted value of the contribution degree obtained by the neural network at the future moment is consistent with the adjustment reference, so that optimal scheduling of all the distributed power supplies in the power distribution network is realized, and the power distribution network meets the low-carbon requirement while meeting the reliability requirement.

The invention discloses a protective layer of a semiconductor photoelectric chip and a production process of a semiconductor. The protective layer of the photoelectric chip comprises a first silicon nitride layer, an Al2O3/SiO2 layer and a second silicon nitride layer from bottom to top in sequence, and a sandwich structure is presented. The process for producing the semiconductor device with the protective layer comprises the following steps of processing a chip; cleaning the wafer; depositing a first silicon nitride layer on the surface of the wafer; depositing an Al2O3/SiO2 layer on the first silicon nitride layer; depositing a second silicon nitride layer on the Al2O3/SiO2 layer; and producing the required semiconductor through a photoetching process, a dry etching process and photoresist removal. The protective layer with a sandwich structure fully utilizes the characteristics of different thin film layers to realize long-acting blocking of water vapor, improves the durability of the device, does not affect the electrical performance of the semiconductor device, can adjust the reflection property to light by adjusting the structure and film thickness of the protective layer, and is simple in production process, low in cost, and good in efficiency. Good application prospects are realized.