Epoxy adhesive for electron component integrated molding technology and preparation method of epoxy adhesive

A technology of epoxy adhesives and electronic components, applied in the direction of online phenolic epoxy resin adhesives, epoxy resin adhesives, adhesives, etc., can solve problems such as the inability to meet the production process requirements of integrated inductors, reliability issues, etc. , to achieve high reliability, high bonding strength, high Tg effect

Inactive Publication Date: 2014-02-05
TONSAN ADHESIVES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with traditional inductors, integrated inductors have the advantages of smaller size, low noise, low interference, and stable quality. It can be seen that integrated inductors will become the general trend, and its technology is completely different from that of traditional inductors. Traditional inductors are used for The assembled adhesive cannot meet the production process requirements of integrated inductors
[0007] 2. Reliability issues

Method used

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  • Epoxy adhesive for electron component integrated molding technology and preparation method of epoxy adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Bisphenol A epoxy resin 30 parts

[0047] Biphenyl type epoxy resin 20 parts

[0048] Dicyandiamide 5 parts

[0049] imidazole 2 parts

[0050] 40 parts of N,N-dimethylformamide

[0051] Stabilizer 0.5 parts

[0052] Release agent 2.5 parts

[0053] Preparation:

[0054] Accurately weigh various raw materials according to the proportion of the formula, first add bisphenol A epoxy resin, biphenyl type epoxy resin, N,N-dimethylformamide, stabilizer, and mold release agent into the reaction kettle in turn and stir, wait until After stirring evenly, add dicyandiamide and imidazole, disperse evenly and discharge.

Embodiment 2

[0056] Bisphenol F epoxy resin 35 parts

[0057] Dicyclopentadiene type epoxy resin 15 parts

[0058] DDS 10 copies

[0059] imidazole 2 parts

[0060] 35 parts of N,N-dimethylformamide

[0061] Stabilizer 0.5 parts

[0062] Release agent 2.5 parts

[0063] Preparation:

[0064] Accurately weigh various raw materials according to the proportion of the formula, first add bisphenol F epoxy resin, dicyclopentadiene epoxy resin, N,N-dimethylformamide, stabilizer, and mold release agent into the reaction kettle and stir , after stirring evenly, add DDS and imidazole, disperse evenly and discharge.

[0065] Examples listed in Table 1 and performance test results after curing thereof. The test results show that the epoxy adhesive of the present invention has high body strength, high modulus, high Tg, and high bonding strength, fully meets the requirements of the integral molding process, and has high reliability.

[0066] Table 1

[0067]

[0068]The present invention dev...

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PUM

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Abstract

The invention discloses an epoxy adhesive for an electron component integrated molding technology and a preparation method of the epoxy adhesive. The epoxy adhesive comprises the following components in parts by weight: 30-70 parts of epoxy resin, 1-10 parts of curing agent, 1-10 parts of accelerator, 20-40 parts of solvent, and 0.1-5.0 parts of additive. Compared with the prior art, the epoxy adhesive is capable of satisfying the demand of an integrated molding process, and well adapting to different requirements of a new process in comparison with the traditional adhesive; the adhesive has high body strength, high modulus, high Tg, and high bonding strength, and is high in reliability. The epoxy adhesive is capable of satisfying the production process demand of the integrated molding process of the electron element and has higher reliability.

Description

technical field [0001] The invention relates to an epoxy adhesive and a preparation method thereof. The epoxy adhesive is mainly used in an integral molding process of components represented by integrally formed inductors to improve the production efficiency and stability of the components. Background technique [0002] The emergence of integrally formed electronic components represented by integrally formed inductors is attributed to the development of computer motherboard technology and the development of power supply technology. The main frequency of the CPU is getting higher and higher, so there are high requirements for stable power supply and filtering. The integrated inductor can work for a long time under the condition of high current, and can provide stable power supply for the CPU. As electronic products become smaller and more powerful, electronic components are also developing towards smaller size and higher power. Good material properties and special design mak...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/04C09J163/00C09J11/06
Inventor 王晓颖史伟同李守平
Owner TONSAN ADHESIVES INC
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