Thermosetting resin composition as well as prepreg, laminated board and circuit carrier containing same

A technology of resin composition and circuit carrier, which is applied in the fields of laminates and circuit carriers, thermosetting resin composition, and prepreg, can solve the problems of affecting the quality of signal transmission, difficulty in roughening the surface of the substrate, and the influence of circuit conduction, etc. Achieve the effect of improving activation rate, specific surface area, and enhancing adhesion

Active Publication Date: 2016-04-20
江苏生益特种材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermoplastic resins are easy to melt and coarsen after being heated, while thermosetting resins are difficult to melt after being heated due to their own characteristics. After laser irradiation, the surface of the substrate is difficult to roughen, which affects the adhesion of copper and reduces the density. This not only affects the quality of signal transmission , and it also has a certain influence on the conduction of the circuit

Method used

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  • Thermosetting resin composition as well as prepreg, laminated board and circuit carrier containing same
  • Thermosetting resin composition as well as prepreg, laminated board and circuit carrier containing same
  • Thermosetting resin composition as well as prepreg, laminated board and circuit carrier containing same

Examples

Experimental program
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Effect test

Embodiment 1

[0073] The composition of 100 parts of epoxy resin DER530, 3 parts of dicyandiamide, 0.05 part of 2-methylimidazole, silicon dioxide and zinc molybdate (accounting for 30% of the resin composition mass fraction, wherein silicon dioxide:molybdic acid Zinc=90:10 (mass ratio)), basic copper phosphate (accounting for 2% of resin composition mass fraction) and accounting for 1% of resin composition content hexaalkoxysilane coupling agent (SIB1817) are dissolved in organic solvent 65wt% glue is prepared by mechanical stirring, then impregnated with glass fiber cloth, heated and dried to form a prepreg (prepreg), pressurized and heated to form a laminated board.

Embodiment 2

[0075] The implementation mode of the present embodiment is the same as that of Example 1, and the difference is that in Example 2, the inorganic filler is a composition of silicon dioxide and zinc molybdate, wherein, silicon dioxide: zinc molybdate=99:1 (mass ratio) .

Embodiment 3

[0077] The implementation mode of the present embodiment is the same as that of Example 1, and the difference is that in Example 3, the inorganic filler is a composition of silicon dioxide and zinc molybdate, wherein, silicon dioxide: zinc molybdate=80:20 (mass ratio) .

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Abstract

The invention provides a thermosetting resin composition as well as a prepreg, a laminated board and a circuit carrier containing the same. The thermosetting resin composition comprises thermosetting resin, a laser direct forming additive, an inorganic filler, and a silane coupling agent with 2-3 groups capable of being hydrolyzed at each of two ends of a molecular chain. The laser direct forming additive is added in the thermosetting resin composition provided by the present invention to ensure that a circuit can be formed on thermosetting resin after laser irradiation and metallization, the CTE of the composition can be reduced and the absorption of laser energy by a matrix can be enhanced by adding the inorganic filler and the silane coupling agent with 2-3 groups capable of being hydrolyzed at each of the two ends of the molecular chain, the activation rate of an LDS auxiliary agent is effectively improved, the attachment and the sedimentary thickness of the matrix to copper are obviously enhanced at the same time, and three types of components mutually cooperate with the thermosetting resin to ensure that the thermosetting resin composition has a low coefficient of thermal expansion, thereby making the prepared circuit carrier have relatively good quality of signal transmission.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to a thermosetting resin composition and a prepreg containing it, a laminated board and a circuit carrier. Background technique [0002] The printed circuit board (PCB) is the carrier board for the secondary packaging of electronic components and is one of the most important components in the electronics industry. Conventional PCB conductive circuit manufacturing adopts the photolithography etching method (subtractive method), which has many disadvantages such as high material consumption, many production processes, large waste liquid discharge, and heavy environmental protection pressure. As the world's largest producer of PCB industry, my country's waste and pollution caused by its production process are astonishing. During the 12th Five-Year Plan period and even in the future, energy conservation and emission reduction, efficiency enhancement and consumption reduction are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/04C08L61/06C08L71/12C08L47/00C08K13/02C08K5/315C08K5/3445C08K3/36C08K3/24C08K5/5415B32B17/04B32B27/04
CPCB32B5/26B32B2250/20B32B2260/021B32B2260/046B32B2262/101C08K3/24C08K3/36C08K5/315C08K5/3445C08K13/02C08L71/12C08L79/04C08L2203/20C08L2205/03C08L63/00C08L61/06C08L47/00C08K5/5415
Inventor 杜翠鸣邢燕侠柴颂刚
Owner 江苏生益特种材料有限公司
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